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EP0584669
European procedure
Extract from the Register of European Patents
EP About this file: EP0584669
| EP0584669 - High density electronics package having stacked circuit boards [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 08.08.1997 Database last updated on 30.03.2026 | Most recent event Tooltip | 08.08.1997 | No opposition filed within time limit | published on 24.09.1997 [1997/39] | Applicant(s) | For all designated states Hughes Aircraft Company 7200 Hughes Terrace, P.O. Box 80028 Los Angeles California 90080-0028 / US | [N/P] |
| Former [1994/09] | For all designated states Hughes Aircraft Company 7200 Hughes Terrace, P.O. Box 80028 Los Angeles, California 90080-0028 / US | Inventor(s) | 01 /
Goss, Steven R. 1401 S. Salamander Place Tucson, Arizona 85713 / US | 02 /
Taggart, Owen H. 612 N. Ruston Tucson, Arizona 85711 / US | [1994/09] | Representative(s) | Winter, Brandl - Partnerschaft mbB Alois-Steinecker-Straße 22 85354 Freising / DE | [N/P] |
| Former [1994/09] | KUHNEN, WACKER & PARTNER Alois-Steinecker-Strasse 22 D-85354 Freising / DE | Application number, filing date | 93112972.0 | 12.08.1993 | [1994/09] | Priority number, date | US19920929354 | 14.08.1992 Original published format: US 929354 | [1994/09] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP0584669 | Date: | 02.03.1994 | Language: | EN | [1994/09] | Type: | B1 Patent specification | No.: | EP0584669 | Date: | 02.10.1996 | Language: | EN | [1996/40] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 06.12.1993 | Classification | IPC: | H05K7/14 | [1994/09] | CPC: |
H05K7/023 (EP,US);
H05K7/1434 (EP,US);
H05K7/20445 (EP,US);
H10W90/00 (EP,US);
H10W90/20 (EP,US);
H10W90/288 (EP,US);
H10W90/297 (EP,US)
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| Designated contracting states | CH, DE, ES, FR, GB, IT, LI, SE [1994/09] | Title | German: | Elektronisches Gehäuse zum dichten Packen, bestehend aus gestapelten Leiterplatten | [1994/09] | English: | High density electronics package having stacked circuit boards | [1994/09] | French: | Boîtier électronique à haute densité avec un empilage de circuits | [1994/09] | Examination procedure | 12.08.1993 | Examination requested [1994/09] | 21.03.1995 | Despatch of a communication from the examining division (Time limit: M07) | 06.10.1995 | Reply to a communication from the examining division | 19.12.1995 | Despatch of communication of intention to grant (Approval: No) | 31.01.1996 | Despatch of communication of intention to grant (Approval: later approval) | 06.02.1996 | Communication of intention to grant the patent | 15.05.1996 | Fee for grant paid | 15.05.1996 | Fee for publishing/printing paid | Opposition(s) | 03.07.1997 | No opposition filed within time limit [1997/39] | Fees paid | Renewal fee | 18.07.1995 | Renewal fee patent year 03 | 15.07.1996 | Renewal fee patent year 04 |
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