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Extract from the Register of European Patents

EP About this file: EP0739034

EP0739034 - Integrated circuit device and fabricating method thereof [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  29.09.2000
Database last updated on 24.04.2024
Most recent event   Tooltip29.08.2008Change - representativepublished on 01.10.2008  [2008/40]
Applicant(s)For all designated states
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, Marunouchi 2-chome Chiyoda-ku
Tokyo 100 / JP
[N/P]
Former [1996/43]For all designated states
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, Marunouchi 2-chome Chiyoda-ku
Tokyo 100 / JP
Inventor(s)01 / Inoue, Akira, c/o Mitsubishi Denki K.K.
2-3, Marunouchi 2-chome, Chiyoda-ku
Tokyo 100 / JP
02 / Goto, Kei, c/o Mitsubishi Denki K.K.
2-3, Marunouchi 2-chome, Chiyoda-ku
Tokyo 100 / JP
03 / Notani, Yoshihiro, c/o Mitsubishi Denki K.K.
2-3, Marunouchi 2-chome, Chiyoda-ku
Tokyo 100 / JP
04 / Nakajima, Yasuharu, c/o Mitsubishi Denki K.K.
2-3, Marunouchi 2-chome, Chiyoda-ku
Tokyo 100 / JP
05 / Matsubayashi, Hiroto, c/o Mitsubishi Denki K.K.
2-3, Marunouchi 2-chome, Chiyoda-ku
Tokyo 100 / JP
06 / Ohta, Yukio, c/o Mitsubishi Denki K.K.
2-3, Marunouchi 2-chome, Chiyoda-ku
Tokyo 100 / JP
[1996/43]
Representative(s)Winter, Brandl - Partnerschaft mbB
Alois-Steinecker-Straße 22
85354 Freising / DE
[N/P]
Former [2008/40]Winter, Brandl, Fürniss, Hübner Röss, Kaiser, Polte Partnerschaft Patent- und Rechtsanwaltskanzlei
Alois-Steinecker-Strasse 22
85354 Freising / DE
Former [1996/43]KUHNEN, WACKER & PARTNER
Alois-Steinecker-Strasse 22
D-85354 Freising / DE
Application number, filing date96104434.420.03.1996
[1996/43]
Priority number, dateJP1995009496320.04.1995         Original published format: JP 9496395
[1996/43]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0739034
Date:23.10.1996
Language:EN
[1996/43]
Type: A3 Search report 
No.:EP0739034
Date:14.07.1999
[1999/28]
Search report(s)(Supplementary) European search report - dispatched on:EP28.05.1999
ClassificationIPC:H01L23/66, H01L23/64, H01L23/498, H01L23/532
[1998/49]
CPC:
H01L24/49 (EP,US); H01L23/66 (EP,US); H01L2223/6644 (EP,US);
H01L2224/45144 (EP,US); H01L2224/48091 (EP,US); H01L2224/49175 (EP,US);
H01L24/45 (EP,US); H01L24/48 (EP,US); H01L2924/00014 (EP,US);
H01L2924/01005 (EP,US); H01L2924/01006 (EP,US); H01L2924/01013 (EP,US);
H01L2924/01014 (EP,US); H01L2924/01047 (EP,US); H01L2924/01079 (EP,US);
H01L2924/10329 (EP,US); H01L2924/12042 (EP,US); H01L2924/1306 (EP,US);
H01L2924/14 (EP,US); H01L2924/19043 (EP,US); H01L2924/19107 (EP,US);
H01L2924/30105 (EP,US); H01L2924/30107 (EP,US); H01L2924/3011 (EP,US);
H01L2924/30111 (EP,US) (-)
C-Set:
H01L2224/45144, H01L2924/00014 (US,EP);
H01L2224/45144, H01L2924/00015 (EP,US);
H01L2224/48091, H01L2924/00014 (US,EP);
H01L2924/00014, H01L2224/05599 (EP,US);
H01L2924/12042, H01L2924/00 (EP,US);
H01L2924/1306, H01L2924/00 (US,EP);
H01L2924/30111, H01L2924/00 (US,EP)
(-)
Former IPC [1996/43]H01L23/66
Designated contracting statesDE,   FR,   GB [1996/43]
TitleGerman:Integriertes Halbleiterschaltkreisbauelement und Herstellungsverfahren[1996/43]
English:Integrated circuit device and fabricating method thereof[1996/43]
French:Dispositif de circuit intégré à semi-conducteur et procédé de fabrication[1996/43]
Examination procedure15.01.2000Application deemed to be withdrawn, date of legal effect  [2000/46]
20.06.2000Despatch of communication that the application is deemed to be withdrawn, reason: examination fee not paid in time  [2000/46]
Fees paidRenewal fee
25.03.1998Renewal fee patent year 03
30.03.1999Renewal fee patent year 04
Penalty fee
Penalty fee Rule 85b EPC 1973
30.03.2000M01   Not yet paid
Additional fee for renewal fee
31.03.200005   M06   Not yet paid
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[A]JPH05226420  ;
 [XA]JPH05235655  ;
 [XA]GB1268175  (HITACHI LTD [JP]) [X] 5,14 * page 2, line 46 - page 3, line 25; figures 1A,,1B * [A] 6,15-17,19;
 [A]EP0169694  (RCA CORP [US]) [A] 7,8,18,19 * the whole document *;
 [A]US4716389  (GAWRONSKI MICHAEL J [US], et al) [A] 7,8,18,19* the whole document *;
 [XA]US4868637  (CLEMENTS JAMES R [US], et al) [X] 1,9 * column 3, line 18 - column 6, line 65; figures 1-6 * [A] 2-4,10-13;
 [A]US5156996  (MILEY DANIEL J [US]) [A] 1-4,9-13 * the whole document *;
 [XA]EP0520434  (HUGHES AIRCRAFT CO [US]) [X] 1,2,9 * column 4, line 30 - column 8, line 26; figures 1-3 * [A] 3,4,10-13;
 [XA]US5237130  (KULESZA FRANK W [US], et al) [X] 1,9 * column 3, line 53 - column 4, line 32; figures 1-5 * [A] 2-4,10-13;
 [A]EP0622840  (NEC CORP [JP]) [A] 5,6,14-17,19 * column 7, line 12 - column 9, line 10; figures 1,2 *;
 [E]EP0736902  (MITSUBISHI ELECTRIC CORP [JP]) [E] 7,8,18,19 * the whole document *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19931210), vol. 017, no. 672, Database accession no. (E - 1474), & JP05226420 A 19930903 (TOPPAN PRINTING CO LTD) [A] 1-4,9-13 * abstract *
 [XA]  - PATENT ABSTRACTS OF JAPAN, (19931217), vol. 017, no. 691, Database accession no. (E - 1479), & JP05235655 A 19930910 (TOSHIBA LIGHTING & TECHNOL CORP) [X] 7,18 * abstract * [A] 8,19
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.