EP0505193 - Cover for electrical components package [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 31.05.1996 Database last updated on 20.05.2024 | Most recent event Tooltip | 31.05.1996 | No opposition filed within time limit | published on 17.07.1996 [1996/29] | Applicant(s) | For all designated states HARRIS CORPORATION 1025 West NASA Blvd MS 53 Melbourne, FL 32919 / US | [1992/39] | Inventor(s) | 01 /
Satriano, Robert Joseph 11 House Wren Hackettstown, New Jersey 07840 / US | [1992/39] | Representative(s) | Meddle, Alan L., et al FORRESTER & BOEHMERT, Pettenkoferstrasse 20-22 80336 München / DE | [N/P] |
Former [1995/30] | Meddle, Alan Leonard, et al FORRESTER & BOEHMERT Franz-Joseph-Strasse 38 D-80801 München / DE | ||
Former [1992/39] | Pratt, Richard Wilson London Patent Operation G.E. Technical Services Co. Inc. Essex House 12/13 Essex Street London WC2R 3AA / GB | Application number, filing date | 92302394.9 | 19.03.1992 | [1992/39] | Priority number, date | US19910672997 | 21.03.1991 Original published format: US 672997 | [1992/39] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP0505193 | Date: | 23.09.1992 | Language: | EN | [1992/39] | Type: | B1 Patent specification | No.: | EP0505193 | Date: | 26.07.1995 | Language: | EN | [1995/30] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 19.06.1992 | Classification | IPC: | H01L23/04, H01L23/10 | [1992/39] | CPC: |
H01L23/49517 (EP,US);
H01L23/04 (EP,US);
H01L23/10 (EP,US);
H01L2224/48091 (EP,US);
H01L24/48 (EP,US);
H01L2924/00014 (EP,US);
H01L2924/12042 (EP,US)
(-)
| C-Set: |
H01L2224/48091, H01L2924/00014 (EP,US);
H01L2924/00014, H01L2224/45099 (US,EP);
H01L2924/12042, H01L2924/00 (US,EP)
| Designated contracting states | DE, FR, GB [1992/39] | Title | German: | Deckel für elektrische Bauelementenpackung | [1995/30] | English: | Cover for electrical components package | [1992/39] | French: | Couvercle pour empaquetage de composants électriques | [1992/39] |
Former [1992/39] | Decke für elektrische Bauelementenpackung | Examination procedure | 18.03.1993 | Examination requested [1993/20] | 27.10.1994 | Despatch of communication of intention to grant (Approval: Yes) | 31.01.1995 | Communication of intention to grant the patent | 06.03.1995 | Fee for grant paid | 06.03.1995 | Fee for publishing/printing paid | Opposition(s) | 27.04.1996 | No opposition filed within time limit [1996/29] | Fees paid | Renewal fee | 24.02.1994 | Renewal fee patent year 03 | 20.02.1995 | Renewal fee patent year 04 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]FR2442508 (GEN ELECTRIC [US]); | [A]FR2528627 (SILICIUM SEMICONDUCTEUR SSC [FR]); | [A]EP0243637 (BBC BROWN BOVERI & CIE [DE]) |