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EP0720226
European procedure
Extract from the Register of European Patents
EP About this file: EP0720226
| EP0720226 - Semiconductor device comprising contact bumps [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 13.06.2008 Database last updated on 15.05.2024 | Most recent event Tooltip | 19.06.2009 | Lapse of the patent in a contracting state New state(s): FR | published on 22.07.2009 [2009/30] | Applicant(s) | For all designated states MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 1006, Oaza Kadoma Kadoma-shi Osaka 571-8501 / JP | [N/P] |
| Former [2007/32] | For all designated states MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD 1006, Oaza-Kadoma Kadoma-shi, Osaka 571-8501 / JP | ||
| Former [1996/27] | For all designated states MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 1006, Oaza Kadoma Kadoma-shi, Osaka-fu, 571 / JP | Inventor(s) | 01 /
Yagi, Yoshihiko 2-4-508, Asahigaoka-cho Ashiya-shi, Hyogo / JP | 02 /
Higashi, Kazushi 4-37-207, Sengoku Nishi-machi Kadoma-shi, Osaka / JP | 03 /
Tsukahara, Norihito Takanoharaeki nishidanchi 17-102, 1-2 Kabutodai Kizu-cho, Soraku-gun, Kyoto / JP | 04 /
Kumagai, Koichi 2-10-16, Hikarigaoka Ikoma-shi, Nara / JP | 05 /
Yonezawa, Takahiro 30-4-1209, Miiminami-machi Neyagawa-shi, Osaka / JP | [1996/27] | Representative(s) | Eisenführ Speiser Patentanwälte Rechtsanwälte PartGmbB Postfach 10 60 78 28060 Bremen / DE | [N/P] |
| Former [1996/27] | Eisenführ, Speiser & Partner Martinistrasse 24 28195 Bremen / DE | Application number, filing date | 95120500.4 | 22.12.1995 | [1996/27] | Priority number, date | JP19940322032 | 26.12.1994 Original published format: JP 32203294 | JP19950007523 | 20.01.1995 Original published format: JP 752395 | JP19950009401 | 25.01.1995 Original published format: JP 940195 | [1996/27] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0720226 | Date: | 03.07.1996 | Language: | EN | [1996/27] | Type: | A3 Search report | No.: | EP0720226 | Date: | 19.11.1997 | [1997/47] | Type: | B1 Patent specification | No.: | EP0720226 | Date: | 08.08.2007 | Language: | EN | [2007/32] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 01.10.1997 | Classification | IPC: | H01L23/485, H01L21/60 | [1996/27] | CPC: |
H01L24/12 (EP,US);
H01L21/321 (KR);
H01L24/11 (EP,US);
H01L24/16 (EP,US);
H01L2224/0401 (EP,US);
H01L2224/05568 (EP,US);
H01L2224/05573 (EP,US);
H01L2224/0603 (EP,US);
H01L2224/1134 (EP,US);
H01L2224/11822 (EP,US);
H01L2224/1184 (EP,US);
H01L2224/131 (EP,US);
H01L2224/13144 (EP,US);
H01L2224/1403 (EP,US);
H01L2224/16 (EP,US);
H01L2224/45144 (EP,US);
H01L2224/81191 (EP,US);
H01L2924/00013 (EP,US);
H01L2924/00014 (EP,US);
H01L2924/01005 (EP,US);
H01L2924/01006 (EP,US);
H01L2924/01033 (EP,US);
H01L2924/01039 (EP,US);
H01L2924/01078 (EP,US);
| C-Set: |
H01L2224/1134, H01L2924/00012 (EP,US);
H01L2224/13144, H01L2924/00014 (US,EP);
H01L2224/131, H01L2924/014 (EP,US);
H01L2224/45144, H01L2924/00 (US,EP); | Designated contracting states | DE, FR, GB [1996/27] | Title | German: | Halbleiteranordnung mit Kontaktlöchern | [1996/27] | English: | Semiconductor device comprising contact bumps | [1996/27] | French: | Dispositif semi-conducteur comprenant des plots de contact | [1996/27] | Examination procedure | 27.12.1995 | Examination requested [1996/27] | 21.10.1999 | Despatch of a communication from the examining division (Time limit: M06) | 22.03.2000 | Reply to a communication from the examining division | 30.03.2006 | Despatch of a communication from the examining division (Time limit: M04) | 02.06.2006 | Reply to a communication from the examining division | 12.01.2007 | Communication of intention to grant the patent | 22.05.2007 | Fee for grant paid | 22.05.2007 | Fee for publishing/printing paid | Opposition(s) | 09.05.2008 | No opposition filed within time limit [2008/29] | Fees paid | Renewal fee | 24.12.1997 | Renewal fee patent year 03 | 04.01.1999 | Renewal fee patent year 04 | 05.01.2000 | Renewal fee patent year 05 | 02.01.2001 | Renewal fee patent year 06 | 02.01.2002 | Renewal fee patent year 07 | 02.01.2003 | Renewal fee patent year 08 | 02.01.2004 | Renewal fee patent year 09 | 03.01.2005 | Renewal fee patent year 10 | 02.01.2006 | Renewal fee patent year 11 | 02.01.2007 | Renewal fee patent year 12 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | GB | 22.12.2007 | FR | 31.12.2007 | [2009/30] |
| Former [2009/03] | GB | 22.12.2007 | Documents cited: | Search | [A]JPS61219159 ; | [XA]EP0402756 (NEC CORP [JP]) [X] 1 * column 8, line 8 - line 58; figures 10B,11B,12; claims 1,2 * [A] 2-5; | [A]EP0409582 (NEC CORP [JP]); | [A]US5172851 (MATSUSHITA AKIRA [JP], et al) [A] 1,2,5 * figures 1D,2; claims 1-4 * | [A] - PATENT ABSTRACTS OF JAPAN, (19870224), vol. 011, no. 059, Database accession no. (E - 482), & JP61219159 A 19860929 (TOSHIBA CORP;OTHERS: 01) [A] * abstract * | Examination | US4661192 | EP0388011 | - SUWA M. ET AL, "Development of a new flip-chip bonding process using multi-stacked /spl mu/-Au bumps", PROCEEDINGS OF THE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, WASHINGTON, MAY 1 - 4, 1994, NEW YORK, IEEE, US, (19940501), pages 906 - 909, XP000479201 |