| EP0682368 - Metallization for polymer-dielectric multichip modules [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 18.04.2003 Database last updated on 18.03.2026 | Most recent event Tooltip | 17.02.2006 | Lapse of the patent in a contracting state Updated state(s): FR | published on 05.04.2006 [2006/14] | Applicant(s) | For all designated states AT&T Corp. 32 Avenue of the Americas New York, NY 10013-2412 / US | [1995/46] | Inventor(s) | 01 /
Frank, Aaron Leonard 52 Plymouth Road Malden, Massachusetts 02148 / US | 02 /
Johnson, Douglas Bradford 26 Anne Drive Hampstead, New Hampshire 03841 / US | 03 /
Ibidunni, Ajibola Olutoyin 30 Riverview Circle Litchfield, New Hampshire 03051 / US | 04 /
Krause, Dennis Lyle 16 Maple Avenue Atkinson, New Hampshire 03811 / US | 05 /
Nguyen, Trac 10 Cornell Road Haverhill, Massachusetts 01832 / US | [1995/46] | Representative(s) | Williams, David John, et al Page White & Farrer Limited Bedford House 21A John Street London WC1N 2BF / GB | [N/P] |
| Former [2001/19] | Williams, David John, et al Page White & Farrer, 54 Doughty Street London WC1N 2LS / GB | ||
| Former [1995/46] | Johnston, Kenneth Graham, et al AT&T (UK) Ltd. 5 Mornington Road Woodford Green Essex, IG8 OTU / GB | Application number, filing date | 95302829.7 | 26.04.1995 | [1995/46] | Priority number, date | US19940239797 | 09.05.1994 Original published format: US 239797 | [1995/46] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0682368 | Date: | 15.11.1995 | Language: | EN | [1995/46] | Type: | A3 Search report | No.: | EP0682368 | Date: | 01.05.1996 | [1996/18] | Type: | B1 Patent specification | No.: | EP0682368 | Date: | 12.06.2002 | Language: | EN | [2002/24] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 12.03.1996 | Classification | IPC: | H01L23/498, H01L27/01 | [1996/17] | CPC: |
H05K3/388 (EP,KR,US);
H05K3/467 (EP,KR,US);
H10W20/4403 (KR);
H10W70/05 (EP,US);
H10W70/60 (EP,US);
H10W70/611 (EP,US);
H10W70/66 (EP,US);
H10W70/69 (EP,KR,US);
H05K3/4644 (EP,US);
|
| Former IPC [1995/46] | H01L23/498 | Designated contracting states | DE, ES, FR, GB, NL [1995/46] | Title | German: | Metallisierung für Polymerdielektrikum-Multichipmodule | [1995/46] | English: | Metallization for polymer-dielectric multichip modules | [1995/46] | French: | Métallisation pour modules multi-puces avec diélectrique à base de polymère | [1995/46] | Examination procedure | 18.10.1996 | Examination requested [1996/52] | 19.01.1998 | Despatch of a communication from the examining division (Time limit: M06) | 18.07.1998 | Reply to a communication from the examining division | 16.02.1999 | Despatch of a communication from the examining division (Time limit: M06) | 17.06.1999 | Reply to a communication from the examining division | 20.02.2001 | Despatch of communication of intention to grant (Approval: Yes) | 21.06.2001 | Communication of intention to grant the patent | 20.09.2001 | Fee for grant paid | 20.09.2001 | Fee for publishing/printing paid | Opposition(s) | 13.03.2003 | No opposition filed within time limit [2003/23] | Fees paid | Renewal fee | 18.04.1997 | Renewal fee patent year 03 | 16.04.1998 | Renewal fee patent year 04 | 12.04.1999 | Renewal fee patent year 05 | 14.04.2000 | Renewal fee patent year 06 | 26.03.2001 | Renewal fee patent year 07 | 25.03.2002 | Renewal fee patent year 08 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | FR | 12.06.2002 | NL | 12.06.2002 | DE | 13.09.2002 | ES | 20.12.2002 | [2006/14] |
| Former [2004/04] | NL | 12.06.2002 | |
| DE | 13.09.2002 | ||
| ES | 20.12.2002 | ||
| FR | 24.01.2003 | ||
| Former [2003/47] | NL | 12.06.2002 | |
| DE | 13.09.2002 | ||
| FR | 24.01.2003 | ||
| Former [2003/31] | NL | 12.06.2002 | |
| DE | 13.09.2002 | ||
| Former [2003/08] | NL | 12.06.2002 | |