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Extract from the Register of European Patents

EP About this file: EP0680081

EP0680081 - Method of forming thin film and electronic device using thin film [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  03.11.2000
Database last updated on 19.10.2024
Most recent event   Tooltip03.11.2000Application deemed to be withdrawnpublished on 20.12.2000 [2000/51]
Applicant(s)For all designated states
Hitachi, Ltd.
6, Kanda Surugadai 4-chome
Chiyoda-ku
Tokyo 101 / JP
[N/P]
Former [1995/44]For all designated states
HITACHI, LTD.
6, Kanda Surugadai 4-chome
Chiyoda-ku, Tokyo 101 / JP
Inventor(s)01 / Miwa, Takao
4829-46, Nakane
Hitachinaka-shi, Ibaraki 312 / JP
02 / Matsuda, Minoru
16-18 Kuromatsu 1-chome, Izumi-ku
Sendai-shi, Miyagi 981 / JP
03 / Watanabe, Akira
68-6-22, Kawauchikameoka, Aoba-ku
Sendai-shi, Miyagi 980 / JP
[1995/44]
Representative(s)Paget, Hugh Charles Edward, et al
Mewburn Ellis LLP
City Tower
40 Basinghall Street
London EC2V 5DE / GB
[N/P]
Former [1995/44]Paget, Hugh Charles Edward, et al
MEWBURN ELLIS York House 23 Kingsway
London WC2B 6HP / GB
Application number, filing date95302740.624.04.1995
[1995/44]
Priority number, dateJP1994008619625.04.1994         Original published format: JP 8619694
[1995/44]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0680081
Date:02.11.1995
Language:EN
[1995/44]
Type: A3 Search report 
No.:EP0680081
Date:04.03.1998
[1998/10]
Search report(s)(Supplementary) European search report - dispatched on:EP20.01.1998
ClassificationIPC:H01L21/428, H01L21/4757, H01L51/30, C08G77/60
[1998/06]
CPC:
H01L21/4846 (EP); H01L21/31 (KR); H01L21/02337 (US);
H01L21/02164 (EP,KR,US); H01L21/02348 (US); H01L21/481 (EP);
H01L23/49872 (EP); H01L21/02126 (EP); H01L21/02282 (EP);
H01L2924/0002 (EP) (-)
C-Set:
H01L2924/0002, H01L2924/00 (EP)
Former IPC [1995/44]H01L21/428, H01L21/4757, H01L51/30
Designated contracting statesDE,   FR [1995/44]
TitleGerman:Verfahren zur Bildung dünner Schichten und elektronischer Vorrichtung mit dünnen Schichten[1995/44]
English:Method of forming thin film and electronic device using thin film[1995/44]
French:Procédé pour former une couche mince et dispositif électronique utilisant la couche mince[1995/44]
Examination procedure02.05.1995Examination requested  [1995/44]
21.02.2000Despatch of a communication from the examining division (Time limit: M04)
04.07.2000Application deemed to be withdrawn, date of legal effect  [2000/51]
28.07.2000Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [2000/51]
Fees paidRenewal fee
23.04.1997Renewal fee patent year 03
21.04.1998Renewal fee patent year 04
21.04.1999Renewal fee patent year 05
Penalty fee
Additional fee for renewal fee
30.04.200006   M06   Not yet paid
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[A]GB925722  (KOPPERS CO INC)[A] 1-14;
 [A]JPH02202524  (NIPPON OILS & FATS CO LTD) [A] 1-14;
 [AD]JPH03258834  (NIPPON TELEGRAPH & TELEPHONE) [AD] 1-14;
 [A]JPH05247217  (SHONO TATSUYA, et al) [A] 1-14
 [AD]  - WALLRAFF, G.M. et al., "Poly- silanes for microlithography. SPIE Advances in Resist Technology and Processing VIII", (1991), vol. 1466, pages 211 - 217 [AD] 1-14
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.