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EP0637080
European procedure
Extract from the Register of European Patents
EP About this file: EP0637080
| EP0637080 - Pressure contact type semiconductor device [Right-click to bookmark this link] | |||
| Former [1995/05] | Pressure contact type semiconductor device and assembly method therefor | ||
| [1998/37] | Status | No opposition filed within time limit Status updated on 16.07.1999 Database last updated on 19.10.2024 | Most recent event Tooltip | 16.07.1999 | No opposition filed within time limit | published on 01.09.1999 [1999/35] | Applicant(s) | For all designated states FUJI ELECTRIC CO. LTD. 1-1, Tanabeshinden, Kawasaki-ku Kawasaki 210 / JP | [1995/05] | Inventor(s) | 01 /
Takahashi, Yoshikazu c/o Fuji Electric Co., Ltd., 1-1 Tanabeshinden Kawasaki-ku, Kawasaki 210 / JP | [1995/05] | Representative(s) | Bridge-Butler, Alan James, et al Baron Warren Redfern 19 South End Kensington London W8 5BU / GB | [N/P] |
| Former [1998/37] | Bridge-Butler, Alan James, et al G.F. Redfern & Co., 7 Staple Inn, Holborn London WC1V 7QF / GB | ||
| Former [1995/05] | Topley, Paul, et al G.F. Redfern & Co. Redfern House 149/151 Tarring Road Worthing West Sussex BN11 4HE / GB | Application number, filing date | 94305463.5 | 25.07.1994 | [1995/05] | Priority number, date | JP19930184271 | 27.07.1993 Original published format: JP 18427193 | JP19940028623 | 28.02.1994 Original published format: JP 2862394 | [1995/05] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP0637080 | Date: | 01.02.1995 | Language: | EN | [1995/05] | Type: | B1 Patent specification | No.: | EP0637080 | Date: | 09.09.1998 | Language: | EN | [1998/37] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 06.12.1994 | Classification | IPC: | H01L23/48, H01L23/367 | [1995/05] | CPC: |
H01L24/72 (EP,US);
H01L24/37 (EP,US);
H01L24/40 (EP,US);
H01L25/072 (EP,US);
H01L2224/37599 (EP,US);
H01L2224/40137 (EP,US);
H01L2224/45015 (EP,US);
H01L2224/45124 (EP,US);
H01L2224/48091 (EP,US);
H01L2224/48247 (EP,US);
H01L2224/83801 (EP,US);
H01L24/45 (EP,US);
H01L2924/00014 (EP,US);
H01L2924/01005 (EP,US);
H01L2924/01013 (EP,US);
H01L2924/01014 (EP,US);
H01L2924/01015 (EP,US);
H01L2924/01033 (EP,US);
H01L2924/01042 (EP,US);
H01L2924/01082 (EP,US);
H01L2924/1301 (EP,US);
H01L2924/1305 (EP,US);
H01L2924/13055 (EP,US);
H01L2924/13091 (EP,US);
| C-Set: |
H01L2224/37599, H01L2924/00014 (US,EP);
H01L2224/45015, H01L2924/00014, H01L2924/2076 (EP,US);
H01L2224/45015, H01L2924/2076 (US,EP);
H01L2224/45124, H01L2924/00014 (US,EP);
H01L2224/45124, H01L2924/00015 (EP,US);
H01L2224/48091, H01L2924/00014 (US,EP);
H01L2924/00014, H01L2224/05599 (EP,US);
H01L2924/00014, H01L2224/37099 (US,EP);
H01L2924/00014, H01L2224/73221 (EP);
H01L2924/1301, H01L2924/00 (EP,US); | Designated contracting states | CH, DE, GB, LI [1995/05] | Title | German: | Halbleiterbauelement mit Druckkontakt | [1998/37] | English: | Pressure contact type semiconductor device | [1998/37] | French: | Dispositif semi-conducteur du type de contact à pression | [1998/37] |
| Former [1995/05] | Halbleiterbauelement mit Druckkontakt und dessen Montageverfahren | ||
| Former [1995/05] | Pressure contact type semiconductor device and assembly method therefor | ||
| Former [1995/05] | Dispositif semi-conducteur du type de contact à pression et son procédé de montage | Miscellaneous | EPB 1998/37: (deleted) | EPB 1998/37: (deleted) | EPB 1998/37: (deleted) | EPB 1997/24: Teilanmeldung 97104435.9 eingereicht am 12/03/97 | EPB 1997/24: Divisional application 97104435.9 filed on 12/03/97 | EPB 1997/24: Demande divisionnaire 97104435.9 déposée le 12/03/97 | Examination procedure | 29.03.1995 | Examination requested [1995/21] | 19.09.1995 | Despatch of a communication from the examining division (Time limit: M04) | 23.01.1996 | Reply to a communication from the examining division | 20.08.1996 | Despatch of a communication from the examining division (Time limit: M04) | 09.12.1996 | Reply to a communication from the examining division | 20.01.1997 | Despatch of a communication from the examining division (Time limit: M04) | 26.02.1997 | Reply to a communication from the examining division | 19.12.1997 | Despatch of communication of intention to grant (Approval: Yes) | 18.02.1998 | Communication of intention to grant the patent | 25.03.1998 | Fee for grant paid | 25.03.1998 | Fee for publishing/printing paid | Divisional application(s) | EP97104435.9 / EP0784342 | Opposition(s) | 10.06.1999 | No opposition filed within time limit [1999/35] | Fees paid | Renewal fee | 06.05.1996 | Renewal fee patent year 03 | 20.05.1997 | Renewal fee patent year 04 | 26.06.1998 | Renewal fee patent year 05 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]JPH04160708 ; | [A]EP0428916 (TOSHIBA KK [JP]) [A] 1-7 * page 5, column 7, line 1 - line 58; figure 7A *; | [A]EP0476661 (TOSHIBA KK [JP]) [A] 8-11* figures 1-12 *; | [XA]EP0499707 (ASEA BROWN BOVERI [CH]) [X] 1,5 * page 3, column 4, line 36 - page 4, column 6, line 50; figures 1-4 * [A] 2-4,6,7 | [A] - PATENT ABSTRACTS OF JAPAN, (19920921), vol. 16, no. 453, Database accession no. (E - 1267), & JP04160708 A 19920604 (NEC) [A] 8-11 * the whole document * |