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Extract from the Register of European Patents

EP About this file: EP0667638

EP0667638 - Method of etching a compound semiconductor [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  06.08.1999
Database last updated on 04.06.2024
Most recent event   Tooltip04.01.2008Lapse of the patent in a contracting state
New state(s): IT
published on 06.02.2008  [2008/06]
Applicant(s)For all designated states
AT&T Corp.
32 Avenue of the Americas
New York, NY 10013-2412 / US
[1995/33]
Inventor(s)01 / Chiu, Tien-Heng
4 Manor Boulevard
Spotswood, New Jersey 08884 / US
02 / Tsang, Won-Tien
8 Taylor Run
Holmdel, New Jersey 07733 / US
[1995/33]
Representative(s)Johnston, Kenneth Graham, et al
Lucent Technologies EUR-IP UK Ltd Unit 18, Core 3 Workzone Innova Business Park Electric Avenue
Enfield, EN3 7XB / GB
[N/P]
Former [1995/33]Johnston, Kenneth Graham, et al
AT&T (UK) Ltd. 5 Mornington Road
Woodford Green Essex, IG8 OTU / GB
Application number, filing date95300764.808.02.1995
[1995/33]
Priority number, dateUS1994019693015.02.1994         Original published format: US 196930
[1995/33]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0667638
Date:16.08.1995
Language:EN
[1995/33]
Type: A3 Search report 
No.:EP0667638
Date:10.07.1996
[1996/28]
Type: B1 Patent specification 
No.:EP0667638
Date:30.09.1998
Language:EN
[1998/40]
Search report(s)(Supplementary) European search report - dispatched on:EP29.05.1996
ClassificationIPC:H01L21/20, H01L21/306, C30B25/14
[1996/28]
CPC:
C30B25/02 (EP,US); C30B29/40 (EP,US); C30B29/42 (EP,US);
H01L21/02543 (EP,US); H01L21/02546 (EP,US); H01L21/0262 (EP,US);
H01L21/02636 (EP,US); Y10S438/913 (EP,US) (-)
Former IPC [1995/33]H01L21/205
Designated contracting statesDE,   FR,   GB,   IT [1995/33]
TitleGerman:Verfahren zum Ätzen eines Verbundhalbleiters[1995/33]
English:Method of etching a compound semiconductor[1995/33]
French:Procédé d'attaque d'un semi-conducteur composé[1995/33]
Examination procedure11.12.1996Examination requested  [1997/09]
26.02.1997Despatch of a communication from the examining division (Time limit: M06)
29.08.1997Reply to a communication from the examining division
23.12.1997Despatch of communication of intention to grant (Approval: Yes)
20.03.1998Communication of intention to grant the patent
28.05.1998Fee for grant paid
28.05.1998Fee for publishing/printing paid
Opposition(s)01.07.1999No opposition filed within time limit [1999/38]
Fees paidRenewal fee
14.02.1997Renewal fee patent year 03
12.02.1998Renewal fee patent year 04
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Patent Court
See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipFR30.09.1998
IT30.09.1998
[2008/06]
Former [2006/14]FR30.09.1998
Former [1999/36]FR26.02.1999
Documents cited:Search[X]US5112439  (REISMAN ARNOLD [US], et al) [X] 1 * column 4, lines 55-65 * * column 7, lines 32-35 * * column 7, line 53 - column 8, line 13 *;
 [A]JPS56169331  ;
 [A]JPS6134926  ;
 [A]  - PATENT ABSTRACTS OF JAPAN, (19820410), vol. 006, no. 055, Database accession no. (E - 101), & JP56169331 A 19811226 (NEC CORP) [A] 1,3,4 * abstract *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19860628), vol. 010, no. 186, Database accession no. (E - 416), & JP61034926 A 19860219 (RES DEV CORP OF JAPAN;OTHERS: 03) [A] 1,3,4 * abstract *
 [A]  - TSANG W T, "SELECTIVE-AREA EPITAXY AND ETCHING BY CHEMICAL BEAM EPITAXY", SEMICONDUCTOR SCIENCE AND TECHNOLOGY, (19930601), vol. 8, no. 6, pages 1016 - 1022, XP000399842 [A] 1,3,4 * abstract *

DOI:   http://dx.doi.org/10.1088/0268-1242/8/6/008
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