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Extract from the Register of European Patents

EP About this file: EP0601468

EP0601468 - Process and electromagnetically coupled planar plasma apparatus for etching oxides [Right-click to bookmark this link]
StatusPatent revoked
Status updated on  02.04.2004
Database last updated on 29.03.2025
Most recent event   Tooltip05.10.2005Change: Appeal number 
Applicant(s)For all designated states
Applied Materials, Inc.
3050 Bowers Avenue
M/S 2061
Santa Clara, California 95054-3299 / US
[N/P]
Former [1998/12]For all designated states
APPLIED MATERIALS, INC.
3050 Bowers Avenue, M/S 2061
Santa Clara, California 95054-3299 / US
Former [1994/24]For all designated states
APPLIED MATERIALS, INC.
3050 Bowers Avenue
Santa Clara California 95054-3299 / US
Inventor(s)01 / Collins, Kenneth S.
165 Knightshaven Way
San Jose, CA 95111 / US
02 / Marks, Jeffrey
4730 Cielo Vista Way
San Jose, California 94129-1446 / US
[1994/24]
Representative(s)Zimmermann, Gerd Heinrich, et al
Zimmermann & Partner Patentanwälte mbB
Postfach 330 920
80069 München / DE
[N/P]
Former [2000/04]Zimmermann, Gerd Heinrich, et al
Zimmermann & Partner, P.O. Box 33 09 20
80069 München / DE
Former [1994/24]Diehl, Hermann, Dr. Dipl.-Phys., et al
DIEHL, GLÄSER, HILTL & PARTNER Patentanwälte Flüggenstrasse 13
D-80639 München / DE
Application number, filing date93119391.601.12.1993
[1994/24]
Priority number, dateUS1992098404501.12.1992         Original published format: US 984045
[1994/24]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP0601468
Date:15.06.1994
Language:EN
[1994/24]
Type: B1 Patent specification 
No.:EP0601468
Date:18.03.1998
Language:EN
[1998/12]
Search report(s)(Supplementary) European search report - dispatched on:EP23.02.1994
ClassificationIPC:H01J37/32
[1994/24]
CPC:
H01J37/32871 (EP,KR,US); H01J37/321 (EP,KR,US); H01J37/32165 (EP,US);
H01J37/32458 (EP,US); H01J37/32522 (EP,KR,US); H01L21/31116 (EP,KR,US);
H01L21/6831 (EP,US); H01F2029/143 (EP,US); H01J2237/3345 (EP,US);
H01J2237/3346 (EP,US) (-)
Designated contracting statesDE,   ES,   FR,   GB,   IT,   NL [1994/24]
TitleGerman:Verfahren und Gerät zur Erzeugung eines elektromagnetisch gekoppelten flachen Plasmas zum Ätzen von Oxyden[1994/24]
English:Process and electromagnetically coupled planar plasma apparatus for etching oxides[1994/24]
French:Procédé et appareil de production d'un plasma plan par couplage électromagnétique pour graver des oxydes[1994/24]
MiscellaneousEPB 1998/12: (deleted)
EPB 1998/12: (deleted)
EPB 1998/12: (deleted)
EPB 1997/36: Teilanmeldung 97109781.1 eingereicht am 16/06/97
EPB 1997/36: Divisional application 97109781.1 filed on 16/06/97
EPB 1997/36: Demande divisionnaire 97109781.1 déposée le 16/06/97
Examination procedure15.12.1994Examination requested  [1995/07]
10.06.1996Despatch of a communication from the examining division (Time limit: M06)
20.12.1996Reply to a communication from the examining division
06.02.1997Despatch of communication of intention to grant (Approval: Yes)
27.06.1997Communication of intention to grant the patent
02.10.1997Fee for grant paid
02.10.1997Fee for publishing/printing paid
Divisional application(s)EP97109781.1  / EP0802560
Opposition(s)Opponent(s)01  18.12.1998    ADMISSIBLE
Institute of Technological Information, Inc.
2-2, Kitahara 2-chome
Asaka-shi Saitama-ken 351 / JP
Opponent's representative
Marsh, Roy David
Hoffmann Eitle
ATTENTION : ADDRESS INACTIVE - USE ASS-NR - CDR / DE
 [N/P]
Former [1999/07]
Opponent(s)01  18.12.1998    ADMISSIBLE
Institute of Technological Information, Inc.
2-2, Kitahara 2-chome
Asaka-shi Saitama-ken 351 / JP
Opponent's representative
Marsh, Roy David
Hoffmann Eitle, Patent- und Rechtsanwälte, Arabellastrasse 4
81925 München / DE
28.01.1999Invitation to proprietor to file observations on the notice of opposition
06.08.1999Reply of patent proprietor to notice(s) of opposition
13.03.2001Date of oral proceedings
17.07.2001Despatch of interlocutory decision in opposition
17.07.2001Despatch of minutes of oral proceedings
29.01.2004Legal effect of revocation of patent [2004/21]
29.01.2004Despatch of communication that the patent will be revoked
Appeal following opposition17.09.2001Appeal received No.  T1034/01
23.11.2001Statement of grounds filed
26.03.2004Interlocutory revision of appeal
26.03.2004Result of appeal procedure: revocation of the patent
29.01.2004Date of oral proceedings
18.02.2004Minutes of the oral proceedings despatched
Fees paidRenewal fee
15.12.1995Renewal fee patent year 03
23.12.1996Renewal fee patent year 04
23.12.1997Renewal fee patent year 05
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Lapses during opposition  TooltipNL01.07.2001
ES02.12.2002
[2004/28]
Former [2004/15]NL01.07.2001
ES13.01.2003
Former [2002/14]NL01.07.2001
Documents cited:Search[DA]US4948458  (OGLE JOHN S [US]) [DA] 1,3-6,11,12 * column 3, paragraph 1 - paragraph 2 * * column 5, line 33 - column 6, line 16 * * column 6, line 60 - column 7, line 10; figures 1,2,6 *;
 [PA]EP0552491  (APPLIED MATERIALS INC [US]) [PA] 1,7-10,12-18,21 * claim 1 ** page 9, line 46 - page 10, line 23; figure 1 *
 [OA]  - J. MARKS ET AL., "Introduction of a new high density plasma reactor concept for high aspect ratio oxide etching", CONFERENCE, ADVANCED TECHNIQUES FOR INTEGRATED CIRCUIT PROCESSING II, SAN JOSE, CALIFORNIA (USA), (19920921) [OA] 1,12
    [ ] - PROCEEDINGS OF THE SPIE - THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING, USA, (1992), vol. 1803, pages 235 - 247 [ ] * whole document *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.