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Extract from the Register of European Patents

EP About this file: EP0745270

EP0745270 - COMPLIANT ELECTRICALLY CONNECTIVE BUMPS FOR AN ADHESIVE FLIP CHIP INTEGRATED CIRCUIT DEVICE AND METHODS FOR FORMING SAME [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  25.02.2000
Database last updated on 02.09.2024
Most recent event   Tooltip25.02.2000Application deemed to be withdrawnpublished on 12.04.2000 [2000/15]
Applicant(s)For all designated states
MICROELECTRONICS AND COMPUTER TECHNOLOGY CORPORATION
3500 West Balcones Center Drive
Austin, TX 78759-5398 / US
[1996/49]
Inventor(s)01 / NOLAN, Ernest, R.
1204 Robin Trail
Round Rock, TX 78681 / US
02 / DUANE, Diana, Carter
2503 Wildlife Run
Cedar Park, TX 78613 / US
03 / HERDER, Todd, H.
3021 NW Angelica Drive
Corvallis, OR 97330 / US
04 / BISHOP, Thomas, A.
7444 Dallas Drive
Austin, TX 78729 / US
05 / TRAN, Kimcuc, T.
2308 Cedar Branch Drive
Austin, TX 78750 / US
06 / FROEHLICH, Robert, W.
9005 Middlebie Drive
Austin, TX 78750 / US
07 / GERMAN, Randy, L.
8913 Sharpstone
Austin, TX 78717 / US
08 / NELSON, Richard, D.
1500 Cliffside Drive
Austin, TX 78704 / US
09 / LEE, Chung, J.
7908 Brightman Lane
Austin, TX 78733 / US
10 / BREEN, Mark, R.
1602 Garner Avenue
Austin, TX 78704 / US
11 / KESWICK, Kathryn, V.
1807 Collier Street
Austin, TX 78704 / US
[1996/49]
Representative(s)Klunker . Schmitt-Nilson . Hirsch
Patentanwälte
Destouchesstrasse 68
80796 München / DE
[N/P]
Former [1996/49]Klunker . Schmitt-Nilson . Hirsch
Winzererstrasse 106
80797 München / DE
Application number, filing date95910308.613.02.1995
[1996/49]
WO1995US02109
Priority number, dateUS1994019543414.02.1994         Original published format: US 195434
[1996/49]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO9522172
Date:17.08.1995
Language:EN
[1995/35]
Type: A1 Application with search report 
No.:EP0745270
Date:04.12.1996
Language:EN
The application published by WIPO in one of the EPO official languages on 17.08.1995 takes the place of the publication of the European patent application.
[1996/49]
Search report(s)International search report - published on:US17.08.1995
(Supplementary) European search report - dispatched on:EP24.06.1999
ClassificationIPC:H01L21/44, H01L21/441, H01L21/60
[1999/32]
CPC:
H01L24/12 (EP,US); H01L21/563 (EP,US); H01L23/49811 (EP,US);
H01L24/03 (EP,US); H01L24/05 (EP,US); H01L24/11 (EP,US);
H01L24/16 (EP,US); H01L24/48 (EP,US); H01L2224/0231 (EP,US);
H01L2224/03912 (EP,US); H01L2224/0401 (EP,US); H01L2224/04042 (EP,US);
H01L2224/05554 (EP,US); H01L2224/05599 (EP,US); H01L2224/0603 (EP,US);
H01L2224/114 (EP,US); H01L2224/1147 (EP,US); H01L2224/116 (EP,US);
H01L2224/11902 (EP,US); H01L2224/13099 (EP,US); H01L2224/1319 (EP,US);
H01L2224/48091 (EP,US); H01L2224/48465 (EP,US); H01L2224/73203 (EP,US);
H01L2224/85444 (EP,US); H01L2924/00014 (EP,US); H01L2924/01005 (EP,US);
