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EP0528608
European procedure
Extract from the Register of European Patents
EP About this file: EP0528608
| EP0528608 - Connector assembly for testing integrated circuit packages [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 26.11.1999 Database last updated on 28.05.2024 | Most recent event Tooltip | 04.02.2000 | Lapse of the patent in a contracting state | published on 22.03.2000 [2000/12] | Applicant(s) | For all designated states Hewlett-Packard Company 3000 Hanover Street Palo Alto, CA 94304-1112 / US | [N/P] |
| Former [1993/08] | For all designated states Hewlett-Packard Company 3000 Hanover Street Palo Alto, California 94304 / US | Inventor(s) | 01 /
Steen, Michael J. 8850 Alpine Valley Dr. Colorado Springs, CO 80920 / US | 02 /
Wardwell, Robert H. 1806 N. Tejon Colorado Springs, CO 80907 / US | 03 /
McKenzie, Joseph A. 1933 Payton Circle Colorado Springs, CO 80915 / US | [1993/08] | Representative(s) | Colgan, Stephen James CARPMAELS & RANSFORD 43 Bloomsbury Square London WC1A 2RA / GB | [N/P] |
| Former [1993/08] | Colgan, Stephen James CARPMAELS & RANSFORD 43 Bloomsbury Square London WC1A 2RA / GB | Application number, filing date | 92307266.4 | 07.08.1992 | [1993/08] | Priority number, date | US19910744763 | 14.08.1991 Original published format: US 744763 | [1993/08] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0528608 | Date: | 24.02.1993 | Language: | EN | [1993/08] | Type: | A3 Search report | No.: | EP0528608 | Date: | 04.05.1994 | Language: | EN | [1994/18] | Type: | B1 Patent specification | No.: | EP0528608 | Date: | 20.01.1999 | Language: | EN | [1999/03] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 17.03.1994 | Classification | IPC: | G01R1/04, H05K7/10, H01R9/07, H01R23/72 | [1993/08] | CPC: |
G01R1/0425 (EP,US);
Y10S439/912 (EP,US)
| Designated contracting states | DE, FR, GB [1993/08] | Title | German: | Verbinderanordnungen zum Testen integrierter Schaltungen im Gehäuse | [1993/08] | English: | Connector assembly for testing integrated circuit packages | [1993/08] | French: | Assemblage de connexion pour tester des circuits intégrés en boîtiers | [1993/08] | Examination procedure | 19.10.1994 | Examination requested [1994/50] | 01.07.1996 | Despatch of a communication from the examining division (Time limit: M06) | 02.01.1997 | Reply to a communication from the examining division | 06.08.1997 | Despatch of communication of intention to grant (Approval: No) | 04.12.1997 | Despatch of communication of intention to grant (Approval: later approval) | 27.07.1998 | Communication of intention to grant the patent | 06.08.1998 | Fee for grant paid | 06.08.1998 | Fee for publishing/printing paid | Opposition(s) | 21.10.1999 | No opposition filed within time limit [2000/02] | Fees paid | Renewal fee | 25.07.1994 | Renewal fee patent year 03 | 25.07.1995 | Renewal fee patent year 04 | 17.07.1996 | Renewal fee patent year 05 | 23.07.1997 | Renewal fee patent year 06 | 27.07.1998 | Renewal fee patent year 07 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | DE | 21.04.1999 | [2000/12] | Documents cited: | Search | [X]EP0195556 (MINNESOTA MINING & MFG [US]) [X] 1 * abstract * * page 18, line 23 - line 26 *; | [X]US4735580 (HANSEN WILLIAM D [US], et al) [X] 1 * column A; figures 1,3-5 *; | [YA]EP0305951 (EVERETT CHARLES CONTACT PROD [US]) [Y] 1-8 * abstract * * column 9, line 58 - column 10, line 6 * [A] 9; | [X]US4919623 (BILLMAN TIMOTHY B [US], et al) [X] 1* column 4, line 62 - line 65; figures 1,4,9 *; | [X]US4996476 (BALYASNY MARIK [US], et al) [X] 1 * column 1, line 14 - line 30; figure 2 * * column 3, line 56 - line 63 *; | [Y]US5015946 (JANKO BOZIDAR [US]) [Y] 1-8 * column A; figures 1,4-7 * * column 1, line 44 - column 2, line 6 * * column 2, line 54 - line 63 *; | [XP]US5057023 (KABADI ASHOK N [US], et al) [XP] 1-8 * column A; figures 1,4A,7 *; | [XPA]EP0458448 (TEKTRONIX INC [US]) [XP] 1-8 * abstract * * column 5, line 27 - line 29 * * column 6, line 18 - line 20 * * column 6, line 48 - column 8, line 14 * [A] 9 |