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Extract from the Register of European Patents

EP About this file: EP0759231

EP0759231 - ENCAPSULATION FOR ELECTRONIC COMPONENTS [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  29.10.1999
Database last updated on 15.06.2024
Most recent event   Tooltip29.10.1999No opposition filed within time limitpublished on 15.12.1999 [1999/50]
Applicant(s)For all designated states
SIEMENS MATSUSHITA COMPONENTS GmbH & CO. KG
Balanstrasse 73, Postfach 80 17 09
81617 München / DE
[1998/52]
Former [1997/09]For all designated states
SIEMENS MATSUSHITA COMPONENTS GmbH & CO KG
Balanstrasse 73, Postfach 80 17 09
81617 München / DE
Inventor(s)01 / FÜRBACHER, Bruno
Regensburger Strasse 191
D-85055 Ingolstadt / DE
02 / LUPP, Friedrich
Antwerpener Strasse 1
D-80805 München / DE
03 / PAHL, Wolfgang
Bavariaring 41
D-80336 München / DE
04 / TRAUSCH, Günter
Feldafinger Strasse 39
D-81477 München / DE
[1997/09]
Representative(s)Epping, Wilhelm, et al
Patentanwalt
Postfach 22 13 17
80503 München / DE
[N/P]
Former [1998/23]Epping, Wilhelm, Dr.-Ing., et al
Patentanwalt Postfach 22 13 17
80503 München / DE
Former [1997/09]Fuchs, Franz-Josef, Dr.-Ing.
Postfach 22 13 17
80503 München / DE
Application number, filing date95918622.202.05.1995
[1997/09]
WO1995EP01658
Priority number, dateDE1994441541102.05.1994         Original published format: DE 4415411
DE1994443256613.09.1994         Original published format: DE 4432566
[1997/09]
Filing languageDE
Procedural languageDE
PublicationType: A1 Application with search report
No.:WO9530276
Date:09.11.1995
Language:DE
[1995/48]
Type: A1 Application with search report 
No.:EP0759231
Date:26.02.1997
Language:DE
The application published by WIPO in one of the EPO official languages on 09.11.1995 takes the place of the publication of the European patent application.
[1997/09]
Type: B1 Patent specification 
No.:EP0759231
Date:23.12.1998
Language:DE
[1998/52]
Search report(s)International search report - published on:EP09.11.1995
ClassificationIPC:H03H9/10
[1997/09]
CPC:
H03H9/1092 (EP,KR,US); H03H9/08 (EP,KR,US); Y10T29/42 (EP,US);
Y10T29/49146 (EP,US)
Designated contracting statesCH,   DE,   FR,   GB,   LI [1997/09]
TitleGerman:VERKAPSELUNG FÜR ELEKTRONISCHE BAUELEMENTE[1997/09]
English:ENCAPSULATION FOR ELECTRONIC COMPONENTS[1997/09]
French:ENCAPSULATION DE COMPOSANTS ELECTRONIQUES[1997/09]
Entry into regional phase22.10.1996National basic fee paid 
22.10.1996Designation fee(s) paid 
22.10.1996Examination fee paid 
Examination procedure25.09.1995Request for preliminary examination filed
International Preliminary Examining Authority: EP
22.10.1996Examination requested  [1997/09]
16.04.1997Despatch of a communication from the examining division (Time limit: M06)
16.10.1997Reply to a communication from the examining division
11.02.1998Despatch of communication of intention to grant (Approval: No)
09.06.1998Despatch of communication of intention to grant (Approval: later approval)
25.06.1998Communication of intention to grant the patent
17.09.1998Fee for grant paid
17.09.1998Fee for publishing/printing paid
Opposition(s)24.09.1999No opposition filed within time limit [1999/50]
Fees paidRenewal fee
20.05.1997Renewal fee patent year 03
19.05.1998Renewal fee patent year 04
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Cited inInternational search[X]GB1512593  (MURATA MANUFACTURING CO [JP]) [X] 1-4,6,13,15 * page 2, column L, line 64 - column R, line 85 * * page 3, column L, line 6 - line 23 * * figures 2,3,10 *;
 [X]EP0367181  (HITACHI LTD [JP]) [X] 1,2 * column 7, line 38 - line 50 *
 [X]  - TAKAHIRO UETA, "MOBILECOM DEMANDS SURFACE-MOUNTABLE CRYSTAL UNITS", JEE JOURNAL OF ELECTRONIC ENGINEERING, (19930501), vol. 30, no. 317, pages 66 - 68, XP000365156 [X] 1,3,11 * figure 1; table 1 *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.