-
EP0687526
European procedure
Extract from the Register of European Patents
EP About this file: EP0687526
| EP0687526 - Polishing method and apparatus for automatic reduction of wafer taper in single-wafer polishing [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 26.05.2000 Database last updated on 19.10.2024 | Most recent event Tooltip | 21.06.2002 | Lapse of the patent in a contracting state | published on 07.08.2002 [2002/32] | Applicant(s) | For all designated states SHIN-ETSU HANDOTAI COMPANY LIMITED 4-2, Marunouchi 1-Chome Chiyoda-ku Tokyo / JP | [N/P] |
| Former [1995/51] | For all designated states SHIN-ETSU HANDOTAI COMPANY LIMITED 4-2, Marunouchi 1-Chome Chiyoda-ku Tokyo / JP | Inventor(s) | 01 /
Misaka, Hitoshi 1-110, Aza-furutakayama Shirakawa-shi, Fukushima-ken / JP | 02 /
Tanaka, Kouichi, Kohu-ryo 106 250-9, Aza-ohira, Oaza-odakura, Nishigo-mura Nishishirakawa-gun, Fukushima-ken / JP | 03 /
Matsumoto, Morifumi, Ryokuhu-ryo 150-5, Aza-ohira, Oaza-odakura, Nishigo-mura Nishishirakawa-gun, Fukushima-ken / JP | 04 /
Morita, Kouji 58, Aza-nishinouchi, Oaza-motonuma Shirakawa-shi, Fukushima-ken / JP | [1995/51] | Representative(s) | Whalley, Kevin, et al Marks & Clerk LLP 90 Long Acre London WC2E 9RA / GB | [N/P] |
| Former [1995/51] | Whalley, Kevin, et al MARKS & CLERK, 57-60 Lincoln's Inn Fields London WC2A 3LS / GB | Application number, filing date | 95302449.4 | 12.04.1995 | [1995/51] | Priority number, date | JP19940103398 | 18.04.1994 Original published format: JP 10339894 | [1995/51] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP0687526 | Date: | 20.12.1995 | Language: | EN | [1995/51] | Type: | B1 Patent specification | No.: | EP0687526 | Date: | 21.07.1999 | Language: | EN | [1999/29] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 24.07.1995 | Classification | IPC: | B24B37/04 | [1995/51] | CPC: |
B24B37/005 (EP,US)
| Designated contracting states | DE, FR, GB [1995/51] | Title | German: | Verfahren und Vorrichtung zur automatischen Reduzierung der Konizität eines Wafers im Einzelpoliervorgang | [1995/51] | English: | Polishing method and apparatus for automatic reduction of wafer taper in single-wafer polishing | [1995/51] | French: | Procédé et dispositif de polissage pour la réduction automatique de la conicité d'une plaquette semi-conductrice lors du polissage pièce par pièce | [1995/51] | Examination procedure | 08.12.1995 | Examination requested [1996/06] | 22.10.1998 | Despatch of communication of intention to grant (Approval: No) | 13.01.1999 | Despatch of communication of intention to grant (Approval: later approval) | 25.01.1999 | Communication of intention to grant the patent | 30.03.1999 | Fee for grant paid | 30.03.1999 | Fee for publishing/printing paid | Opposition(s) | 26.04.2000 | No opposition filed within time limit [2000/28] | Fees paid | Renewal fee | 12.04.1997 | Renewal fee patent year 03 | 14.04.1998 | Renewal fee patent year 04 | 14.04.1999 | Renewal fee patent year 05 |
| Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | FR | 21.07.1999 | [2002/32] | Documents cited: | Search | [DA]JPH02159722 ; | [A]JPH02257628 ; | [A]JPH01228773 ; | [A]JPH01193172 ; | [A]JPH0227721 ; | [A]JPH01153266 ; | [A]US4742651 (WITTSTOCK GERHARD [DE]) [A] 1,3 * abstract * | [DA] - PATENT ABSTRACTS OF JAPAN, (19900907), vol. 014, no. 414, Database accession no. (E - 0975), & JP02159722 A 19900619 (SHIN ETSU HANDOTAI CO LTD) [DA] 1,3 * abstract * | [A] - PATENT ABSTRACTS OF JAPAN, (19910107), vol. 015, no. 003, Database accession no. (E - 1019), & JP02257628 A 19901018 (KYUSHU ELECTRON METAL CO LTD;OTHERS: 01) [A] 1,3 * abstract * | [A] - PATENT ABSTRACTS OF JAPAN, (19891211), vol. 013, no. 555, Database accession no. (M - 904), & JP01228773 A 19890912 (KYUSHU ELECTRON METAL CO LTD;OTHERS: 01) [A] 1,3 * abstract * | [A] - PATENT ABSTRACTS OF JAPAN, (19891106), vol. 013, no. 485, Database accession no. (M - 887), & JP01193172 A 19890803 (SUMITOMO METAL MINING CO LTD) [A] 1,3 * abstract * | [A] - PATENT ABSTRACTS OF JAPAN, (19900330), vol. 014, no. 170, Database accession no. (E - 0913), & JP02027721 A 19900130 (HITACHI LTD) [A] 1,3 * abstract * | [A] - PATENT ABSTRACTS OF JAPAN, (19890913), vol. 013, no. 415, Database accession no. (M - 870), & JP01153266 A 19890615 (SHINETSU ENG KK;OTHERS: 01) [A] 1,3 * abstract * |