EP0720211 - Novel tungsten deposition process [Right-click to bookmark this link] | Status | The application has been withdrawn Status updated on 07.11.1997 Database last updated on 16.07.2024 | Most recent event Tooltip | 07.11.1997 | Withdrawal of application | published on 29.12.1997 [1997/52] | Applicant(s) | For all designated states AT&T Corp. 32 Avenue of the Americas New York, NY 10013-2412 / US | [1996/27] | Inventor(s) | 01 /
Merchant, Sailesh Mansinh 8214 Vineland Oaks Boulevard Orlando, Florida 32835 / US | 02 /
Nanda, Arun Kumar 9400 Caracas Drive Austin, Texas 78733 / US | 03 /
Roy, Pradip Kumar 7706 Hidden Ivey Court Orlando, Florida 32819 / US | [1996/27] | Representative(s) | Johnston, Kenneth Graham, et al Lucent Technologies EUR-IP UK Ltd Unit 18, Core 3 Workzone Innova Business Park Electric Avenue Enfield, EN3 7XB / GB | [N/P] |
Former [1996/27] | Johnston, Kenneth Graham, et al Lucent Technologies (UK) Ltd, 5 Mornington Road Woodford Green Essex, IG8 OTU / GB | Application number, filing date | 95309093.3 | 13.12.1995 | [1996/27] | Priority number, date | US19940366529 | 30.12.1994 Original published format: US 366529 | [1996/27] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0720211 | Date: | 03.07.1996 | Language: | EN | [1996/27] | Type: | A3 Search report | No.: | EP0720211 | Date: | 05.03.1997 | [1997/10] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 21.01.1997 | Classification | IPC: | H01L21/768, H01L23/522 | [1997/09] | CPC: |
H01L21/28556 (EP,KR,US);
H01L21/76843 (EP,US);
H01L21/76876 (EP,US);
H01L21/76877 (KR);
H01L21/76879 (EP,US);
H01L21/76897 (KR);
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Former IPC [1996/27] | H01L21/285 | Designated contracting states | DE, ES, FR, GB, IT, NL [1996/27] | Title | German: | Verfahren zur Abscheidung von Wolfram | [1996/27] | English: | Novel tungsten deposition process | [1996/27] | French: | Procédé de débit de tungstène | [1996/27] | Examination procedure | 21.08.1997 | Examination requested [1997/43] | 03.11.1997 | Application withdrawn by applicant [1997/52] |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]JPH05152292 ; | [A]DE4018801 (SAMSUNG ELECTRONICS CO LTD [KR]) [A] 1,6,19,21 * column 1, line 45 - column 2, line 7; figure 3; claim 1 *; | [A]EP0488264 (TOSHIBA KK [JP]) [A] 1* column 3, line 9 - column 3, line 52; figures 2,11,12; claim 1 *; | [A]EP0587401 (INMOS LTD [GB]) [A] 1,2,6,8,11,15,19,21 * column 2, line 47 - column 4, line 58 *; | [A] - TSAI N S ET AL, LAYER-TUNGSTEN AND ITS APPLICATIONS FOR VLSI INTERCONNECTS, INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS, INTERNATIONAL ELECTRON DEVICES MEETING, SAN FRANCISCO, DECEMBER 11 - 14, 1988, NR. 1988, PAGE(S) 462 - 465, (19881211), XP000013962 [A] 1,4,6,7,19,21 * page 462 - page 463; figures 3,8 * | [A] - PATENT ABSTRACTS OF JAPAN, (19930928), vol. 017, no. 538, Database accession no. (E - 1440), & JP05152292 A 19930618 (SONY CORP) [A] 1,2,6,8,11,15,19,21 * abstract * |