EP0736225 - METHOD OF ATTACHING INTEGRATED CIRCUIT DIES BY ROLLING ADHESIVES ONTO SEMICONDUCTOR WAFERS [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 18.09.1998 Database last updated on 03.09.2024 | Most recent event Tooltip | 18.09.1998 | Application deemed to be withdrawn | published on 04.11.1998 [1998/45] | Applicant(s) | For all designated states NATIONAL SEMICONDUCTOR CORPORATION 1090 Kifer Road, M/S 16-135 Sunnyvale, CA 94086-3737 / US | [1996/41] | Inventor(s) | 01 /
MOSTAFAZADEH, Shahram 325 Lassenpark Circle San Jose, CA 95136 / US | 02 /
MEKDHANASARN, Boonmi 823 Durshire Way Sunnyvale, CA 94087 / US | 03 /
TAKIAR, Hem, P. 1544 Blackfoot Drive Fremont, CA 94539 / US | [1996/41] | Representative(s) | Bowles, Sharon Margaret, et al BOWLES HORTON Felden House Dower Mews High Street Berkhamsted Hertfordshire HP4 2BL / GB | [N/P] |
Former [1996/41] | Bowles, Sharon Margaret, et al BOWLES HORTON Felden House Dower Mews High Street Berkhamsted Hertfordshire HP4 2BL / GB | Application number, filing date | 95939026.1 | 17.10.1995 | [1996/41] | WO1995US14196 | Priority number, date | US19940326769 | 20.10.1994 Original published format: US 326769 | [1996/41] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO9613066 | Date: | 02.05.1996 | Language: | EN | [1996/20] | Type: | A1 Application with search report | No.: | EP0736225 | Date: | 09.10.1996 | Language: | EN | The application published by WIPO in one of the EPO official languages on 02.05.1996 takes the place of the publication of the European patent application. | [1996/41] | Search report(s) | International search report - published on: | EP | 02.05.1996 | Classification | IPC: | H01L23/495, H01L21/58 | [1996/41] | CPC: |
H01L24/27 (EP);
H01L21/6836 (EP);
H01L23/49513 (EP);
H01L24/32 (EP);
H01L24/83 (EP);
H01L2221/68327 (EP);
H01L2224/274 (EP);
H01L2224/2919 (EP);
H01L2224/32245 (EP);
H01L2224/48091 (EP);
H01L2224/48247 (EP);
H01L2224/49171 (EP);
H01L2224/73265 (EP);
H01L2224/83048 (EP);
H01L2224/83191 (EP);
H01L2224/83855 (EP);
H01L2224/83856 (EP);
H01L2224/8388 (EP);
H01L2224/94 (EP);
H01L24/48 (EP);
H01L24/49 (EP);
H01L2924/00014 (EP);
H01L2924/01005 (EP);
H01L2924/01006 (EP);
H01L2924/01021 (EP);
H01L2924/01033 (EP);
H01L2924/01051 (EP);
H01L2924/01057 (EP);
H01L2924/01082 (EP);
H01L2924/0665 (EP);
| C-Set: |
H01L2224/2919, H01L2924/0665 (EP);
H01L2224/2919, H01L2924/0665, H01L2924/00 (EP);
H01L2224/48091, H01L2924/00014 (EP);
H01L2224/49171, H01L2224/48247, H01L2924/00 (EP);
H01L2224/73265, H01L2224/32245, H01L2224/48247 (EP);
H01L2224/94, H01L2224/27 (EP);
H01L2924/00014, H01L2224/45099 (EP);
H01L2924/0665, H01L2924/00 (EP); | Designated contracting states | DE, FR, GB [1996/41] | Title | German: | VERFAHREN ZUR BEFESTIGUNG VON IC-CHIPS DURCH ABROLLEN VON KLEBSTOFF AUF HALBLEITERWAFER | [1996/41] | English: | METHOD OF ATTACHING INTEGRATED CIRCUIT DIES BY ROLLING ADHESIVES ONTO SEMICONDUCTOR WAFERS | [1996/41] | French: | PROCEDE DE FIXATION DE PUCES DE CIRCUIT INTEGRE CONSISTANT A APPLIQUER A L'AIDE D'UN CYLINDRE DES ADHESIFS SUR DES TRANCHES DE SEMI-CONDUCTEURS | [1996/41] | Entry into regional phase | 13.06.1996 | National basic fee paid | 13.06.1996 | Designation fee(s) paid | 13.06.1996 | Examination fee paid | Examination procedure | 13.06.1996 | Examination requested [1996/41] | 04.05.1998 | Application deemed to be withdrawn, date of legal effect [1998/45] | 05.06.1998 | Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time [1998/45] | Fees paid | Penalty fee | Additional fee for renewal fee | 31.10.1997 | 03   M06   Not yet paid |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Cited in | International search | [PA]US5362354 (OKURA HIROYUKI [JP], et al) [PA] 1,16 * the whole document *; | [YA]US5348611 (LAURENT EDWARD T [US], et al) [Y] 1,3,10,11,15,16,19,21 * the whole document * [A] 22; | [XY]EP0253444 (NAT STARCH CHEM CORP [US]) [X] 22-24 * the whole document * [Y] 1,3,10,11,15,16,19,21; | [XA]JPH01272125 ; | [XA]JPS5984532 ; | [A]US3600246 (BREEN JOSEPH) [A] 1,10,11,16,21,22,24 * the whole document * | [XA] - PATENT ABSTRACTS OF JAPAN, (19900124), vol. 014, no. 038, Database accession no. (E - 878), & JP01272125 A 19891031 (NITTO DENKO CORP) [X] 22,23 * abstract * [A] 1,5,10,16 | [XA] - PATENT ABSTRACTS OF JAPAN, (19840911), vol. 008, no. 198, Database accession no. (E - 265), & JP59084532 A 19840516 (HITACHI SEISAKUSHO KK;OTHERS: 01) [X] 22,23 * abstract * [A] 1,5,10,16 |