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Extract from the Register of European Patents

EP About this file: EP0740334

EP0740334 - Isotropic silicon etch process that is highly selective to tungsten [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  19.01.2004
Database last updated on 08.10.2024
Most recent event   Tooltip05.06.2009Change - representativepublished on 08.07.2009  [2009/28]
Applicant(s)For all designated states
Infineon Technologies AG
St.-Martin-Strasse 53
81669 München / DE
For all designated states
International Business Machines Corporation
New Orchard Road
Armonk, NY 10504 / US
[N/P]
Former [2003/11]For all designated states
Infineon Technologies AG
St.-Martin-Strasse 53
81669 München / DE
For all designated states
International Business Machines Corporation
Old Orchard Road
Armonk, N.Y. 10504 / US
Former [2003/02]For all designated states
Infineon Technologies AG
St.-Martin-Strasse 53
81669 München / DE
For all designated states
International Business Machines Corporation
Old Orchard Road
Armonk, N.Y. 10504 / US
Former [1996/44]For all designated states
SIEMENS AKTIENGESELLSCHAFT
Wittelsbacherplatz 2
80333 München / DE
For all designated states
International Business Machines Corporation
Old Orchard Road
Armonk, N.Y. 10504 / US
Inventor(s)01 / Eckstein, Elke
20 rue Cassette
75006 Paris / FR
02 / Hoffman, Birgit
#
Deceased / DE
03 / Kiewra, Edward W.
Schuetzenmattstr. 27-B
8802 Kilchberg / CH
04 / Kocon, Waldemar Walter
25 Valley Road
Wappingers Falls, NY 12590 / US
05 / Weiss, Mark Jay
1675 York Avenue, Apt. 28D
New York, NY 10128 / US
[1996/44]
Representative(s)Vigars, Christopher Ian, et al
Haseltine Lake LLP Redcliff Quay 120 Redcliff Street Bristol
BS1 6HU / GB
[2009/28]
Former [2000/47]Vigars, Christopher Ian, et al
Haseltine Lake & Co. Redcliff Quay 120 Redcliff Street
Bristol BS1 6HU / GB
Former [1998/27]Epping, Wilhelm, Dr.-Ing., et al
Patentanwalt Postfach 22 13 17
80503 München / DE
Former [1996/44]Fuchs, Franz-Josef, Dr.-Ing.
Postfach 22 13 17
80503 München / DE
Application number, filing date96105741.111.04.1996
[1996/44]
Priority number, dateUS1995043001127.04.1995         Original published format: US 430011
[1996/44]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0740334
Date:30.10.1996
Language:EN
[1996/44]
Type: A3 Search report 
No.:EP0740334
Date:28.05.1997
[1997/22]
Type: B1 Patent specification 
No.:EP0740334
Date:12.03.2003
Language:EN
[2003/11]
Search report(s)(Supplementary) European search report - dispatched on:EP14.04.1997
ClassificationIPC:H01L21/321, H01L21/311
[1997/19]
CPC:
H01L21/32137 (EP,US); H01L21/306 (KR); Y10S438/963 (EP,US)
Former IPC [1996/44]H01L21/321
Designated contracting statesAT,   DE,   FR,   GB,   IE,   IT,   NL [1996/44]
TitleGerman:Verfahren zum isotropen Ätzen von Silizium, das hochselektiv gegenüber Wolfram ist[1996/44]
English:Isotropic silicon etch process that is highly selective to tungsten[1996/44]
French:Procédé de gravure isotrope - hautement sélectif par rapport au tungstène - de silicium[1996/44]
Examination procedure22.10.1997Examination requested  [1997/51]
30.07.1999Despatch of a communication from the examining division (Time limit: M04)
26.10.1999Reply to a communication from the examining division
28.03.2000Despatch of a communication from the examining division (Time limit: M06)
02.10.2000Reply to a communication from the examining division
30.07.2002Communication of intention to grant the patent
23.12.2002Fee for grant paid
23.12.2002Fee for publishing/printing paid
Opposition(s)15.12.2003No opposition filed within time limit [2004/10]
Fees paidRenewal fee
20.04.1998Renewal fee patent year 03
19.04.1999Renewal fee patent year 04
26.04.2000Renewal fee patent year 05
23.04.2001Renewal fee patent year 06
24.04.2002Renewal fee patent year 07
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Lapses during opposition  TooltipAT12.03.2003
FR12.03.2003
IT12.03.2003
NL12.03.2003
[2008/06]
Former [2006/14]AT12.03.2003
FR12.03.2003
NL12.03.2003
Former [2003/47]AT12.03.2003
NL12.03.2003
Former [2003/41]NL12.03.2003
Documents cited:Search[Y]EP0030798  (HUGHES AIRCRAFT CO [US]);
 [Y]EP0350997  (KONINKL PHILIPS ELECTRONICS NV [NL]);
 [Y]WO9110261  (IBM [US]);
 [Y]US5094712  (BECKER DAVID S [US], et al);
 [A]EP0553961  (APPLIED MATERIALS INC [US])
ExaminationEP0354717
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.