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EP0617464
European procedure
Extract from the Register of European Patents
EP About this file: EP0617464
| EP0617464 - Semiconductor device having X-shaped die support member and method for making the same [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 28.03.2003 Database last updated on 11.05.2024 | Most recent event Tooltip | 28.03.2003 | No opposition filed within time limit | published on 14.05.2003 [2003/20] | Applicant(s) | For all designated states MOTOROLA, INC. 1303 East Algonquin Road Schaumburg, IL 60196 / US | [1994/39] | Inventor(s) | 01 /
Djennas, Frank 7702 Penelope Circle Austin, Texas 78759 / US | 02 /
Poku, Isaac T. 12604 Oro Valley Trail Austin, Texas 78729 / US | 03 /
Yarosh, Robert 3214 Evanston Lane Austin, Texas 78745 / US | [1994/39] | Representative(s) | Hudson, Peter David, et al Motorola European Intellectual Property Midpoint Alencon Link, Basingstoke Hampshire RG21 7PL / GB | [N/P] |
| Former [1994/39] | Hudson, Peter David, et al Motorola European Intellectual Property Midpoint Alencon Link Basingstoke, Hampshire RG21 7PL / GB | Application number, filing date | 94103166.8 | 03.03.1994 | [1994/39] | Priority number, date | US19930035422 | 22.03.1993 Original published format: US 35422 | US19930133947 | 12.10.1993 Original published format: US 133947 | [1994/39] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0617464 | Date: | 28.09.1994 | Language: | EN | [1994/39] | Type: | A3 Search report | No.: | EP0617464 | Date: | 31.05.1995 | Language: | EN | [1995/22] | Type: | B1 Patent specification | No.: | EP0617464 | Date: | 22.05.2002 | Language: | EN | [2002/21] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 19.04.1995 | Classification | IPC: | H01L23/495 | [1994/39] | CPC: |
H01L23/49503 (EP);
H01L2224/05553 (EP);
H01L2224/32014 (EP);
H01L2224/48091 (EP);
H01L2224/48247 (EP);
H01L2224/48465 (EP);
H01L2224/73265 (EP);
H01L24/48 (EP);
H01L2924/00014 (EP);
| C-Set: |
H01L2224/48091, H01L2924/00014 (EP);
H01L2224/48465, H01L2224/48091, H01L2924/00 (EP);
H01L2224/48465, H01L2224/48247, H01L2924/00 (EP);
H01L2924/00014, H01L2224/05599 (EP);
H01L2924/00014, H01L2224/45099 (EP);
H01L2924/14, H01L2924/00 (EP); | Designated contracting states | DE, FR, GB, IT [1994/39] | Title | German: | Halbleiteranordnung bestehend aus einem X-förmiger Montierungsrahmen und dessen Herstellungsverfahren | [1994/39] | English: | Semiconductor device having X-shaped die support member and method for making the same | [1994/39] | French: | Dispositif semi-conducteur ayant un support en forme de croix et procédé de fabrication | [1994/39] | Examination procedure | 30.11.1995 | Examination requested [1996/06] | 28.04.1997 | Despatch of a communication from the examining division (Time limit: M06) | 11.02.1998 | Reply to a communication from the examining division | 12.08.1998 | Despatch of a communication from the examining division (Time limit: M06) | 19.02.1999 | Reply to a communication from the examining division | 22.06.1999 | Despatch of a communication from the examining division (Time limit: M06) | 03.02.2000 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time | 12.04.2000 | Reply to a communication from the examining division | 26.04.2001 | Despatch of communication of intention to grant (Approval: No) | 24.09.2001 | Despatch of communication of intention to grant (Approval: later approval) | 28.09.2001 | Communication of intention to grant the patent | 08.01.2002 | Fee for grant paid | 08.01.2002 | Fee for publishing/printing paid | Opposition(s) | 25.02.2003 | No opposition filed within time limit [2003/20] | Request for further processing for: | 12.04.2000 | Request for further processing filed | 12.04.2000 | Full payment received (date of receipt of payment) Request granted | 16.05.2000 | Decision despatched | 11.02.1998 | Request for further processing filed | 11.02.1998 | Full payment received (date of receipt of payment) Request deemed not to be filed | 26.02.1998 | Decision despatched | Fees paid | Renewal fee | 01.04.1996 | Renewal fee patent year 03 | 01.04.1997 | Renewal fee patent year 04 | 31.03.1998 | Renewal fee patent year 05 | 31.03.1999 | Renewal fee patent year 06 | 06.03.2000 | Renewal fee patent year 07 | 05.03.2001 | Renewal fee patent year 08 | 04.03.2002 | Renewal fee patent year 09 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]JPS63204753 ; | [X]JPS6072236 ; | [X]JPS6381966 ; | [X]JPH0274065 | [X] - PATENT ABSTRACTS OF JAPAN, (19881221), vol. 012, no. 489, Database accession no. (E - 696), & JP63204753 A 19880824 (NITTO ELECTRIC IND CO LTD) [X] 1-6,9,10 * abstract * | [X] - PATENT ABSTRACTS OF JAPAN, (19850824), vol. 009, no. 208, Database accession no. (E - 338), & JP60072236 A 19850424 (TOSHIBA KK) [X] 1,9,10 * abstract * | [X] - PATENT ABSTRACTS OF JAPAN, (19880829), vol. 012, no. 318, Database accession no. (E - 650), & JP63081966 A 19880412 (HITACHI LTD) [X] 1-6,9,10 * abstract * | [X] - PATENT ABSTRACTS OF JAPAN, (19900531), vol. 014, no. 255, Database accession no. (E - 0935), & JP02074065 A 19900314 (MATSUSHITA ELECTRON CORP) [X] 1,2,7,8 * abstract * | Examination | JPH04363056 | JPS61110454 | US5229638 |