blank Quick help
blank Maintenance news

Scheduled maintenance

Regular maintenance outages:
between 05.00 and 05.15 hrs CET (Monday to Sunday).

Other outages
Availability
Register Forum

2022.02.11

More...
blank News flashes

News Flashes

New version of the European Patent Register – SPC proceedings information in the Unitary Patent Register.

2024-07-24

More...
blank Related links

Extract from the Register of European Patents

EP About this file: EP0759637

EP0759637 - Semiconductor package and mounting method [Right-click to bookmark this link]
StatusThe application has been withdrawn
Status updated on  13.07.2002
Database last updated on 02.09.2024
Most recent event   Tooltip13.07.2002Withdrawal of applicationpublished on 28.08.2002  [2002/35]
Applicant(s)For all designated states
NEC Corporation
7-1, Shiba 5-chome Minato-ku
Tokyo 108-8001 / JP
[N/P]
Former [1997/09]For all designated states
NEC CORPORATION
7-1, Shiba 5-chome Minato-ku
Tokyo / JP
Inventor(s)01 / Itoh, Nobuyuki
c/o NEC Corp., 7-1, Shiba 5-chome, Minato-ku
Tokyo / JP
[1997/09]
Representative(s)Betten & Resch
Patent- und Rechtsanwälte PartGmbB
Postfach 10 02 51
80076 München / DE
[N/P]
Former [1997/09]Betten & Resch
Reichenbachstrasse 19
80469 München / DE
Application number, filing date96111396.615.07.1996
[1997/09]
Priority number, dateJP1995020467210.08.1995         Original published format: JP 20467295
[1997/09]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0759637
Date:26.02.1997
Language:EN
[1997/09]
Type: A3 Search report 
No.:EP0759637
Date:30.09.1998
[1998/40]
Search report(s)(Supplementary) European search report - dispatched on:EP19.08.1998
ClassificationIPC:H01L23/498, H01L21/98, H01L25/10
[1998/41]
CPC:
H01L25/50 (EP,US); H01L25/105 (EP,US); H01L2225/1023 (EP,US);
H01L2225/1058 (EP,US); H01L2225/1082 (EP,US); H01L2924/0002 (EP,US);
H01L2924/15162 (EP,US); H01L2924/15173 (EP,US); H01L2924/3511 (EP,US) (-)
C-Set:
H01L2924/0002, H01L2924/00 (EP,US)
Former IPC [1997/09]H01L23/498
Designated contracting statesDE,   FR,   GB [1997/09]
TitleGerman:Halbleitergehäuse und Montagemethode[1997/09]
English:Semiconductor package and mounting method[1997/09]
French:Boîtier à semi-conducteurs et méthode d'assemblage[1997/09]
Examination procedure21.01.1999Examination requested  [1999/12]
08.07.2002Application withdrawn by applicant  [2002/35]
Fees paidRenewal fee
30.07.1998Renewal fee patent year 03
30.07.1999Renewal fee patent year 04
31.07.2000Renewal fee patent year 05
31.07.2001Renewal fee patent year 06
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court
See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[A]US5006922  (MCSHANE MICHAEL B [US], et al) [A] 1,4,5,7,10 * column 2, lines 5-45; figure 1 *;
 [XA]US5321884  (AMEEN JOSEPH G [US], et al) [X] 1,3 * column 3, lines 7-65 * * column 4, lines 45-60; figure 1 * [A] 2,5,6,9;
 [A]US5397916  (NORMINGTON PETER J C [US]) [A] 1,5,8 * column 8, line 52 - column 9, line 24; figures 15,16 *;
 [X]US5408123  (MURAI TAKASHI [JP]) [X] 1,2 * column 1, lines 40-53; figure 1 * * column 2, lines 42-50 *;
 [A]US5440171  (MIYANO ICHIRO [JP], et al) [A] 1,5,8* column 1, line 48 - column 2, line 40; figure 7 *
by applicantJPS61107675
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.