Extract from the Register of European Patents

EP About this file: EP0661732

EP0661732 - A method of forming silicon oxy-nitride films by plasma-enhanced chemical vapor deposition [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  15.04.2005
Database last updated on 26.03.2026
Most recent event   Tooltip17.02.2006Lapse of the patent in a contracting state
New state(s): FR
published on 05.04.2006  [2006/14]
Applicant(s)For all designated states
Applied Materials, Inc.
P.O. Box 58039
M/S 0934
3050 Bowers Avenue
Santa Clara, California 95052-8039 / US
[N/P]
Former [2004/24]For all designated states
APPLIED MATERIALS, INC.
P.O. Box 58039, M/S 0934, 3050 Bowers Avenue
Santa Clara, California 95052-8039 / US
Former [1995/27]For all designated states
APPLIED MATERIALS, INC.
P.O. Box 58039 3050 Bowers Avenue
Santa Clara California 95052-8039 / US
Inventor(s)01 / Law, Kam
461 Riviera Drive
Union City, California 94587 / US
02 / Olsen, Jeff
20880 Canyon View Drive
Saratoga, California 95070 / US
[1995/27]
Representative(s)Käck, Jürgen, et al
Patentanwälte
Kahler Käck Mollekopf
Vorderer Anger 239
86899 Landsberg/Lech / DE
[N/P]
Former [2002/40]Käck, Jürgen, et al
Kahler Käck Mollekopf Vorderer Anger 239
86899 Landsberg / DE
Former [1996/30]Kahler, Kurt, Dipl.-Ing.
Patentanwälte Kahler, Käck, Fiener et col., Vorderer Anger 268
86899 Landsberg/Lech / DE
Former [1995/27]Kahler, Kurt, Dipl.-Ing.
Patentanwälte Kahler, Käck, Fiener & Sturm P.O. Box 12 49
D-87712 Mindelheim / DE
Application number, filing date94118479.824.11.1994
[1995/27]
Priority number, dateUS1993017409528.12.1993         Original published format: US 174095
[1995/27]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0661732
Date:05.07.1995
Language:EN
[1995/27]
Type: A3 Search report 
No.:EP0661732
Date:14.08.1996
[1996/33]
Type: B1 Patent specification 
No.:EP0661732
Date:09.06.2004
Language:EN
[2004/24]
Search report(s)(Supplementary) European search report - dispatched on:EP03.07.1996
ClassificationIPC:H01L21/316, C23C16/30, C23C16/50
[1995/27]
CPC:
H10P14/6927 (EP,US); C23C16/308 (EP,US); C23C16/45565 (EP,US);
C23C16/5096 (EP,US); H10P14/6336 (EP,US); H10P14/6682 (EP,US);
H10P14/69215 (EP,US); H10P14/69433 (EP,US); Y10T428/24942 (EP,US) (-)
Designated contracting statesDE,   FR,   GB [1995/27]
TitleGerman:Verfahren zur plasma-unterstützten chemischen Dampfabscheidung von Silizium-Oxynitridschichten[1995/27]
English:A method of forming silicon oxy-nitride films by plasma-enhanced chemical vapor deposition[1995/27]
French:Procédé de dépôt chimique en phase vapeur assisté par plasma de couche d'oxynitrure de silicium[1995/27]
Examination procedure14.02.1997Examination requested  [1997/16]
02.11.1998Despatch of a communication from the examining division (Time limit: M06)
14.05.1999Reply to a communication from the examining division
14.11.2000Date of oral proceedings
04.12.2000Despatch of communication that the application is refused, reason: substantive examination {1}
04.12.2000Minutes of oral proceedings despatched
08.10.2003Communication of intention to grant the patent
05.01.2004Fee for grant paid
05.01.2004Fee for publishing/printing paid
Appeal following examination26.01.2001Appeal received No.  T0409/01
04.04.2001Statement of grounds filed
26.06.2003Result of appeal procedure: remittal for grant
Opposition(s)10.03.2005No opposition filed within time limit [2005/22]
Fees paidRenewal fee
29.11.1996Renewal fee patent year 03
28.11.1997Renewal fee patent year 04
30.11.1998Renewal fee patent year 05
30.11.1999Renewal fee patent year 06
30.11.2000Renewal fee patent year 07
30.11.2001Renewal fee patent year 08
28.11.2002Renewal fee patent year 09
07.11.2003Renewal fee patent year 10
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Lapses during opposition  TooltipFR09.06.2004
DE10.09.2004
[2006/14]
Former [2005/30]DE10.09.2004
Documents cited:Search[XY]   W.R.KNOLLE ET AL.: "Characterization of Oxygen-Doped, Plasma-Deposited Silicon Nitride", JOURNAL OF THE ELECTROCHEMICAL SOCIETY, vol. 135, no. 5, May 1988 (1988-05-01), MANCHESTER, NEW HAMPSHIRE US, pages 1211 - 1217, XP002006507
 [XY]   KNOLLE W R ET AL: "PLASMA-DEPOSITED SILICON OXYNITRIDE FROM SILANE, NITROGEN, AND CARBON DIOXIDE OR CARBON MONOXIDE OR NITRIC OXIDE", JOURNAL OF THE ELECTROCHEMICAL SOCIETY, vol. 139, no. 11, 1 November 1992 (1992-11-01), pages 3310 - 3316, XP000360631 [X] 1,2,5-8,11-13,15,16,18-20 * the whole document * [Y] 3,4,9,21
 [X]   T.S.ERIKSSON ET AL.: "Infrared optical properties of silicon oxynitride films: Experimental data and theoretical interpretation", JOURNAL OF APPLIED PHYSICS, vol. 60, no. 6, September 1986 (1986-09-01), NEW YORK US, pages 2081 - 2091, XP002006508 [X] 1,2,5-7,11,12,15,18,20 * the whole document *

DOI:   http://dx.doi.org/10.1063/1.337212
 [X]   "5me COLLOQUE INTERNATIONAL SUR LES PLASMAS ET LA PULVRISATION CATHODIQUE CIP 85", 1985, SOCIT FRANAISE DU VIDE, PARIS, FRANCE, XP002006509, 13148 [X] 1,6 * the whole document *
 [Y]   HIRAO T ET AL: "PROPERTIES OF SILICON OXYNITRIDE FILMS PREPARED BY ECR PLASMA CVD METHOD", JAPANESE JOURNAL OF APPLIED PHYSICS, vol. 27, no. 1, 1 January 1988 (1988-01-01), pages L21 - 23, XP000111327

DOI:   http://dx.doi.org/10.1143/JJAP.27.L21
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