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Extract from the Register of European Patents

EP About this file: EP0565070

EP0565070 - Electroplating process [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  05.06.1998
Database last updated on 25.09.2024
Most recent event   Tooltip05.06.1998No opposition filed within time limitpublished on 22.07.1998 [1998/30]
Applicant(s)For all designated states
Heidelberger Druckmaschinen Aktiengesellschaft
Kurfürsten-Anlage 52-60
69115 Heidelberg / DE
For all designated states
WINTERTHURER METALLVEREDELUNG AG
Hegistrasse 39
CH-8404 Winterthur / CH
[N/P]
Former [1993/41]For all designated states
Heidelberger Druckmaschinen Aktiengesellschaft
Kurfürsten-Anlage 52-60
D-69115 Heidelberg / DE
For all designated states
WINTERTHURER METALLVEREDELUNG AG
Hegistrasse 39
CH-8404 Winterthur / CH
Inventor(s)01 / Müll, Karl
Püntstrasse 33
CH-8604 Volketswil-Kindhausen / CH
[1993/41]
Representative(s)Fey, Hans-Jürgen, et al
Heidelberger Druckmaschinen AG
Patentabteilung
Kurfürsten-Anlage 52-60
69115 Heidelberg / DE
[N/P]
Former [1997/47]Fey, Hans-Jürgen, et al
Heidelberger Druckmaschinen AG Patentabteilung Kurfürsten-Anlage 52-60
69115 Heidelberg / DE
Former [1997/31]Stoltenberg, Heinz-Herbert Baldo, et al
c/o Heidelberger Druckmaschinen AG Kurfürsten-Anlage 52-60
69115 Heidelberg / DE
Former [1993/41]Weiss, Wolfgang, Dr., et al
Kurfürsten-Anlage 52-60
D-69115 Heidelberg / DE
Application number, filing date93105726.907.04.1993
[1993/41]
Priority number, dateDE1992421188109.04.1992         Original published format: DE 4211881
[1993/41]
Filing languageDE
Procedural languageDE
PublicationType: A1 Application with search report 
No.:EP0565070
Date:13.10.1993
Language:DE
[1993/41]
Type: B1 Patent specification 
No.:EP0565070
Date:30.07.1997
Language:DE
[1997/31]
Search report(s)(Supplementary) European search report - dispatched on:EP24.06.1993
ClassificationIPC:C25D5/18
[1993/41]
CPC:
C25D5/18 (EP,US); C25D5/14 (EP,US); C25D5/605 (EP,US);
C25D5/625 (EP,US)
Designated contracting statesAT,   CH,   FR,   GB,   IT,   LI [1993/41]
TitleGerman:Verfahren zum galvanischen Aufbringen einer Oberflächenbeschichtung[1993/41]
English:Electroplating process[1993/41]
French:Procédé d'électrodéposition[1993/41]
Examination procedure07.04.1993Examination requested  [1993/41]
15.05.1995Despatch of a communication from the examining division (Time limit: M04)
09.09.1995Reply to a communication from the examining division
10.07.1996Despatch of communication of intention to grant (Approval: Yes)
31.10.1996Communication of intention to grant the patent
29.01.1997Fee for grant paid
29.01.1997Fee for publishing/printing paid
Opposition(s)05.05.1998No opposition filed within time limit [1998/30]
Fees paidRenewal fee
13.04.1995Renewal fee patent year 03
23.04.1996Renewal fee patent year 04
18.04.1997Renewal fee patent year 05
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Documents cited:Search[A]JP59016993  ;
 [A]US3318786  (FAUST CHARLES L, et al);
 [X]DE1421984  (FORSCH EDELMETALLE UND METALLC);
 [X]US4869971  (NEE CHIN-CHENG [US], et al)
 [A]  - PATENT ABSTRACTS OF JAPAN vol. 8, no. 102 (C-222)(1539) 12. Mai 1984 & JP-A-59 016 993 ( NIHON EREKUTOROPUREITEINGU ENGINEERS K.K ) 28. Januar 1984, & JP59016993 A 00000000
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.