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Extract from the Register of European Patents

EP About this file: EP0610130

EP0610130 - Method of manufacturing à semiconductor component, in particular a buried ridge laser [Right-click to bookmark this link]
Former [1994/32]Method of manufacturing à semi-conducteur component, in particular a buried ridge laser, and component made by this method
[1998/26]
StatusNo opposition filed within time limit
Status updated on  30.04.1999
Database last updated on 28.06.2024
Most recent event   Tooltip30.04.1999No opposition filed within time limitpublished on 16.06.1999 [1999/24]
Applicant(s)For all designated states
ALCATEL
54, rue La Boétie
75008 Paris / FR
[1999/08]
Former [1998/20]For all designated states
ALCATEL ALSTHOM COMPAGNIE GENERALE D'ELECTRICITE
54, rue La Boétie
75008 Paris / FR
Former [1994/32]For all designated states
ALCATEL N.V.
Strawinskylaan 341, (World Trade Center)
NL-1077 XX Amsterdam / NL
Inventor(s)01 / Goldstein, Léon
1, Allée du Colombier
F-92370 Chaville / FR
02 / Bonnevie, Dominique
15, Rue Georges Clémenceau
F-91310 Leuville sur Orge / FR
[1998/25]
Former [1994/32]01 / Goldstein, Leon
1, Allee du Colombier
F-92370 Chaville / FR
02 / Bonnevie, Dominique
15, Rue Georges Clémenceau
F-91310 Leuville sur Orge / FR
Representative(s)Fournier, Michel Robert Marie, et al
Alcatel Lucent Intellectual Property & Standards 54 rue La Boétie
75008 Paris / FR
[N/P]
Former [1999/19]Fournier, Michel Robert Marie, et al
COMPAGNIE FINANCIERE ALCATEL Département Propriété Industrielle 30, avenue Kléber
75116 Paris / FR
Former [1994/32]Bourely, Paul, et al
SOSPI 14-16, rue de la Baume
F-75008 Paris / FR
Application number, filing date94400210.401.02.1994
[1994/32]
Priority number, dateFR1993000121204.02.1993         Original published format: FR 9301212
[1994/32]
Filing languageFR
Procedural languageFR
PublicationType: A1 Application with search report 
No.:EP0610130
Date:10.08.1994
Language:FR
[1994/32]
Type: B1 Patent specification 
No.:EP0610130
Date:24.06.1998
Language:FR
[1998/26]
Search report(s)(Supplementary) European search report - dispatched on:EP19.04.1994
ClassificationIPC:H01L33/00, H01L21/20, H01S3/19
[1994/32]
CPC:
H01L33/0062 (EP,US); H01S5/305 (EP,US); Y10S148/095 (EP,US)
Designated contracting statesDE,   ES,   FR,   GB,   IT,   NL,   SE [1994/32]
TitleGerman:Verfahren zur Herstellung eines Halbleiterbauteils, insbesondere eines Lasers mit vergrabener Streifenwellenleiterstruktur[1998/26]
English:Method of manufacturing à semiconductor component, in particular a buried ridge laser[1998/26]
French:Procédé de fabrication d'un composant semiconducteur notamment d'un laser à arête enterrée[1998/26]
Former [1994/32]Verfahren zur Herstellung einer Halbleiterkomponente, insbesondere eines Lasers mit vergrabener Streifenstruktur und nach diesem Verfahren hergestellte Komponente
Former [1994/32]Method of manufacturing à semi-conducteur component, in particular a buried ridge laser, and component made by this method
Former [1994/32]Procédé de fabrication d'un composant semi-conducteur notamment d'un laser à arête enterrée, et composant fabriqué par ce procédé
Examination procedure09.12.1994Examination requested  [1995/05]
10.01.1996Despatch of a communication from the examining division (Time limit: M06)
16.07.1996Reply to a communication from the examining division
03.03.1997Despatch of a communication from the examining division (Time limit: M04)
01.04.1997Reply to a communication from the examining division
19.11.1997Despatch of communication of intention to grant (Approval: Yes)
19.12.1997Communication of intention to grant the patent
02.03.1998Fee for grant paid
02.03.1998Fee for publishing/printing paid
Opposition(s)25.03.1999No opposition filed within time limit [1999/24]
Fees paidRenewal fee
02.01.1996Renewal fee patent year 03
20.01.1997Renewal fee patent year 04
19.01.1998Renewal fee patent year 05
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Documents cited:Search[A]JPS6232679  ;
 [A]JPS6482585  ;
 [A]  - H. JUNG AND E. SCHLOSSER, "InP/InGaAsP buried mesa ridge laser: A new ridge laser with reduced leakage currents", APPLIED PHYSICS LETTERS., NEW YORK US, (19890529), vol. 54, no. 22, doi:doi:10.1063/1.101155, pages 2171 - 2173, XP000050402 [A] 1,2,7,8 * the whole document *

DOI:   http://dx.doi.org/10.1063/1.101155
 [A]  - PATENT ABSTRACTS OF JAPAN, (19870709), vol. 11, no. 212, Database accession no. (E - 522), & JP62032679 A 19870212 (NEC CORP) [A] 1,2,7,8 * abstract *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19890713), vol. 13, no. 307, Database accession no. (E - 787), & JP01082585 A 19890328 (TOSHIBA CORP) [A] 1,2,7,8 * abstract *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.