Extract from the Register of European Patents

EP About this file: EP0500492

EP0500492 - Plasma spray gun for spraying powdered or gaseous materials [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  31.01.1997
Database last updated on 11.04.2026
Most recent event   Tooltip07.12.2007Lapse of the patent in a contracting state
New state(s): NL
published on 09.01.2008  [2008/02]
Applicant(s)For all designated states
Sulzer Metco AG
Rigackerstrasse 21
5610 Wohlen 1 / CH
[N/P]
Former [1995/27]For all designated states
Sulzer Metco AG
Rigackerstrasse 21
CH-5610 Wohlen 1 / CH
Former [1992/35]For all designated states
PLASMA-TECHNIK AG
Rigackerstrasse 21
CH-5610 Wohlen 1 / CH
Inventor(s)01 / Landes, Klaus, Dr.-Ing.
Melchiorstrasse 23
W-8000 München 71 / DE
[1992/35]
Representative(s)Rottmann, Maximilian, et al
Rottmann, Zimmermann + Partner AG
Gartenstrasse 28 A
5400 Baden / CH
[N/P]
Former [1995/27]Rottmann, Maximilian R., et al
c/o Rottmann, Zimmermann + Partner AG Glattalstrasse 37
CH-8052 Zürich / CH
Former [1992/35]Rottmann, Maximilian R.
c/o Rottmann, Zimmermann + Partner AG Glattalstrasse 37
CH-8052 Zürich / CH
Application number, filing date92810095.710.02.1992
[1992/35]
Priority number, dateDE1991410540721.02.1991         Original published format: DE 4105407
[1992/35]
Filing languageDE
Procedural languageDE
PublicationType: A1 Application with search report 
No.:EP0500492
Date:26.08.1992
Language:DE
[1992/35]
Type: B1 Patent specification 
No.:EP0500492
Date:27.03.1996
Language:DE
[1996/13]
Search report(s)(Supplementary) European search report - dispatched on:EP25.05.1992
ClassificationIPC:H05H1/34, H05H1/42, H05H1/44
[1992/35]
CPC:
H05H1/42 (EP,US); H05H1/34 (EP,US); H05H1/3452 (EP,US);
H05H1/3468 (EP,US); H05H1/3484 (EP,US); H05H1/44 (EP,US)
Designated contracting statesAT,   BE,   CH,   DE,   DK,   ES,   FR,   GB,   GR,   IT,   LI,   LU,   MC,   NL,   PT,   SE [1992/35]
TitleGerman:Plasmaspritzgerät zum Versprühen von pulverförmigem oder gasförmigem Material[1992/35]
English:Plasma spray gun for spraying powdered or gaseous materials[1992/35]
French:Appareil de pulvérisation par plasma de matériaux en poudre ou gazeux[1992/35]
Examination procedure15.10.1992Examination requested  [1992/51]
31.08.1994Despatch of a communication from the examining division (Time limit: M04)
01.12.1994Reply to a communication from the examining division
28.03.1995Despatch of communication of intention to grant (Approval: Yes)
06.09.1995Communication of intention to grant the patent
29.11.1995Fee for grant paid
29.11.1995Fee for publishing/printing paid
Opposition(s)28.12.1996No opposition filed within time limit [1997/12]
Fees paidRenewal fee
17.01.1994Renewal fee patent year 03
19.01.1995Renewal fee patent year 04
16.01.1996Renewal fee patent year 05
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Lapses during opposition  TooltipBE27.03.1996
DK27.03.1996
ES27.03.1996
GR27.03.1996
IT27.03.1996
NL27.03.1996
PT27.06.1996
SE27.06.1996
[2003/07]
Former [2002/25]BE27.03.1996
DK27.03.1996
ES27.03.1996
GR27.03.1996
IT27.03.1996
PT27.06.1996
SE27.06.1996
Former [2000/05]BE27.03.1996
DK27.03.1996
GR27.03.1996
IT27.03.1996
PT27.06.1996
SE27.06.1996
Former [1999/42]BE27.03.1996
DK27.03.1996
IT27.03.1996
PT27.06.1996
SE27.06.1996
Former [1998/15]BE27.03.1996
DK27.03.1996
PT27.06.1996
SE27.06.1996
Former [1998/14]BE27.03.1996
PT27.06.1996
SE27.06.1996
Former [1996/52]BE27.03.1996
SE27.06.1996
Former [1996/44]SE27.06.1996
Documents cited:Search[A] FR1207809  (KNAPSACK AG et al.)
 [A] US3360988  (STINE HOWARD A et al.)
 [A] US3239130  (NAUNDORF JR CHARLES H et al.) [A]
 [A] USRE32908   [A]
 [A] WO8704039  (PLASMAINVENT AG et al.) [A]
 [A] US2892067  (DONALD RUSSELL S et al.) [A]
 [A] US3628079  (DOBBS DAVID JOHN MILLER et al.) [A]
 [A] US3562486  (HATCH BRUCE O et al.) [A]
ExaminationWO9015516
   Rutscher/Deutsch: Plasmatechnik. Mnchen, Wien 1984. Seiten 244, 262, 263.
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.