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EP0520679
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EP About this file: EP0520679
| EP0520679 - Method of forming a premolded package assembly [Right-click to bookmark this link] | Status | The application has been refused Status updated on 27.06.1997 Database last updated on 19.10.2024 | Most recent event Tooltip | 27.06.1997 | Refusal of application | published on 13.08.1997 [1997/33] | Applicant(s) | For all designated states AT&T Corp. 32 Avenue of the Americas New York, NY 10013-2412 / US | [1993/01] | Inventor(s) | 01 /
Biswas, Ranjit 5 Meadow Lane Westford, Massachusetts 01886 / US | 02 /
Zimmerman, Michael A. 75 Johnson Circle North Andover, Massachusetts 01845 / US | [1993/01] | Representative(s) | Johnston, Kenneth Graham, et al Lucent Technologies EUR-IP UK Ltd Unit 18, Core 3 Workzone Innova Business Park Electric Avenue Enfield, EN3 7XB / GB | [N/P] |
| Former [1993/01] | Johnston, Kenneth Graham, et al AT&T (UK) Ltd. 5 Mornington Road Woodford Green Essex, IG8 OTU / GB | Application number, filing date | 92305577.6 | 18.06.1992 | [1993/01] | Priority number, date | US19910722069 | 27.06.1991 Original published format: US 722069 | [1993/01] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0520679 | Date: | 30.12.1992 | Language: | EN | [1992/53] | Type: | A3 Search report | No.: | EP0520679 | Date: | 16.06.1993 | Language: | EN | [1993/24] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 26.04.1993 | Classification | IPC: | H01L21/56, H01L23/498, H01L23/057, H01L21/48, H01L23/495 | [1993/23] | CPC: |
H01L23/49531 (EP,US);
H01L21/56 (EP,US);
H01L23/057 (EP,US);
H01L2224/45124 (EP,US);
H01L2224/45144 (EP,US);
H01L2224/48091 (EP,US);
H01L24/45 (EP,US);
H01L24/48 (EP,US);
H01L2924/01079 (EP,US);
H01L2924/10253 (EP,US);
H01L2924/1532 (EP,US);
H01L2924/15747 (EP,US);
H01L2924/181 (EP,US)
(-)
| C-Set: |
H01L2224/45124, H01L2924/00015 (US,EP);
H01L2224/45144, H01L2924/00014 (US,EP);
H01L2224/45144, H01L2924/00015 (US,EP);
H01L2224/48091, H01L2924/00014 (EP,US); |
| Former IPC [1993/01] | H01L21/56, H01L23/498, H01L23/057 | Designated contracting states | DE, FR, GB, NL [1993/01] | Title | German: | Verfahren zur Herstellung eines vorgeformten Verpackungssystems | [1993/01] | English: | Method of forming a premolded package assembly | [1993/01] | French: | Procédé pour fabriquer un ensemble d'empaquetage prémoulé | [1993/01] | Examination procedure | 02.12.1993 | Examination requested [1994/05] | 06.09.1995 | Despatch of a communication from the examining division (Time limit: M06) | 14.03.1996 | Reply to a communication from the examining division | 24.03.1997 | Despatch of communication that the application is refused, reason: substantive examination [1997/33] | 03.04.1997 | Application refused, date of legal effect [1997/33] | Fees paid | Renewal fee | 16.06.1994 | Renewal fee patent year 03 | 16.06.1995 | Renewal fee patent year 04 | 14.06.1996 | Renewal fee patent year 05 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]JP01226170 ; | [X]JP02194641 ; | [A]JP01175250 ; | [A]JP61144852 ; | [A]JP02133932 ; | [A]WO8602200 (MOTOROLA INC [US]); | [A]US4195193 (GRABBE DIMITRY [US], et al) | [X] - PATENT ABSTRACTS OF JAPAN vol. 13, no. 548 (E-856)7 December 1989 & JP-A-01 226 170 ( FUJI ELECTRIC CO LTD ), & JP01226170 A 19891207 | [X] - PATENT ABSTRACTS OF JAPAN vol. 14, no. 476 (E-991)17 October 1990 & JP-A-02 194 641 ( IBIDEN CO LTD ), & JP02194641 A 19901017 | [A] - PATENT ABSTRACTS OF JAPAN vol. 13, no. 453 (E-831)11 October 1989 & JP-A-01 175 250 ( SONY CORP ), & JP01175250 A 19891011 | [A] - PATENT ABSTRACTS OF JAPAN vol. 10, no. 340 (E-455)(2396) 18 November 1986 & JP-A-61 144 852 ( HITACHI LTD ), & JP61144852 A 19861118 | [A] - CHEMICAL PATENTS INDEX, DOCUMENTATION ABSTRACTS JOURNAL Week 9027, Derwent Publications Ltd., London, GB; AN 90-204 220 & JP-A-02 133 932 (POLYPLASTICS KK), & JP02133932 A 00000000 |