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Extract from the Register of European Patents

EP About this file: EP0703498

EP0703498 - Photosensitive resin composition and method for forming a photoresist pattern [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  06.11.1998
Database last updated on 03.10.2024
Most recent event   Tooltip06.11.1998No opposition filed within time limitpublished on 23.12.1998 [1998/52]
Applicant(s)For all designated states
MITSUBISHI CHEMICAL CORPORATION
5-2 Marunouchi 2-chome
Chiyoda-ku
Tokyo 100-0005 / JP
[N/P]
Former [1996/13]For all designated states
MITSUBISHI CHEMICAL CORPORATION
5-2 Marunouchi 2-chome
Chiyoda-ku, Tokyo 100 / JP
Inventor(s)01 / Nishi, Mineo, Kurosaki Dev.Center
Mitsubishi Chem.Corp., 11 Kurosakishiroishi
Yahatanishi-ku, Kitakyushu-shi, Fukuoka / JP
02 / Nakano, Koji, Kurosaki Dev.Center
Mitsubishi Chem.Corp., 11 Kurosakishiroishi
Yahatanishi-ku, Kitakyushu-shi, Fukuoka / JP
03 / Ikemoto, Makoto, Kurosaki Dev.Center
Mitsubishi Chem.Corp., 11 Kurosakishiroishi
Yahatanishi-ku, Kitakyushu-shi, Fukuoka / JP
04 / Kusumoto, Tadashi, Kurosaki Dev.Center
Mitsubishi Chem.Corp., 11 Kurosakishiroishi
Yahatanishi-ku, Kitakyushu-shi, Fukuoka / JP
05 / Kawase, Yasuhiro, Kurosaki Dev.Center
Mitsubishi Chem.Corp., 11 Kurosakishiroishi
Yahatanishi-ku, Kitakyushu-shi, Fukuoka / JP
[1996/13]
Representative(s)Ter Meer Steinmeister & Partner
Patentanwälte mbB
Nymphenburger Strasse 4
80335 München / DE
[N/P]
Former [1996/13]TER MEER - MÜLLER - STEINMEISTER & PARTNER
Mauerkircherstrasse 45
D-81679 München / DE
Application number, filing date95113937.705.09.1995
[1996/13]
Priority number, dateJP1994021392707.09.1994         Original published format: JP 21392794
[1996/13]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP0703498
Date:27.03.1996
Language:EN
[1996/13]
Type: B1 Patent specification 
No.:EP0703498
Date:29.12.1997
Language:EN
[1997/52]
Search report(s)(Supplementary) European search report - dispatched on:EP08.02.1996
ClassificationIPC:G03F7/022, G03F7/004
[1996/13]
CPC:
G03F7/0226 (EP,US); G03F7/00 (KR); G03F7/0045 (EP,US);
G03F7/022 (EP,US)
Designated contracting statesDE,   GB [1996/13]
TitleGerman:Fotoempfindliche Harzzusammensetzung und Verfahren zur Herstellung von Fotoresistmustern[1996/13]
English:Photosensitive resin composition and method for forming a photoresist pattern[1996/13]
French:Composition à base de résine photosensible et procédé de fabrication de motifs à partir de cette photoréserve[1996/13]
Examination procedure05.07.1996Examination requested  [1996/36]
20.12.1996Despatch of communication of intention to grant (Approval: Yes)
21.03.1997Communication of intention to grant the patent
26.06.1997Fee for grant paid
26.06.1997Fee for publishing/printing paid
Opposition(s)30.09.1998No opposition filed within time limit [1998/52]
Fees paidRenewal fee
16.09.1997Renewal fee patent year 03
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:SearchJPH05323598  [ ] (HITACHI CHEMICAL CO LTD);
 [A]US5215856  (JAYARAMAN TRIPUNITHURA V [US]) [A] 1-11 * column 5, line 47 - line 65; claim - *;
 [AD]US5204218  (KUMADA TERUHIKO [US], et al) [AD] 1-11 * column 3, line 10 - line 39; claim - *
 [AD]  - M. NUNOMURA ET AL., "Positive-working photoresist compositions and resist pattern formation", CHEMICAL ABSTRACTS, (19940613), vol. 120, no. 24, Database accession no. 311598, page 899 [AD] 1-11 * abstract *
by applicantJPH04330444
 JPH05323598
 JPH07104473
 JPH063544
 JPH02269351
 JPH0348249
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.