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Extract from the Register of European Patents

EP About this file: EP0660407

EP0660407 - Adhesive for semiconductor device and reinforcing material using the same [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  12.06.1998
Database last updated on 03.08.2024
Most recent event   Tooltip12.06.1998Application deemed to be withdrawnpublished on 29.07.1998 [1998/31]
Applicant(s)For all designated states
TOMOEGAWA PAPER CO. LTD.
5-15 Kyobashi 1-chome Chuo-ku
Tokyo 104 / JP
[N/P]
Former [1995/26]For all designated states
TOMOEGAWA PAPER CO. LTD.
5-15 Kyobashi 1-chome
Chuo-ku, Tokyo 104 / JP
Inventor(s)01 / Oishi, Tadahiro, c/o Electronic & LCD Materials
Tomoegawa Paper Co., Ltd., 3-1 Mochimune Tomoe-cho
Shizuoka-shi, Shizuoka-ken / JP
02 / Tezuka, Akira, c/o Electronic & LCD Materials
Tomoegawa Paper Co., Ltd., 3-1 Mochimune Tomoe-cho
Shizuoka-shi, Shizuoka-ken / JP
[1995/26]
Representative(s)Woods, Geoffrey Corlett, et al
J A Kemp
14 South Square
Gray's Inn
London WC1R 5JJ / GB
[N/P]
Former [1995/26]Woods, Geoffrey Corlett, et al
J.A. KEMP & CO. 14 South Square Gray's Inn
London WC1R 5LX / GB
Application number, filing date94309571.120.12.1994
[1995/26]
Priority number, dateJP1993034484320.12.1993         Original published format: JP 34484393
[1995/26]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP0660407
Date:28.06.1995
Language:EN
[1995/26]
Search report(s)(Supplementary) European search report - dispatched on:EP26.04.1995
ClassificationIPC:H01L23/498
[1995/26]
CPC:
H01L24/50 (EP); H01L21/50 (KR); H01L23/293 (EP);
H01L23/3157 (EP); H01L23/49572 (EP); H01L2924/01004 (EP);
H01L2924/01005 (EP); H01L2924/01006 (EP); H01L2924/01012 (EP);
H01L2924/01013 (EP); H01L2924/01015 (EP); H01L2924/01019 (EP);
H01L2924/01029 (EP); H01L2924/0103 (EP); H01L2924/01033 (EP);
H01L2924/01042 (EP); H01L2924/01078 (EP); H01L2924/01082 (EP);
H01L2924/14 (EP); H01L2924/181 (EP); H05K3/386 (EP) (-)
C-Set:
H01L2924/181, H01L2924/00 (EP)
Designated contracting statesDE,   FR,   GB [1995/26]
TitleGerman:Klebstoff für Halbleiterbauelement und Verstärkungmaterial[1995/26]
English:Adhesive for semiconductor device and reinforcing material using the same[1995/26]
French:Adhésif pour dispositif semi-conducteur et matériau de renforcement utilisant un tel adhésif[1995/26]
Examination procedure21.07.1995Examination requested  [1995/38]
23.09.1997Despatch of a communication from the examining division (Time limit: M04)
04.02.1998Application deemed to be withdrawn, date of legal effect  [1998/31]
05.03.1998Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [1998/31]
Fees paidRenewal fee
11.12.1996Renewal fee patent year 03
12.12.1997Renewal fee patent year 04
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competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[XY]JPH0529399  ;
 [DA]EP0551512  (TOMOEGAWA PAPER CO LTD [JP]) [DA] 1,3,5,7 * the whole document *;
 [Y]JPH0215644  ;
 [Y]JPH0529385  ;
 [A]JPH0529398  ;
 [A]JPH05259228  ;
 [A]JPH05291356
 [XY]  - PATENT ABSTRACTS OF JAPAN, (19930614), vol. 017, no. 310, Database accession no. (E - 1380), & JP05029399 A 19930205 (TOMOEGAWA PAPER CO LTD) [X] 1 * the whole document * [Y] 3,10-12
 [Y]  - PATENT ABSTRACTS OF JAPAN, (19900326), vol. 014, no. 156, Database accession no. (E - 0908), & JP02015644 A 19900119 (TOMOEGAWA PAPER CO LTD) [Y] 3 * abstract *
 [Y]  - PATENT ABSTRACTS OF JAPAN, (19930614), vol. 017, no. 310, Database accession no. (E - 1380), & JP05029385 A 19930205 (MATSUSHITA ELECTRIC IND CO LTD) [Y] 10-12 * abstract *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19930614), vol. 017, no. 310, Database accession no. (E - 1380), & JP05029398 A 19930205 (TOMOEGAWA PAPER CO LTD) [A] 9 * abstract *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19940113), vol. 018, no. 020, Database accession no. (E - 1489), & JP05259228 A 19931008 (TOMOEGAWA PAPER CO LTD) [A] 1 * abstract *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19940209), vol. 018, no. 080, Database accession no. (E - 1505), & JP05291356 A 19931105 (TOMOEGAWA PAPER CO LTD) [A] 7 * abstract *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.