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EP0769209
European procedure
Extract from the Register of European Patents
EP About this file: EP0769209
| EP0769209 - METHOD OF MANUFACTURING THREE-DIMENSIONAL CIRCUITS [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 20.08.2004 Database last updated on 14.05.2024 | Most recent event Tooltip | 05.10.2005 | Change: Appeal number | Applicant(s) | For all designated states Infineon Technologies AG St.-Martin-Strasse 53 81669 München / DE | [2001/46] |
| Former [1997/17] | For all designated states SIEMENS AKTIENGESELLSCHAFT Wittelsbacherplatz 2 80333 München / DE | Inventor(s) | 01 /
HÜBNER, Holger Hamsterweg 10 D-85598 Baldham / DE | [1997/17] | Representative(s) | Kindermann, Peter, et al Patentanwälte Kindermann Postfach 10 02 34 85593 Baldham / DE | [N/P] |
| Former [2001/47] | Kindermann, Peter, Dipl.-Ing., et al Patentanwalt, Postfach 1330 85627 Grasbrunn / DE | ||
| Former [2001/46] | Zedlitz, Peter, Dipl.-Inf., et al Patentanwalt, Postfach 22 13 17 80503 München / DE | Application number, filing date | 95924165.4 | 03.07.1995 | [1997/17] | WO1995DE00857 | Priority number, date | DE19944423566 | 05.07.1994 Original published format: DE 4423566 | [1997/17] | Filing language | DE | Procedural language | DE | Publication | Type: | A1 Application with search report | No.: | WO9601497 | Date: | 18.01.1996 | Language: | DE | [1996/04] | Type: | A1 Application with search report | No.: | EP0769209 | Date: | 23.04.1997 | Language: | DE | The application published by WIPO in one of the EPO official languages on 18.01.1996 takes the place of the publication of the European patent application. | [1997/17] | Type: | B1 Patent specification | No.: | EP0769209 | Date: | 15.10.2003 | Language: | DE | [2003/42] | Search report(s) | International search report - published on: | EP | 18.01.1996 | Classification | IPC: | H01L21/98, H01L25/065 | [1997/17] | CPC: |
H01L24/16 (EP,US);
H01L24/31 (EP,US);
H01L25/0657 (EP,US);
H01L2224/13099 (EP,US);
H01L2225/06513 (EP,US);
H01L2225/06541 (EP,US);
H01L2924/01004 (EP,US);
H01L2924/01006 (EP,US);
H01L2924/0101 (EP,US);
H01L2924/01013 (EP,US);
H01L2924/01023 (EP,US);
H01L2924/01032 (EP,US);
H01L2924/01039 (EP,US);
H01L2924/01049 (EP,US);
H01L2924/01052 (EP,US);
H01L2924/01058 (EP,US);
H01L2924/01068 (EP,US);
H01L2924/01074 (EP,US);
H01L2924/01079 (EP,US);
H01L2924/01082 (EP,US);
H01L2924/0132 (EP,US);
H01L2924/014 (EP,US);
H01L2924/14 (EP,US);
Y10T408/56343 (EP,US);
Y10T408/62 (EP,US)
(-)
| C-Set: |
H01L2924/0132, H01L2924/01049, H01L2924/01079 (EP,US)
| Designated contracting states | DE, FR, GB, IE, IT [1997/17] | Title | German: | VERFAHREN ZUR HERSTELLUNG EINER DREIDIMENSIONALEN SCHALTUNGSANORDNUNG | [1997/17] | English: | METHOD OF MANUFACTURING THREE-DIMENSIONAL CIRCUITS | [1997/17] | French: | PROCEDE DE PRODUCTION D'UNE CIRCUITERIE TRIDIMENSIONNELLE | [1997/17] | Entry into regional phase | 16.12.1996 | National basic fee paid | 16.12.1996 | Designation fee(s) paid | 16.12.1996 | Examination fee paid | Examination procedure | 16.10.1995 | Request for preliminary examination filed International Preliminary Examining Authority: EP | 16.12.1996 | Examination requested [1997/17] | 21.07.1997 | Despatch of a communication from the examining division (Time limit: M04) | 10.10.1997 | Reply to a communication from the examining division | 28.04.1998 | Despatch of communication that the application is refused, reason: substantive examination {1} | 24.01.2003 | Communication of intention to grant the patent | 10.04.2003 | Fee for grant paid | 10.04.2003 | Fee for publishing/printing paid | Appeal following examination | 26.06.1998 | Appeal received No. T0908/98 | 21.08.1998 | Statement of grounds filed | 06.12.2002 | Result of appeal procedure: remittal for grant | Opposition(s) | 16.07.2004 | No opposition filed within time limit [2004/41] | Fees paid | Renewal fee | 21.07.1997 | Renewal fee patent year 03 | 20.07.1998 | Renewal fee patent year 04 | 20.07.1999 | Renewal fee patent year 05 | 17.07.2000 | Renewal fee patent year 06 | 20.07.2001 | Renewal fee patent year 07 | 15.07.2002 | Renewal fee patent year 08 | 19.07.2003 | Renewal fee patent year 09 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Cited in | International search | [YA]EP0531723 (IBM [US]) [Y] 1 * figure 3I; claims 1,3,20 * [A] 6,7; | [YA]EP0238089 (FUJITSU LTD [JP]) [Y] 1 * figure 3; claim 9 * [A] 6,7; | [A]GB1304591 (ARBEITSSTELLE MOLEKULARELEKTRONIK) [A] 1,2,5 * column 2, line 27 - line 30; figure 6 * * column 2, line 56 - line 62 * | [DA] - Y. HAYASHI ET AL., "fabrication of three-dimensional ic using "cumulatively bonded ic" (cubic) technology", 1990 SYMP. VLSI TECHNOLOGY, HONOLULU, (19900604), pages 95 - 96 [DA] 1,3 * figure 1 * |