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Extract from the Register of European Patents

EP About this file: EP0736225

EP0736225 - METHOD OF ATTACHING INTEGRATED CIRCUIT DIES BY ROLLING ADHESIVES ONTO SEMICONDUCTOR WAFERS [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  18.09.1998
Database last updated on 03.09.2024
Most recent event   Tooltip18.09.1998Application deemed to be withdrawnpublished on 04.11.1998 [1998/45]
Applicant(s)For all designated states
NATIONAL SEMICONDUCTOR CORPORATION
1090 Kifer Road, M/S 16-135
Sunnyvale, CA 94086-3737 / US
[1996/41]
Inventor(s)01 / MOSTAFAZADEH, Shahram
325 Lassenpark Circle
San Jose, CA 95136 / US
02 / MEKDHANASARN, Boonmi
823 Durshire Way
Sunnyvale, CA 94087 / US
03 / TAKIAR, Hem, P.
1544 Blackfoot Drive
Fremont, CA 94539 / US
[1996/41]
Representative(s)Bowles, Sharon Margaret, et al
BOWLES HORTON
Felden House
Dower Mews
High Street
Berkhamsted Hertfordshire HP4 2BL / GB
[N/P]
Former [1996/41]Bowles, Sharon Margaret, et al
BOWLES HORTON Felden House Dower Mews High Street
Berkhamsted Hertfordshire HP4 2BL / GB
Application number, filing date95939026.117.10.1995
[1996/41]
WO1995US14196
Priority number, dateUS1994032676920.10.1994         Original published format: US 326769
[1996/41]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO9613066
Date:02.05.1996
Language:EN
[1996/20]
Type: A1 Application with search report 
No.:EP0736225
Date:09.10.1996
Language:EN
The application published by WIPO in one of the EPO official languages on 02.05.1996 takes the place of the publication of the European patent application.
[1996/41]
Search report(s)International search report - published on:EP02.05.1996
ClassificationIPC:H01L23/495, H01L21/58
[1996/41]
CPC:
H01L24/27 (EP); H01L21/6836 (EP); H01L23/49513 (EP);
H01L24/32 (EP); H01L24/83 (EP); H01L2221/68327 (EP);
H01L2224/274 (EP); H01L2224/2919 (EP); H01L2224/32245 (EP);
H01L2224/48091 (EP); H01L2224/48247 (EP); H01L2224/49171 (EP);
H01L2224/73265 (EP); H01L2224/83048 (EP); H01L2224/83191 (EP);
H01L2224/83855 (EP); H01L2224/83856 (EP); H01L2224/8388 (EP);
H01L2224/94 (EP); H01L24/48 (EP); H01L24/49 (EP);
H01L2924/00014 (EP); H01L2924/01005 (EP); H01L2924/01006 (EP);
H01L2924/01021 (EP); H01L2924/01033 (EP); H01L2924/01051 (EP);
H01L2924/01057 (EP); H01L2924/01082 (EP); H01L2924/0665 (EP);
H01L2924/07802 (EP); H01L2924/14 (EP); H01L2924/181 (EP) (-)
C-Set:
H01L2224/2919, H01L2924/0665 (EP);
H01L2224/2919, H01L2924/0665, H01L2924/00 (EP);
H01L2224/48091, H01L2924/00014 (EP);
H01L2224/49171, H01L2224/48247, H01L2924/00 (EP);
H01L2224/73265, H01L2224/32245, H01L2224/48247 (EP);
H01L2224/94, H01L2224/27 (EP);
H01L2924/00014, H01L2224/45099 (EP);
H01L2924/0665, H01L2924/00 (EP);
H01L2924/181, H01L2924/00012 (EP)
(-)
Designated contracting statesDE,   FR,   GB [1996/41]
TitleGerman:VERFAHREN ZUR BEFESTIGUNG VON IC-CHIPS DURCH ABROLLEN VON KLEBSTOFF AUF HALBLEITERWAFER[1996/41]
English:METHOD OF ATTACHING INTEGRATED CIRCUIT DIES BY ROLLING ADHESIVES ONTO SEMICONDUCTOR WAFERS[1996/41]
French:PROCEDE DE FIXATION DE PUCES DE CIRCUIT INTEGRE CONSISTANT A APPLIQUER A L'AIDE D'UN CYLINDRE DES ADHESIFS SUR DES TRANCHES DE SEMI-CONDUCTEURS[1996/41]
Entry into regional phase13.06.1996National basic fee paid 
13.06.1996Designation fee(s) paid 
13.06.1996Examination fee paid 
Examination procedure13.06.1996Examination requested  [1996/41]
04.05.1998Application deemed to be withdrawn, date of legal effect  [1998/45]
05.06.1998Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time  [1998/45]
Fees paidPenalty fee
Additional fee for renewal fee
31.10.199703   M06   Not yet paid
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Cited inInternational search[PA]US5362354  (OKURA HIROYUKI [JP], et al) [PA] 1,16 * the whole document *;
 [YA]US5348611  (LAURENT EDWARD T [US], et al) [Y] 1,3,10,11,15,16,19,21 * the whole document * [A] 22;
 [XY]EP0253444  (NAT STARCH CHEM CORP [US]) [X] 22-24 * the whole document * [Y] 1,3,10,11,15,16,19,21;
 [XA]JPH01272125  ;
 [XA]JPS5984532  ;
 [A]US3600246  (BREEN JOSEPH) [A] 1,10,11,16,21,22,24 * the whole document *
 [XA]  - PATENT ABSTRACTS OF JAPAN, (19900124), vol. 014, no. 038, Database accession no. (E - 878), & JP01272125 A 19891031 (NITTO DENKO CORP) [X] 22,23 * abstract * [A] 1,5,10,16
 [XA]  - PATENT ABSTRACTS OF JAPAN, (19840911), vol. 008, no. 198, Database accession no. (E - 265), & JP59084532 A 19840516 (HITACHI SEISAKUSHO KK;OTHERS: 01) [X] 22,23 * abstract * [A] 1,5,10,16
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.