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EP About this file: EP0702287

EP0702287 - Personal computer cooling device and process for manufacturing container of heat pipe for the device [Right-click to bookmark this link]
Status	The application is deemed to be withdrawn Status updated on 02.08.2002 Database last updated on 03.08.2024
Most recent event Tooltip	02.08.2002	Application deemed to be withdrawn	published on 18.09.2002 [2002/38]
Applicant(s)	For all designated states FUJIKURA LTD. 5-1 Kiba 1-chome Kohtoh-ku Tokyo / JP
	[N/P]
Former [1996/12]	For all designated states FUJIKURA LTD. No. 5-1 Kiba 1-chome Koto-ku Tokyo / JP
Inventor(s)	01 / Mochizuki, Masataka Fujikura Ltd., 5-1, Kiba 1-chome Koto-ku, Tokyo / JP
	02 / Mashiko, Koichi Fujikura Ltd., 5-1, Kiba 1-chome Koto-ku, Tokyo / JP
	03 / Saito, Yuji Fujikura Ltd., 5-1, Kiba 1-chome Koto-ku, Tokyo / JP
	04 / Hasegawa, Masashi Fujikura Ltd., 5-1, Kiba 1-chome Koto-ku, Tokyo / JP
	05 / Ono, Motoyuki Fujikura Ltd., 5-1, Kiba 1-chome Koto-ku, Tokyo / JP
	06 / Sugano, Shinji Fujikura Ltd., 5-1, Kiba 1-chome Koto-ku, Tokyo / JP
	[1996/12]
Representative(s)	Pellmann, Hans-Bernd, et al Patentanwaltsbüro Tiedtke-Bühling-Kinne & Partner Bavariaring 4-6 80336 München / DE
	[N/P]
Former [1996/12]	Pellmann, Hans-Bernd, Dipl.-Ing., et al Patentanwaltsbüro Tiedtke-Bühling-Kinne & Partner Bavariaring 4 D-80336 München / DE
Application number, filing date	95114535.8	15.09.1995
	[1996/12]
Priority number, date	JP19940248877	16.09.1994 Original published format: JP 24887794
	JP19940300341	09.11.1994 Original published format: JP 30034194
	JP19950129084	28.04.1995 Original published format: JP 12908495
	JP19950129085	28.04.1995 Original published format: JP 12908595
	JP19950132947	02.05.1995 Original published format: JP 13294795
	JP19950188694	30.06.1995 Original published format: JP 18869495
	[1996/12]
Filing language	EN
Procedural language	EN
Publication	Type:	A2 Application without search report
	No.:	EP0702287
	Date:	20.03.1996
	Language:	EN
	[1996/12]
	Type:	A3 Search report
	No.:	EP0702287
	Date:	05.03.1997
	[1997/10]
Search report(s)	(Supplementary) European search report - dispatched on:	EP	13.01.1997
Classification	IPC:	G06F1/20, H05K7/20, H01L23/427, F28D15/02, F28D15/04	[1997/06]
	CPC:	G06F1/203 (EP,US); G06F1/00 (KR); G06F2200/201 (EP,US)
	Former IPC [1997/03]	G06F1/20, H05K7/20, H01L23/427
	Former IPC [1996/27]	G06F1/20, H05K7/20
	Former IPC [1996/12]	G06F1/20
Designated contracting states	DE, FR, GB, IT [1996/12]
Title	German:	Kühlvorrichtung für Personalrechner und Herstellungsverfahren von Wärmerohrbehälter für besagte Vorrichtung	[1996/12]
	English:	Personal computer cooling device and process for manufacturing container of heat pipe for the device	[1996/12]
	French:	Dispositif de refroidissement pour ordinateur personnel et procédé de fabrication de conteneur de conduite de transfert de chaleur pour ce dispositif	[1996/12]
Examination procedure	15.09.1995	Examination requested [1996/12]
	10.11.2000	Despatch of a communication from the examining division (Time limit: M04)
	19.03.2001	Reply to a communication from the examining division
	07.09.2001	Despatch of a communication from the examining division (Time limit: M06)
	18.01.2002	Application deemed to be withdrawn, date of legal effect [2002/38]
	22.04.2002	Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [2002/38]
Fees paid	Renewal fee
	26.09.1997	Renewal fee patent year 03
	29.09.1998	Renewal fee patent year 04
	27.09.1999	Renewal fee patent year 05
	28.09.2000	Renewal fee patent year 06
	28.09.2001	Renewal fee patent year 07
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:	Search	[X]JPS60198848 ;
		[A]DE2515753 (SIEMENS AG) [A] 41* page 5, line 16 - line 21; figure 3 *;
		[A]US4109709 (HONDA ICHIRO, et al) [A] 37-40 * column 4, line 63 - column 5, line 51; figures 4,5 *;
		[A]US4394344 (WERNER RICHARD W, et al) [A] 37 * abstract *;
		[XA]DE4217431 (HITACHI LTD [JP]) [X] 19,35 * abstract * * column 6, line 31 - line 58 * * figures 3,10,25 * * figures 11,13 * [A] 1,11;
		[A]US5237486 (LAPOINTE BRION [US], et al) [A] 1,11 * abstract *;
		[XA]US5331510 (OUCHI KATSUNORI [JP], et al) [X] 19,20 * column 5, line 52 - line 58 * * column 8, line 15 - line 36 * * figure 4 * [A] 35;
		[X] - NICHOLAS BARAN, "Liquid-Cooled PCs: The Next Hot Thing?", BYTE, ST PETERBOROUGH US, (199402), vol. 19, no. 2, page 32, XP000425736 [X] 1,9,10 * the whole document *
		[X] - PATENT ABSTRACTS OF JAPAN, (19860219), vol. 10, no. 42, Database accession no. (E - 382), & JP60198848 A 19851008 (FUJITSU) [X] 19 * abstract *
		[X] - "LIQUID HEAT SINK COOLS MILITARY COMPUTER", MACHINE DESIGN, (19920611), vol. 64, no. 11, page 42, XP000319107 [X] 35 * the whole document *
		[A] - LEVASSEUR R, "LIQUID COOLED APPROACHES FOR HIGH DENSITY AVIONICS", PROCEEDINGS OF THE DIGITAL AVIONICS SYSTEMS CONFERENCE, LOS ANGELES, OCT. 14 - 17, 1991, INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS, (19911014), no. CONF. 10, pages 147 - 152, XP000309237 [A] 35 * figure 1 *

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