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EP0701284
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EP About this file: EP0701284
| EP0701284 - A semiconductor chip kerf clear method and resultant semiconductor chip and electronic module formed from the same [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 30.01.1998 Database last updated on 07.03.2026 | Most recent event Tooltip | 30.01.1998 | Application deemed to be withdrawn | published on 18.03.1998 [1998/12] | Applicant(s) | For all designated states International Business Machines Corporation New Orchard Road Armonk, NY 10504 / US | [N/P] |
| Former [1997/06] | For all designated states International Business Machines Corporation Old Orchard Road Armonk, N.Y. 10504 / US | ||
| Former [1996/11] | For all designated states INTERNATIONAL BUSINESS MACHINES CORPORATION Old Orchard Road Armonk, N.Y. 10504 / US | Inventor(s) | 01 /
Bertin, Claude Louis 33 Pheasant Way South Burlington, Vermont 05403 / US | 02 /
Howel, Wayne John 1460 Hinesburg Road South Burlington, Vermont 05402 / US | 03 /
Beilstein, Kenneth Edward, Jr. 11 Walden Woods Essex Junction, Vermont 05452 / US | 04 /
Daubenspeck, Timothy Harrison 15 Pine Meadow Drive Colchester, Vermont 05446 / US | [1996/11] | Representative(s) | Therias, Philippe Compagnie IBM FRANCE Département de Propriété Intellectuelle 06610 La Gaude / FR | [N/P] |
| Former [1996/11] | Therias, Philippe Compagnie IBM FRANCE, Département de Propriété Intellectuelle F-06610 La Gaude / FR | Application number, filing date | 95480110.6 | 08.08.1995 | [1996/11] | Priority number, date | US19940301290 | 06.09.1994 Original published format: US 301290 | [1996/11] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP0701284 | Date: | 13.03.1996 | Language: | EN | [1996/11] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 06.10.1995 | Classification | IPC: | H01L25/065, H01L21/98 | [1996/11] | CPC: |
H10W90/00 (EP,US);
H10P95/00 (KR);
H10W70/60 (EP,US);
H10W72/834 (EP,US);
H10W90/20 (EP,US);
H10W90/297 (EP,US)
| Designated contracting states | DE, FR, GB [1996/11] | Title | German: | Ein Verfahren vom freigelegten Kerbetyp für Halbleiterchip und resultierender Halbleiterchip und gemäss diesem Verfahren hergestellter elektronischer Modul | [1996/11] | English: | A semiconductor chip kerf clear method and resultant semiconductor chip and electronic module formed from the same | [1996/11] | French: | Un procédé du type à trait de scie libre pour puce semi-conductrice et puce semi-conductrice en résultant et module électronique ainsi fabriqué | [1996/11] | Examination procedure | 27.08.1996 | Examination requested [1996/43] | 13.05.1997 | Despatch of a communication from the examining division (Time limit: M04) | 24.09.1997 | Application deemed to be withdrawn, date of legal effect [1998/12] | 23.10.1997 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [1998/12] | Fees paid | Penalty fee | Additional fee for renewal fee | 31.08.1997 | 03 M06 Not yet paid |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A] "process for producing lateral chip connectors", IBM TECHNICAL DISCLOSURE BULLETIN, vol. 32, no. 3B, August 1989 (1989-08-01), NEW YORK, pages 410 - 411 [A] 1,3,6 * the whole document * |