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EP About this file: EP0706221

EP0706221 - Semiconductor device comprising a plurality of semiconductor elements [Right-click to bookmark this link]
Status	No opposition filed within time limit Status updated on 01.05.2009 Database last updated on 06.07.2024
Most recent event Tooltip	01.05.2009	No opposition filed within time limit	published on 03.06.2009 [2009/23]
Applicant(s)	For all designated states Hitachi, Ltd. 6, Kanda Surugadai 4-chome Chiyoda-ku Tokyo 101 / JP
	For all designated states HITACHI HARAMACHI ELECTRONICS CO., LTD. 10-2, Benten-cho 3-chome Hitachi-shi Ibaraki 317-0072 / JP
	[N/P]
Former [2008/31]	For all designated states Hitachi, Ltd. 6, Kanda Surugadai 4-chome Chiyoda-ku Tokyo 101 / JP
	For all designated states HITACHI HARAMACHI ELECTRONICS CO., LTD. 10-2, Benten-cho 3-chome Hitachi-shi Ibaraki 317-0072 / JP
Former [2008/26]	For all designated states Hitachi, Ltd. 6, Kanda Surugadai 4-chome Chiyoda-ku Tokyo 101 / JP
	For all designated states HITACHI HARAMACHI ELECTRONICS CO., LTD. 3-10-2 Benten-cho Hitachi-shi Ibaraki 317 / JP
Former [1996/15]	For all designated states HITACHI, LTD. 6, Kanda Surugadai 4-chome Chiyoda-ku, Tokyo 101 / JP
	For all designated states HITACHI HARAMACHI ELECTRONICS CO., LTD. 3-10-2 Benten-cho Hitachi-shi, Ibaraki 317 / JP
Inventor(s)	01 / Yamada, Kazuji 8-32, Moriyama-cho 3-chome Hitachi-shi, Ibaraki 316 / JP
	02 / Tanaka, Akira Izumigamori-ryo, 20-1, Mizuki-cho 2-chome Hitachi-shi, Ibaraki 316 / JP
	03 / Saito, Ryuichi 42-67, Ishinazaka-cho 1-chome Hitachi-shi, Ibaraki 319-12 / JP
	04 / Kurihara, Yasutoshi 1181-72, Higashiishikawa Hitachinaka-shi, Ibaraki 312 / JP
	05 / Kushima, Tadao 640-127, Suwama, Tokai-mura Naka-gun, Ibaraki 319-11 / JP
	06 / Haramaki, Takashi 2118-77, Muramatsu, Tokai-mura Naka-gun, Ibaraki 319-11 / JP
	07 / Koike, Yoshihiko 19-1-403, Ishinazaka-cho 1-chome Hitachi-shi, Ibaraki 319-12 / JP
	08 / Hosokawa, Takashi Sieshin-ryo, 19-1 Jyosuihon-cho 5-chome Kodaira-shi, Tokyo 187 / JP
	09 / Sawahata, Mamoru 12-20, Ookubo-cho 2-chome Hitachi-shi, Ibaraki 316 / JP
	10 / Koizumi, Masahiro 12-2, Mikanohara-cho 2-chome Hitachi-shi, Ibaraki 316 / JP
	11 / Onuki, Jin 6-1, Kuji-cho 1-chome Hitachi-shi, Ibaraki 319-12 / JP
	12 / Suzuki, Kazuhiro 3-3-11-601, Sannomaru Mito-shi, Ibaraki 310 / JP
	13 / Kobayashi, Isao 3909, Iida, Naka-machi Naka-gun, Ibaraki 311-01 / JP
	14 / Shimizu, Hideo Kouwa-ryo, 8-18, Kokubu-cho 3-chome Hitachi-shi, Ibaraki 316 / JP
	15 / Higashimura, Yutaka 34-8, Tajiri-cho 1-chome Hitachi-shi, Ibaraki 316 / JP
	16 / Sekine, Shigeki 4-16, Suehiro-cho 2-chome Hitachi-shi, Ibaraki 316 / JP
	17 / Koike, Nobuya 296-202, Kaminakaimachi Takasaki-shi, Gunma 370 / JP
	18 / Kokubun, Hideya 769, Kamikimida Takahagi-shi, Ibaraki 318-01 / JP
	[1996/15]
Representative(s)	Hackney, Nigel John, et al Mewburn Ellis LLP City Tower 40 Basinghall Street London EC2V 5DE / GB
	[N/P]
Former [1996/15]	Hackney, Nigel John, et al Mewburn Ellis, York House, 23 Kingsway London WC2B 6HP / GB
Application number, filing date	95307054.7	04.10.1995
	[1996/15]
Priority number, date	JP19940243654	07.10.1994 Original published format: JP 24365494
	JP19940326633	28.12.1994 Original published format: JP 32663394
	JP19940326640	28.12.1994 Original published format: JP 32664094
	JP19950002818	11.01.1995 Original published format: JP 281895
	[1996/15]
Filing language	EN
Procedural language	EN
Publication	Type:	A2 Application without search report
	No.:	EP0706221
