Extract from the Register of European Patents

EP About this file: EP0682368

EP0682368 - Metallization for polymer-dielectric multichip modules [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  18.04.2003
Database last updated on 18.03.2026
Most recent event   Tooltip17.02.2006Lapse of the patent in a contracting state
Updated state(s): FR
published on 05.04.2006  [2006/14]
Applicant(s)For all designated states
AT&T Corp.
32 Avenue of the Americas
New York, NY 10013-2412 / US
[1995/46]
Inventor(s)01 / Frank, Aaron Leonard
52 Plymouth Road
Malden, Massachusetts 02148 / US
02 / Johnson, Douglas Bradford
26 Anne Drive
Hampstead, New Hampshire 03841 / US
03 / Ibidunni, Ajibola Olutoyin
30 Riverview Circle
Litchfield, New Hampshire 03051 / US
04 / Krause, Dennis Lyle
16 Maple Avenue
Atkinson, New Hampshire 03811 / US
05 / Nguyen, Trac
10 Cornell Road
Haverhill, Massachusetts 01832 / US
[1995/46]
Representative(s)Williams, David John, et al
Page White & Farrer Limited
Bedford House
21A John Street
London WC1N 2BF / GB
[N/P]
Former [2001/19]Williams, David John, et al
Page White & Farrer, 54 Doughty Street
London WC1N 2LS / GB
Former [1995/46]Johnston, Kenneth Graham, et al
AT&T (UK) Ltd. 5 Mornington Road
Woodford Green Essex, IG8 OTU / GB
Application number, filing date95302829.726.04.1995
[1995/46]
Priority number, dateUS1994023979709.05.1994         Original published format: US 239797
[1995/46]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0682368
Date:15.11.1995
Language:EN
[1995/46]
Type: A3 Search report 
No.:EP0682368
Date:01.05.1996
[1996/18]
Type: B1 Patent specification 
No.:EP0682368
Date:12.06.2002
Language:EN
[2002/24]
Search report(s)(Supplementary) European search report - dispatched on:EP12.03.1996
ClassificationIPC:H01L23/498, H01L27/01
[1996/17]
CPC:
H05K3/388 (EP,KR,US); H05K3/467 (EP,KR,US); H10W20/4403 (KR);
H10W70/05 (EP,US); H10W70/60 (EP,US); H10W70/611 (EP,US);
H10W70/66 (EP,US); H10W70/69 (EP,KR,US); H05K3/4644 (EP,US);
H10W72/07251 (EP,US); H10W72/20 (EP,US) (-)
Former IPC [1995/46]H01L23/498
Designated contracting statesDE,   ES,   FR,   GB,   NL [1995/46]
TitleGerman:Metallisierung für Polymerdielektrikum-Multichipmodule[1995/46]
English:Metallization for polymer-dielectric multichip modules[1995/46]
French:Métallisation pour modules multi-puces avec diélectrique à base de polymère[1995/46]
Examination procedure18.10.1996Examination requested  [1996/52]
19.01.1998Despatch of a communication from the examining division (Time limit: M06)
18.07.1998Reply to a communication from the examining division
16.02.1999Despatch of a communication from the examining division (Time limit: M06)
17.06.1999Reply to a communication from the examining division
20.02.2001Despatch of communication of intention to grant (Approval: Yes)
21.06.2001Communication of intention to grant the patent
20.09.2001Fee for grant paid
20.09.2001Fee for publishing/printing paid
Opposition(s)13.03.2003No opposition filed within time limit [2003/23]
Fees paidRenewal fee
18.04.1997Renewal fee patent year 03
16.04.1998Renewal fee patent year 04
12.04.1999Renewal fee patent year 05
14.04.2000Renewal fee patent year 06
26.03.2001Renewal fee patent year 07
25.03.2002Renewal fee patent year 08
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Lapses during opposition  TooltipFR12.06.2002
NL12.06.2002
DE13.09.2002
ES20.12.2002
[2006/14]
Former [2004/04]NL12.06.2002
DE13.09.2002
ES20.12.2002
FR24.01.2003
Former [2003/47]NL12.06.2002
DE13.09.2002
FR24.01.2003
Former [2003/31]NL12.06.2002
DE13.09.2002
Former [2003/08]NL12.06.2002
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