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Extract from the Register of European Patents

EP About this file: EP0731188

EP0731188 - Apparatus and method for depositing films on substrate via off-axis laser ablation [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  22.06.2001
Database last updated on 03.08.2024
Most recent event   Tooltip22.06.2001No opposition filed within time limitpublished on 08.08.2001 [2001/32]
Applicant(s)For all designated states
SUMITOMO ELECTRIC INDUSTRIES, LTD
5-33, Kitahama 4-chome, Chuo-ku Osaka-shi
Osaka-fu 541 / JP
[N/P]
Former [1996/37]For all designated states
SUMITOMO ELECTRIC INDUSTRIES, LTD
5-33, Kitahama 4-chome, Chuo-ku
Osaka-shi, Osaka-fu 541 / JP
Inventor(s)01 / Itozaki, Hideo
c/o Sumitomo El. Ind., Ltd., 1-1, Koyakita 1-chome
Itami-shi, Hyogo 664 / JP
02 / Nagaishi, Tatsuoki
c/o Sumitomo El. Ind., Ltd., 1-1, Koyakita 1-chome
Itami-shi, Hyogo 664 / JP
[1996/37]
Representative(s)von Fischern, Bernhard, et al
Hoffmann - Eitle
Patent- und Rechtsanwälte
Arabellastrasse 4
81925 München / DE
[N/P]
Former [1996/37]Ritter und Edler von Fischern, Bernhard, Dipl.-Ing., et al
Hoffmann, Eitle & Partner, Patentanwälte, Arabellastrasse 4
81925 München / DE
Application number, filing date96103558.107.03.1996
[1996/37]
Priority number, dateJP1995007442207.03.1995         Original published format: JP 7442295
[1996/37]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0731188
Date:11.09.1996
Language:EN
[1996/37]
Type: A3 Search report 
No.:EP0731188
Date:26.02.1997
[1997/09]
Type: B1 Patent specification 
No.:EP0731188
Date:23.08.2000
Language:EN
[2000/34]
Search report(s)(Supplementary) European search report - dispatched on:EP10.01.1997
ClassificationIPC:C23C14/28, C23C14/24
[1996/37]
CPC:
C23C14/28 (EP,US); H10N60/0521 (EP,US)
Designated contracting statesDE,   FR,   GB,   IT,   NL [1996/37]
TitleGerman:Vorrichtung und Verfahren zur Ablagerung von Filmen auf ein Substrat durch ausserachsiale Laserablation[1996/37]
English:Apparatus and method for depositing films on substrate via off-axis laser ablation[1996/37]
French:Dispositif et procédé pour le dépôt de films sur un substrat par ablation au laser hors d'axe[1996/37]
Examination procedure18.04.1997Examination requested  [1997/26]
02.12.1999Despatch of communication of intention to grant (Approval: Yes)
02.03.2000Communication of intention to grant the patent
05.05.2000Fee for grant paid
05.05.2000Fee for publishing/printing paid
Opposition(s)24.05.2001No opposition filed within time limit [2001/32]
Fees paidRenewal fee
27.03.1998Renewal fee patent year 03
29.03.1999Renewal fee patent year 04
17.03.2000Renewal fee patent year 05
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Documents cited:Search[A]GB2231587  (MITSUBISHI ELECTRIC CORP [JP]);
 [A]WO9213113  (EUROP COMMUNITIES [LU]);
 [A]WO9401595  (GEN ELECTRIC [US])
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.