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Extract from the Register of European Patents

EP About this file: EP0580826

EP0580826 - SEALED ELECTRONIC PACKAGE PROVIDING IN-SITU METALLIZATION [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  10.05.1996
Database last updated on 03.10.2024
Most recent event   Tooltip10.05.1996Application deemed to be withdrawnpublished on 26.06.1996 [1996/26]
Applicant(s)For all designated states
MOTOROLA, INC.
1303 East Algonquin Road
Schaumburg, IL 60196 / US
[1994/05]
Inventor(s)01 / KNECHT, Thomas, A.
6410 Coachlight
Crystal Lake, IL 60012 / US
02 / MANCINI, Brian, M.
855 Seneca
Carol Stream, IL 60188 / US
03 / KRAUSE, Joseph, P.
1495 Castlewood Drive
Wheaton, IL 60187 / US
[1994/05]
Representative(s)Hudson, Peter David, et al
Motorola
European Intellectual Property
Midpoint
Alencon Link, Basingstoke
Hampshire RG21 7PL / GB
[N/P]
Former [1995/32]Hudson, Peter David, et al
Motorola European Intellectual Property Midpoint Alencon Link
Basingstoke, Hampshire RG21 7PL / GB
Former [1994/05]Hudson, Peter David
Motorola European Intellectual Property Midpoint Alencon Link
Basingstoke Hampshire RG21 1PL / GB
Application number, filing date93900797.727.11.1992
[1994/05]
WO1992US10366
Priority number, dateUS1992083664314.02.1992         Original published format: US 836643
[1994/05]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO9316577
Date:19.08.1993
Language:EN
[1993/20]
Type: A1 Application with search report 
No.:EP0580826
Date:02.02.1994
Language:EN
The application published by WIPO in one of the EPO official languages on 19.08.1993 takes the place of the publication of the European patent application.
[1994/05]
Search report(s)International search report - published on:US19.08.1993
(Supplementary) European search report - dispatched on:EP03.06.1994
ClassificationIPC:H05K5/06, H01L41/04
[1994/05]
CPC:
H03H9/0504 (EP,US); H03H3/02 (EP,US); H03H9/1014 (EP,US);
H01L2224/16225 (EP,US); H01L2224/50 (EP,US)
Designated contracting statesDE,   FR,   GB [1994/05]
TitleGerman:ABGEDICHTETE ELEKTRONIK-PACKUNG ZUR IN-SITU METALLISIERUNG[1994/05]
English:SEALED ELECTRONIC PACKAGE PROVIDING IN-SITU METALLIZATION[1994/05]
French:EMBALLAGE HERMETIQUEMENT FERME DE COMPOSANT ELECTRONIQUE PERMETTANT LA METALLISATION IN SITU.[1994/05]
File destroyed:20.04.2002
Entry into regional phase01.10.1993National basic fee paid 
01.10.1993Search fee paid 
01.10.1993Designation fee(s) paid 
01.10.1993Examination fee paid 
Examination procedure01.10.1993Examination requested  [1994/05]
23.08.1995Despatch of a communication from the examining division (Time limit: M04)
03.01.1996Application deemed to be withdrawn, date of legal effect  [1996/26]
01.02.1996Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [1996/26]
Fees paidRenewal fee
27.10.1994Renewal fee patent year 03
Penalty fee
Additional fee for renewal fee
30.11.199504   M06   Not yet paid
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[XY]JPS58170210  ;
 [XAY]US2816239  (BERGE ROBERT E);
 [Y]US4454639  (DWORSKY LAWRENCE N [US], et al)
International search[X]US3006711  (SILVER JOHN F);
 [Y]US4391034  (STUBY KENNETH P);
 [Y]US4410407  (MACAULAY ALEXANDER [US]);
 [A]US4849079  (CUOMO JEROME J [US], et al)
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.