H01L2924/01006 (EP,US); H01L2924/01013 (EP,US); H01L2924/01014 (EP,US);
H01L2924/01015 (EP,US); H01L2924/01019 (EP,US); H01L2924/01022 (EP,US);
H01L2924/01028 (EP,US); H01L2924/01029 (EP,US); H01L2924/0103 (EP,US);
H01L2924/01056 (EP,US); H01L2924/01078 (EP,US); H01L2924/01079 (EP,US);
H01L2924/01327 (EP,US); H01L2924/014 (EP,US); H01L2924/09701 (EP,US);
H01L2924/14 (EP,US); H01L2924/19042 (EP,US); Y10S438/903 (EP,US) (-)
C-Set:
H01L2224/48091, H01L2924/00014 (EP,US);
H01L2224/48465, H01L2224/48091, H01L2924/00 (EP,US);
H01L2924/00014, H01L2224/05599 (US,EP);
H01L2924/00014, H01L2224/45099 (US,EP);
H01L2924/00014, H01L2224/85399 (US,EP)
(-)
Former IPC [1996/49]H01L21/44, H01L21/441
Designated contracting statesDE,   FR,   GB [1996/49]
TitleGerman:WEICHE ELEKTRISCHE VERBINDUNGSHÖCKER FÜR EINEN GEKLEBTEN KOPF-ÜBER-IC UND SEINEHERSTELLUNG[1996/49]
English:COMPLIANT ELECTRICALLY CONNECTIVE BUMPS FOR AN ADHESIVE FLIP CHIP INTEGRATED CIRCUIT DEVICE AND METHODS FOR FORMING SAME[1996/49]
French:BOSSES DE RACCORDEMENT ELECTRIQUE SOUPLES DESTINEES A UN DISPOSITIF A CIRCUIT INTEGRE A PUCES A BOSSES ADHESIVES ET LEURS PROCEDES DE FABRICATION[1996/49]
Entry into regional phase10.09.1996National basic fee paid 
10.09.1996Search fee paid 
10.09.1996Designation fee(s) paid 
10.09.1996Examination fee paid 
Examination procedure13.09.1995Request for preliminary examination filed
International Preliminary Examining Authority: US
10.09.1996Examination requested  [1996/49]
01.09.1999Application deemed to be withdrawn, date of legal effect  [2000/15]
06.10.1999Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time  [2000/15]
Fees paidRenewal fee
24.02.1997Renewal fee patent year 03
26.02.1998Renewal fee patent year 04
Penalty fee
Additional fee for renewal fee
28.02.199905   M06   Not yet paid
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[XY]JPH03101234  ;
 [XY]EP0295914  (HEWLETT PACKARD CO [US]) [X] 1,2,6,7 * column 5, line 16 - column 9, line 23; figures 1-3 * [Y] 10;
 [X]JPH05243231  (MATSUSHITA ELECTRIC IND CO LTD) [X] 1,5,7;
 US5477087  [ ] (KAWAKITA TETSUO [JP], et al) [ ] * column 2, line 50 - column 3, line 51 * * column 4, line 44 - column 5, line 45; figures 1,2,5 *
 [XY]  - PATENT ABSTRACTS OF JAPAN, (19910722), vol. 015, no. 288, Database accession no. (E - 1092), & JP03101234 A 19910426 (NEC CORP) [X] 1,4,8 * abstract * [Y] 10
International search[X]US4740700  (SHAHAM YIFAL J [US], et al);
 [A]US5071787  (MORI MIKI [JP], et al);
 [A]US5189502  (GOMI HIDEKI [JP]);
 [A]US5208186  (MATHEW RANJAN J [US]);
 [A]US5223454  (UDA TAKAYUKI [JP], et al);
 [A]US5284797  (HEIM DOROTHY A [US]);
 [AP]US5290732  (KUMAR NALIN [US], et al)
 [Y]  - PROCEEDINGS OF THE 1993 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 9-11 November 1993, Dallas, Texas, J. SIMON et al., "Electroless Bumping for TAB and Flip Chip", pages 439-444.
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.