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EP0748666
European procedure
Extract from the Register of European Patents
EP About this file: EP0748666
| EP0748666 - HIGH-STRENGTH SOLDER ALLOY [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 18.08.2000 Database last updated on 14.06.2024 | Most recent event Tooltip | 18.08.2000 | No opposition filed within time limit | published on 04.10.2000 [2000/40] | Applicant(s) | For all designated states Nihon Almit Co., Ltd. Almit Bldg., 14-2, Yayoicho 2-chome Nakano-ku Tokyo 164-0013 / JP | [N/P] |
| Former [1996/51] | For all designated states Nihon Almit Co., Ltd. Almit Building, 14-2 Yayoichyo 2-chome Nakano-ku Tokyo 164 / JP | Inventor(s) | 01 /
KAWAGUCHI, Toranosuke Nihon Almit Co., Ltd. Almit Building 14-2, Yayoichyo 2-chome Nakano-ku Tokyo 164 / JP | 02 /
HAYASHI, Takayuki Nihon Almit Co., Ltd. Almit Building 14-2, Yayoichyo 2-chome Nakano-ku Tokyo 164 / JP | [1996/51] | Representative(s) | Westman, Per Börje Ingemar Valea AB Lindholmspiren 5 417 56 Gothenburg / SE | [N/P] |
| Former [1996/51] | Westman, P. Börje I. Göteborgs Patentbyra AB Box 5005 402 21 Göteborg / SE | Application number, filing date | 95913322.4 | 23.03.1995 | [1996/51] | WO1995JP00531 | Priority number, date | JP19940154244 | 13.06.1994 Original published format: JP 15424494 | [1996/51] | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO9534401 | Date: | 21.12.1995 | Language: | EN | [1995/54] | Type: | A1 Application with search report | No.: | EP0748666 | Date: | 18.12.1996 | Language: | EN | The application published by WIPO in one of the EPO official languages on 21.12.1995 takes the place of the publication of the European patent application. | [1996/51] | Type: | B1 Patent specification | No.: | EP0748666 | Date: | 20.10.1999 | Language: | EN | [1999/42] | Search report(s) | International search report - published on: | JP | 21.12.1995 | (Supplementary) European search report - dispatched on: | EP | 28.09.1998 | Classification | IPC: | B23K35/26 | [1996/51] | CPC: |
B23K35/268 (EP);
B23K35/26 (KR);
B23K35/262 (EP)
| Designated contracting states | DE, FR, GB, NL, SE [1996/51] | Title | German: | HOCHFESTE LÖTLEGIERUNG | [1996/51] | English: | HIGH-STRENGTH SOLDER ALLOY | [1996/51] | French: | ALLIAGE DE SOUDAGE A HAUTE RESISTANCE | [1996/51] | Entry into regional phase | 23.11.1995 | Translation filed | 23.11.1995 | National basic fee paid | 23.11.1995 | Search fee paid | 23.11.1995 | Designation fee(s) paid | 23.11.1995 | Examination fee paid | Examination procedure | 23.11.1995 | Examination requested [1996/51] | 19.03.1999 | Despatch of communication of intention to grant (Approval: Yes) | 20.04.1999 | Communication of intention to grant the patent | 19.07.1999 | Fee for grant paid | 19.07.1999 | Fee for publishing/printing paid | Opposition(s) | 21.07.2000 | No opposition filed within time limit [2000/40] | Fees paid | Renewal fee | 05.03.1997 | Renewal fee patent year 03 | 24.02.1998 | Renewal fee patent year 04 | 24.03.1999 | Renewal fee patent year 05 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]US2937438 (LEMON LLOYD C) [X] 1 * claim 1 *; | RU1785858 [ ] (ROSTOVSKIJ INZH STR INST [SU]); | [A]US3839023 (ERDMANN JESNITZER F, et al); | [A]GB918807 (EIKASU KINZOKU KOGYO KABUSHIKI) | [X] - ANDRUSHCHENKO, EVGENIJ S. ET AL, "Lead-tin type solder for aluminum alloys without fluxing", CHEMICAL ABSTRACTS, (19940207), vol. 120, no. 6, Database accession no. 60442, XP002077036 [X] 1 * abstract * | International search | [A]JPS63123594 (TOSHIBA CORP); | [A]JPS5524720 (ASAHI GLASS CO LTD); | [A]JPS4521580B |