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Extract from the Register of European Patents

EP About this file: EP0712160

EP0712160 - Leadframe with steps, semiconductor device incorporating such a leadframe, and methd for the manufacture of such a leadframe [Right-click to bookmark this link]
Former [1996/20]Improvements in or relating to semiconductor devices
[2001/40]
StatusNo opposition filed within time limit
Status updated on  02.08.2003
Database last updated on 24.04.2024
Most recent event   Tooltip04.01.2008Lapse of the patent in a contracting state
New state(s): IT
published on 06.02.2008  [2008/06]
Applicant(s)For all designated states
Texas Instruments Incorporated
13500 North Central Expressway
Dallas, Texas 75265 / US
[N/P]
Former [1996/20]For all designated states
TEXAS INSTRUMENTS INCORPORATED
13500 North Central Expressway
Dallas Texas 75265 / US
Inventor(s)01 / Carter, Buford H., Jr.
902 Pinecrest Drive
Richardson, Texas 75080 / US
02 / Davis, Dennis D.
2106 Mars Drive
Garland, Texas 75040 / US
03 / Kee, David R.
1513 Ambleside
Richardson, Texas 75040 / US
04 / Clark, Jesse
1115 McArthur Drive, Apt. No. 3603
Richardson, Texas 75007 / US
05 / Laverde, Steven P.
16206 Fallkirk Drive
Dallas, Texas 75234 / US
06 / Tran, Hai
11480 Audelia, Apt. No. 133
Dallas, Texas 75243 / US
[1996/20]
Representative(s)Darby, David Thomas, et al
Abel & Imray, 20 Red Lion Street
London WC1R 4PQ / GB
[N/P]
Former [1996/20]Darby, David Thomas, et al
Abel & Imray Northumberland House 303-306 High Holborn
London WC1V 7LH / GB
Application number, filing date95308085.013.11.1995
[1996/20]
Priority number, dateUS1994033779814.11.1994         Original published format: US 337798
[1996/20]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0712160
Date:15.05.1996
Language:EN
[1996/20]
Type: A3 Search report 
No.:EP0712160
Date:01.04.1998
[1998/14]
Type: B1 Patent specification 
No.:EP0712160
Date:25.09.2002
Language:EN
[2002/39]
Search report(s)(Supplementary) European search report - dispatched on:EP12.02.1998
ClassificationIPC:H01L23/495
[1996/20]
CPC:
H05K1/0206 (EP,US); H01L23/495 (KR); H01L23/49503 (EP,US);
H01L23/49551 (EP,US); H01L2224/06165 (EP,US); H01L2224/32245 (EP,US);
H01L2224/32257 (EP,US); H01L2224/48091 (EP,US); H01L2224/48247 (EP,US);
H01L2224/73265 (EP,US); H01L24/48 (EP,US); H01L2924/00014 (EP,US);
H01L2924/14 (EP,US); H01L2924/1532 (EP,US); H01L2924/181 (EP,US);
H01L2924/3025 (EP,US); H05K1/0204 (EP,US); H05K2201/066 (EP,US);
H05K2201/09781 (EP,US); H05K2201/10416 (EP,US); H05K2201/10689 (EP,US);
H05K2201/10969 (EP,US); H05K3/341 (EP,US) (-)
C-Set:
H01L2224/48091, H01L2924/00014 (EP,US);
H01L2224/73265, H01L2224/32245, H01L2224/48247, H01L2924/00 (US,EP);
H01L2924/00014, H01L2224/05599 (US,EP);
H01L2924/00014, H01L2224/45099 (US,EP);
H01L2924/14, H01L2924/00 (EP,US);
H01L2924/181, H01L2924/00012 (EP,US)
(-)
Designated contracting statesDE,   FR,   GB,   IT,   NL [1996/20]
TitleGerman:Leiterrahmen mit Stufen, Halbleiterbaulelement und Herstellungsmethode[2001/40]
English:Leadframe with steps, semiconductor device incorporating such a leadframe, and methd for the manufacture of such a leadframe[2001/40]
French:Cadre de connexion avec des pas, dispositf à semi-conducteurs et méthode de fabrication[2001/40]
Former [1996/20]Verbesserungen in oder in Beziehung zu integrierten Schaltungen
Former [1996/20]Improvements in or relating to semiconductor devices
Former [1996/20]Améliorations dans ou relatives à des circuits intégrés
Examination procedure08.09.1998Examination requested  [1998/45]
09.12.1999Despatch of a communication from the examining division (Time limit: M06)
13.07.2000Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time
22.09.2000Reply to a communication from the examining division
25.09.2001Despatch of communication of intention to grant (Approval: Yes)
04.04.2002Communication of intention to grant the patent
12.07.2002Fee for grant paid
12.07.2002Fee for publishing/printing paid
Opposition(s)26.06.2003No opposition filed within time limit [2003/38]
Request for further processing for:25.09.2000Request for further processing filed
20.09.2000Full payment received (date of receipt of payment)
Request granted
17.10.2000Decision despatched
Fees paidRenewal fee
10.11.1997Renewal fee patent year 03
10.11.1998Renewal fee patent year 04
12.11.1999Renewal fee patent year 05
27.02.2001Renewal fee patent year 06
12.02.2002Renewal fee patent year 07
Penalty fee
Additional fee for renewal fee
30.11.200006   M06   Fee paid on   27.02.2001
30.11.200107   M06   Fee paid on   12.02.2002
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Patent Court
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipIT25.09.2002
NL25.09.2002
[2008/06]
Former [2003/30]NL25.09.2002
Documents cited:Search[XY]JPH0661408  ;
 [X]JPH0529529  ;
 [Y]JPS5558557  ;
 [X]US5252783  (BAIRD JOHN [US]) [X] 1,2,4-8,10,15,16,19 * the whole document *
 [XY]  - PATENT ABSTRACTS OF JAPAN, (19940608), vol. 018, no. 299, Database accession no. (E - 1558), & JP06061408 A 19940304 (ROHM CO LTD) [X] 1,2,4-8,10-12,15-19 * the whole document * [Y] 9,14
 [X]  - PATENT ABSTRACTS OF JAPAN, (19930615), vol. 017, no. 313, Database accession no. (E - 1381), & JP05029529 A 19930205 (MATSUSHITA ELECTRON CORP) [X] 1,2,4-8,10,15,16,19 * abstract *
 [Y]  - PATENT ABSTRACTS OF JAPAN, (19800628), vol. 004, no. 091, Database accession no. (E - 017), & JP55058557 A 19800501 (HITACHI LTD) [Y] 9,14 * the whole document *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.