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Extract from the Register of European Patents

EP About this file: EP0505193

EP0505193 - Cover for electrical components package [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  31.05.1996
Database last updated on 20.05.2024
Most recent event   Tooltip31.05.1996No opposition filed within time limitpublished on 17.07.1996 [1996/29]
Applicant(s)For all designated states
HARRIS CORPORATION
1025 West NASA Blvd MS 53
Melbourne, FL 32919 / US
[1992/39]
Inventor(s)01 / Satriano, Robert Joseph
11 House Wren
Hackettstown, New Jersey 07840 / US
[1992/39]
Representative(s)Meddle, Alan L., et al
FORRESTER & BOEHMERT, Pettenkoferstrasse 20-22
80336 München / DE
[N/P]
Former [1995/30]Meddle, Alan Leonard, et al
FORRESTER & BOEHMERT Franz-Joseph-Strasse 38
D-80801 München / DE
Former [1992/39]Pratt, Richard Wilson
London Patent Operation G.E. Technical Services Co. Inc. Essex House 12/13 Essex Street
London WC2R 3AA / GB
Application number, filing date92302394.919.03.1992
[1992/39]
Priority number, dateUS1991067299721.03.1991         Original published format: US 672997
[1992/39]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP0505193
Date:23.09.1992
Language:EN
[1992/39]
Type: B1 Patent specification 
No.:EP0505193
Date:26.07.1995
Language:EN
[1995/30]
Search report(s)(Supplementary) European search report - dispatched on:EP19.06.1992
ClassificationIPC:H01L23/04, H01L23/10
[1992/39]
CPC:
H01L23/49517 (EP,US); H01L23/04 (EP,US); H01L23/10 (EP,US);
H01L2224/48091 (EP,US); H01L24/48 (EP,US); H01L2924/00014 (EP,US);
H01L2924/12042 (EP,US) (-)
C-Set:
H01L2224/48091, H01L2924/00014 (EP,US);
H01L2924/00014, H01L2224/45099 (US,EP);
H01L2924/12042, H01L2924/00 (US,EP)
Designated contracting statesDE,   FR,   GB [1992/39]
TitleGerman:Deckel für elektrische Bauelementenpackung[1995/30]
English:Cover for electrical components package[1992/39]
French:Couvercle pour empaquetage de composants électriques[1992/39]
Former [1992/39]Decke für elektrische Bauelementenpackung
Examination procedure18.03.1993Examination requested  [1993/20]
27.10.1994Despatch of communication of intention to grant (Approval: Yes)
31.01.1995Communication of intention to grant the patent
06.03.1995Fee for grant paid
06.03.1995Fee for publishing/printing paid
Opposition(s)27.04.1996No opposition filed within time limit [1996/29]
Fees paidRenewal fee
24.02.1994Renewal fee patent year 03
20.02.1995Renewal fee patent year 04
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[A]FR2442508  (GEN ELECTRIC [US]);
 [A]FR2528627  (SILICIUM SEMICONDUCTEUR SSC [FR]);
 [A]EP0243637  (BBC BROWN BOVERI & CIE [DE])
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.