| EP0590463 - Halogen containing epoxy resin composition and copper-clad laminate [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 16.05.2003 Database last updated on 28.03.2026 | Most recent event Tooltip | 28.12.2007 | Lapse of the patent in a contracting state New state(s): IT | published on 30.01.2008 [2008/05] | Applicant(s) | For all designated states SUMITOMO CHEMICAL COMPANY LIMITED 5-33, Kitahama 4-chome, Chuo-ku Osaka-shi Osaka 541-0041 / JP | [N/P] |
| Former [2002/28] | For all designated states SUMITOMO CHEMICAL COMPANY LIMITED 5-33, Kitahama 4-chome, Chuo-ku Osaka-shi, Osaka 541-0041 / JP | ||
| Former [1996/38] | For all designated states SUMITOMO CHEMICAL COMPANY LIMITED 5-33, Kitahama 4-chome, Chuo-ku Osaka-shi, Osaka 541 / JP | ||
| Former [1994/14] | For all designated states SUMITOMO CHEMICAL COMPANY, LIMITED 5-33, Kitahama 4-chome Chuo-ku Osaka / JP | Inventor(s) | 01 /
Ueda, Yoichi 3-18-5, Matsushiro Tsukuba-shi Ibaraki 305 / JP | 02 /
Endo, Yasuhiro 2-13-3, Ninomiya Tsukuba-shi Ibaraki 305 / JP | 03 /
Shibata, Mitsuhiro 2-13-1, 5-302, Umezono Tsukuba-shi Ibaraki 305 / JP | 04 /
Kamio, Kunimasa 4-9-7, Shintoride Toride-shi Ibaraki 302 / JP | 05 /
Kitayama, Shinichiro 2-13-1, 2-103, Umezono Tsukuba-shi Ibaraki 305 / JP | 06 /
Yamasaki, Kaori 3281-1, 206, Kashiwadacho Ushiku-shi Ibaraki 300-12 / JP | 07 /
Hayashi, Toshiaki 2-40-1, Kasuga Tsukuba-shi Ibaraki 305 / JP | [1994/14] | Representative(s) | Vossius & Partner Patentanwälte Rechtsanwälte mbB Siebertstrasse 3 81675 München / DE | [N/P] |
| Former [1995/52] | VOSSIUS & PARTNER Postfach 86 07 67 D-81634 München / DE | ||
| Former [1994/14] | VOSSIUS & PARTNER P.O. Box 86 07 67 D-81634 München / DE | Application number, filing date | 93115110.4 | 20.09.1993 | [1994/14] | Priority number, date | JP19920252806 | 22.09.1992 Original published format: JP 25280692 | JP19920295858 | 05.11.1992 Original published format: JP 29585892 | JP19920295859 | 05.11.1992 Original published format: JP 29585992 | [1994/14] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0590463 | Date: | 06.04.1994 | Language: | EN | [1994/14] | Type: | A3 Search report | No.: | EP0590463 | Date: | 19.10.1994 | Language: | EN | [1994/42] | Type: | B1 Patent specification | No.: | EP0590463 | Date: | 10.07.2002 | Language: | EN | [2002/28] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 26.08.1994 | Classification | IPC: | C08G59/06, C08L63/00, B32B15/20, B32B27/38, B32B15/08 | [1994/40] | CPC: |
B32B15/08 (EP);
B32B15/092 (KR);
B32B15/14 (US);
B32B15/20 (US);
C08G59/06 (EP,KR);
C08G59/08 (EP,KR);
C08G59/38 (EP,KR);
C08G59/4261 (KR);
C08G59/621 (KR);
C08L63/00 (EP);
C08L63/04 (KR);
H05K1/034 (EP);
H05K1/0366 (KR);
B32B2260/021 (US);
B32B2260/046 (US);
| C-Set: |
C08L63/00, C08L2666/08 (EP);
C08L63/00, C08L2666/22 (EP) |
| Former IPC [1994/14] | C08G59/06, C08L63/00, B32B15/20, B32B27/38 | Designated contracting states | CH, DE, FR, GB, IT, LI [1994/14] | Title | German: | Halogen enthaltende Epoxidharzzusammensetzung und kupferkaschiertes Laminat | [1994/14] | English: | Halogen containing epoxy resin composition and copper-clad laminate | [1994/14] | French: | Composition de résine époxyde contenant des halogènes et un laminé revêtu de cuivre | [1994/14] | Examination procedure | 02.03.1995 | Examination requested [1995/17] | 30.07.1996 | Despatch of a communication from the examining division (Time limit: M06) | 10.02.1997 | Reply to a communication from the examining division | 13.01.1998 | Despatch of a communication from the examining division (Time limit: M06) | 23.07.1998 | Reply to a communication from the examining division | 26.04.1999 | Despatch of a communication from the examining division (Time limit: M04) | 01.09.1999 | Reply to a communication from the examining division | 21.12.2000 | Despatch of communication of intention to grant (Approval: No) | 19.07.2001 | Despatch of communication of intention to grant (Approval: later approval) | 26.07.2001 | Communication of intention to grant the patent | 05.11.2001 | Fee for grant paid | 05.11.2001 | Fee for publishing/printing paid | Opposition(s) | 11.04.2003 | No opposition filed within time limit [2003/27] | Fees paid | Renewal fee | 29.09.1995 | Renewal fee patent year 03 | 27.09.1996 | Renewal fee patent year 04 | 30.09.1997 | Renewal fee patent year 05 | 29.09.1998 | Renewal fee patent year 06 | 29.09.1999 | Renewal fee patent year 07 | 29.09.2000 | Renewal fee patent year 08 | 01.10.2001 | Renewal fee patent year 09 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | CH | 10.07.2002 | FR | 10.07.2002 | IT | 10.07.2002 | LI | 10.07.2002 | GB | 10.10.2002 | [2008/05] |
| Former [2004/35] | CH | 10.07.2002 | |
| FR | 10.07.2002 | ||
| LI | 10.07.2002 | ||
| GB | 10.10.2002 | ||
| Former [2004/22] | CH | 10.07.2002 | |
| LI | 10.07.2002 | ||
| GB | 10.10.2002 | ||
| FR | 14.02.2003 | ||
| Former [2003/47] | CH | 10.07.2002 | |
| LI | 10.07.2002 | ||
| FR | 14.02.2003 | ||
| Former [2003/31] | CH | 10.07.2002 | |
| LI | 10.07.2002 | Documents cited: | Search | [L] JPH05125149 | [L] JPH05148344 | [A] JPH03192112 | [A] JPS62135539 | [L] CHEMICAL ABSTRACTS, vol. 120, no. 2, 10 January 1994, Columbus, Ohio, US; abstract no. 10028 [L] 1,5 * abstract * | [L] PATENT ABSTRACTS OF JAPAN vol. 17, no. 492 (C - 1107) * abstract * | [L] CHEMICAL ABSTRACTS, vol. 119, no. 18, 1 November 1993, Columbus, Ohio, US; abstract no. 182174 [L] 1,2,5 * abstract * | [L] PATENT ABSTRACTS OF JAPAN vol. 17, no. 540 (C - 1115) * abstract * | [A] CHEMICAL ABSTRACTS, vol. 115, no. 26, 30 December 1991, Columbus, Ohio, US; abstract no. 281671 [A] 1,5 * abstract * | [A] PATENT ABSTRACTS OF JAPAN vol. 15, no. 450 (C - 0885) * abstract * | [A] PATENT ABSTRACTS OF JAPAN vol. 11, no. 365 (C - 460) [A] 4,5 * abstract * |