	Date:	10.04.1996
	Language:	EN
	[1996/15]
	Type:	A3 Search report
	No.:	EP0706221
	Date:	05.11.1997
	[1997/45]
	Type:	B1 Patent specification
	No.:	EP0706221
	Date:	25.06.2008
	Language:	EN
	[2008/26]
	Type:	B8 Corrected title page of specification
	No.:	EP0706221
	Date:	03.09.2008
	[2008/36]
Search report(s)	(Supplementary) European search report - dispatched on:	EP	22.09.1997
Classification	IPC:	H01L25/07, H01L23/495, H01L23/373	[1997/33]
	CPC:	H01L23/49562 (EP,US); H01L29/70 (KR); H01L23/049 (EP,US); H01L25/0655 (EP,US); H01L25/072 (EP,US); H01L25/18 (EP,US); (+) H02M7/003 (EP,US); H01L2224/32225 (EP,US); H01L2224/45015 (EP,US); H01L2224/451 (EP,US); H01L2224/48011 (EP,US); H01L2224/48091 (EP,US); H01L2224/48227 (EP,US); H01L2224/48472 (EP,US); H01L2224/49111 (EP,US); H01L2224/49113 (EP,US); H01L2224/49171 (EP,US); H01L2224/49431 (EP,US); H01L2224/73265 (EP,US); H01L24/45 (EP,US); H01L24/48 (EP,US); H01L24/49 (EP,US); H01L2924/00014 (EP,US); H01L2924/01005 (EP,US); H01L2924/01006 (EP,US); H01L2924/01014 (EP,US); H01L2924/01019 (EP,US); H01L2924/01022 (EP,US); H01L2924/01028 (EP,US); H01L2924/01029 (EP,US); H01L2924/01039 (EP,US); H01L2924/01041 (EP,US); H01L2924/01042 (EP,US); H01L2924/01047 (EP,US); H01L2924/0105 (EP,US); H01L2924/01061 (EP,US); H01L2924/01074 (EP,US); H01L2924/01078 (EP,US); H01L2924/01079 (EP,US); H01L2924/01322 (EP,US); H01L2924/014 (EP,US); H01L2924/1301 (EP,US); H01L2924/1305 (EP,US); H01L2924/13055 (EP,US); H01L2924/13091 (EP,US); H01L2924/15787 (EP,US); H01L2924/181 (EP,US); H01L2924/19043 (EP,US); H01L2924/2076 (EP,US); H01L2924/30105 (EP,US); H01L2924/30107 (EP,US); H01L2924/3025 (EP,US); H01L2924/351 (EP,US) (-)
	C-Set:	H01L2224/45015, H01L2924/2076 (US,EP); H01L2224/451, H01L2924/00 (US,EP); H01L2224/451, H01L2924/00014 (EP,US); H01L2224/48091, H01L2924/00014 (US,EP); (+) H01L2224/48472, H01L2224/48091, H01L2924/00 (US,EP); H01L2224/48472, H01L2224/48227, H01L2924/00 (US,EP); H01L2224/49111, H01L2224/48227, H01L2924/00012 (US,EP); H01L2224/49111, H01L2224/48472, H01L2924/00 (US,EP); H01L2224/49171, H01L2224/48227, H01L2924/00 (US,EP); H01L2224/49171, H01L2224/48472, H01L2924/00 (US,EP); H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00 (US,EP); H01L2924/00014, H01L2224/05599 (EP,US); H01L2924/1301, H01L2924/00 (EP,US); H01L2924/1305, H01L2924/00 (EP,US); H01L2924/13091, H01L2924/00 (EP,US); H01L2924/15787, H01L2924/00 (US,EP); H01L2924/181, H01L2924/00 (EP,US); H01L2924/351, H01L2924/00 (US,EP) (-)
	Former IPC [1996/15]	H01L25/07, H01L23/495
Designated contracting states	DE, FR, GB [1996/15]
Title	German:	Halbleiteranordnung mit einer Mehrzahl von Halbleiterelementen	[1996/15]
	English:	Semiconductor device comprising a plurality of semiconductor elements	[1996/15]
	French:	Dispositif semi-conducteur comprenant une pluralité d'éléments semi-conducteurs	[1996/15]
Examination procedure	24.10.1995	Examination requested [1996/15]
	20.01.2000	Despatch of a communication from the examining division (Time limit: M06)
	03.07.2000	Reply to a communication from the examining division
	25.09.2002	Despatch of a communication from the examining division (Time limit: M06)
	04.04.2003	Reply to a communication from the examining division
	09.02.2006	Despatch of a communication from the examining division (Time limit: M06)
	18.08.2006	Reply to a communication from the examining division
	04.07.2007	Despatch of a communication from the examining division (Time limit: M04)
	14.11.2007	Reply to a communication from the examining division
	03.01.2008	Communication of intention to grant the patent
	07.05.2008	Fee for grant paid
	07.05.2008	Fee for publishing/printing paid
Opposition(s)	26.03.2009	No opposition filed within time limit [2009/23]
Fees paid	Renewal fee
	21.10.1997	Renewal fee patent year 03
	21.10.1998	Renewal fee patent year 04
	22.10.1999	Renewal fee patent year 05
	25.10.2000	Renewal fee patent year 06
	23.10.2001	Renewal fee patent year 07
	22.10.2002	Renewal fee patent year 08
	22.10.2003	Renewal fee patent year 09
	22.10.2004	Renewal fee patent year 10
	24.10.2005	Renewal fee patent year 11
	24.10.2006	Renewal fee patent year 12
	23.10.2007	Renewal fee patent year 13
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:	Search	[Y]JPS5931044 ;
		[PYA]JPH06334070 ;
		[Y]JPS6254944 ;
		[Y]JPS62160746 ;
		[A]JPH065730 ;
		[A]JPH03177385 ;
		[A]US4278990 (FICHOT JULIE Y) [A] 25-29 * the whole document *;
		[AX]EP0277546 (SIEMENS AG [DE]) [A] 31 * the whole document * * figure 1 * [X] 33;
		[A]EP0459283 (TELEFUNKEN SYSTEMTECHNIK [DE]) [A] 1,25,29,30 * the whole document *;
		[XA]EP0468475 (TOSHIBA KK [JP]) [X] 25-27,29 * column 2, line 57 - column 3, line 27; figures 2A,2B,2C,4 * [A] 28;
		[A]EP0546731 (FUJI ELECTRIC CO LTD [JP]) [A] * the whole document *;
		[A]EP0553981 (GEN ELECTRIC [US]) [A] 31 * the whole document *;
		[A]DE4330070 (HITACHI LTD [JP]) [A] 1 * the whole document *;
		[A]EP0588094 (TOSHIBA KK [JP]) [A] 31 * the whole document *;
		[AX]EP0609528 (MOTOROLA INC [US]) [A] 31 * the whole document * * figure 2 * [X] 33;
		[PA] - TANAKA A ET AL, "2000V 500A HIGH POWER IGBT MODULE", PROCEEDINGS OF THE 7TH. INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND IC'S. (ISPSD), YOKOHAMA, MAY 23 - 25, 1995, INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS, (19950523), no. SYMP. 7, pages 80 - 83, XP000594244 [PA] 1,2,14 * the whole document * * page 81, column R - page 82, column R; figure 3 * DOI: http://dx.doi.org/10.1109/ISPSD.1995.515013
		[AY] - BAYERER R ET AL, "LEISTUNGSHALBLEITERMODULE IN DIREKT-BONDING-TECHNIK", TECHNISCHE RUNDSCHAU TRANSFER, (19880805), vol. 80, no. 32, pages 38 - 41, 43, 45, XP000110807 [A] 1,25,29,30 * the whole document * * figure 2 * * figure 1 * [Y] 14
		[A] - NGON BINH NGUYEN, "USING ADVANCED SUBSTRATE MATERIALS WITH HYBRID PACKAGING TECHNIQUES FOR ULTRAHIGH-POWER ICS", SOLID STATE TECHNOLOGY, (19930201), vol. 36, no. 2, page 59, 60, 62, XP000343999 [A] 1,25,29,30 * the whole document *
		[Y] - PATENT ABSTRACTS OF JAPAN, (19840605), vol. 008, no. 119, Database accession no. (E - 248), & JP59031044 A 19840218 (MITSUBISHI DENKI KK) [Y] 14 * abstract *
		[PYA] - PATENT ABSTRACTS OF JAPAN, (19950428), vol. 095, no. 003, & JP06334070 A 19941202 (SANYO ELECTRIC CO LTD) [PY] 14 * abstract * [A] 2,11-13,22,23,41
		[Y] - PATENT ABSTRACTS OF JAPAN, (19870808), vol. 011, no. 244, Database accession no. (E - 530), & JP62054944 A 19870310 (MITSUBISHI ELECTRIC CORP) [Y] 14 * abstract *
		[Y] - PATENT ABSTRACTS OF JAPAN, (19871226), vol. 011, no. 400, Database accession no. (E - 569), & JP62160746 A 19870716 (FUJI ELECTRIC CO LTD) [Y] 14 * abstract *
		[A] - PATENT ABSTRACTS OF JAPAN, (19940407), vol. 018, no. 199, Database accession no. (E - 1534), & JP06005730 A 19940114 (MITSUBISHI MATERIALS CORP) [A] 30 * abstract *
		[A] - PATENT ABSTRACTS OF JAPAN, (19911029), vol. 015, no. 425, Database accession no. (C - 0879), & JP03177385 A 19910801 (KAWASAKI STEEL CORP) [A] 30 * abstract *
	Examination	EP0309920

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