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Extract from the Register of European Patents

EP About this file: EP0742682

EP0742682 - Low-profile socketed integrated circuit packaging system [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  30.12.2005
Database last updated on 13.04.2024
Most recent event   Tooltip04.01.2008Lapse of the patent in a contracting state
New state(s): IT
published on 06.02.2008  [2008/06]
Applicant(s)For all designated states
STMicroelectronics, Inc.
1310 Electronics Drive Carrollton
Texas 75006-5039 / US
[N/P]
Former [1999/08]For all designated states
STMicroelectronics, Inc.
1310 Electronics Drive
Carrollton Texas 75006-5039 / US
Former [1996/46]For all designated states
SGS-THOMSON MICROELECTRONICS, INC.
1310 Electronics Drive
Carrollton Texas 75006-5039 / US
Inventor(s)01 / Hundt, Michael J.
170 S. Woodland Trail
Double Oak, Texas 75067 / US
02 / Chiu, Anthony M.
2563 Buttercup Drive
Richardson, Texas 75082 / US
[1996/46]
Representative(s)Driver, Virginia Rozanne, et al
Page White & Farrer Limited
Bedford House
21A John Street
London WC1N 2BF / GB
[N/P]
Former [2004/35]Driver, Virginia Rozanne, et al
Page White & Farrer 54 Doughty Street
London WC1N 2LS / GB
Former [1996/46]Palmer, Roger, et al
PAGE, WHITE & FARRER 54 Doughty Street
London WC1N 2LS / GB
Application number, filing date96302902.024.04.1996
[1996/46]
Priority number, dateUS1995044036712.05.1995         Original published format: US 440367
[1996/46]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0742682
Date:13.11.1996
Language:EN
[1996/46]
Type: A3 Search report 
No.:EP0742682
Date:30.07.1997
[1997/31]
Type: B1 Patent specification 
No.:EP0742682
Date:23.02.2005
Language:EN
[2005/08]
Search report(s)(Supplementary) European search report - dispatched on:EP09.06.1997
ClassificationIPC:H05K7/10
[1996/46]
CPC:
H05K7/1069 (EP,US); H01L23/4093 (EP,US); H01L2224/48091 (EP,US);
H01L2224/48227 (EP,US); H01L24/48 (EP,US); H01L2924/00014 (EP,US);
H01L2924/01046 (EP,US); H01L2924/01079 (EP,US); H01L2924/01087 (EP,US);
H01L2924/14 (EP,US); H01L2924/181 (EP,US) (-)
C-Set:
H01L2224/48091, H01L2924/00014 (US,EP);
H01L2924/00014, H01L2224/05599 (US,EP);
H01L2924/00014, H01L2224/45015, H01L2924/207 (EP,US);
H01L2924/00014, H01L2224/45099 (US,EP);
H01L2924/00014, H01L2224/85399 (EP,US);
H01L2924/14, H01L2924/00 (EP,US);
H01L2924/181, H01L2924/00012 (US,EP)
(-)
Designated contracting statesDE,   FR,   GB,   IT [1996/46]
TitleGerman:IC-Packungsfassungssystem mit niedrigem Profil[1996/46]
English:Low-profile socketed integrated circuit packaging system[1996/46]
French:Système de conditionnement pour circuit intégré par socle à profil bas[1996/46]
Examination procedure05.01.1998Examination requested  [1998/11]
05.06.2003Despatch of a communication from the examining division (Time limit: M06)
15.12.2003Reply to a communication from the examining division
15.01.2004Despatch of a communication from the examining division (Time limit: M06)
26.07.2004Reply to a communication from the examining division
30.08.2004Communication of intention to grant the patent
22.12.2004Fee for grant paid
22.12.2004Fee for publishing/printing paid
Opposition(s)24.11.2005No opposition filed within time limit [2006/07]
Fees paidRenewal fee
21.04.1998Renewal fee patent year 03
12.04.1999Renewal fee patent year 04
14.04.2000Renewal fee patent year 05
11.04.2001Renewal fee patent year 06
10.04.2002Renewal fee patent year 07
18.04.2003Renewal fee patent year 08
29.04.2004Renewal fee patent year 09
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipIT23.02.2005
DE24.05.2005
[2008/06]
Former [2006/18]DE24.05.2005
Documents cited:Search[X]US3951495  (DONAHER CHARLES JOSEPH, et al) [X] 1,7 * column 2, line 56 - column 3, line 42; figure 1 *;
 [X]JPS62163351  ;
 [E]JPH08203644  ;
 [A]US4620761  (SMITH BRIAN M [US], et al) [A] 1,7 * figure 9 *;
 [E]JPH08271578  ;
 [A]JPS6381837
 [X]  - PATENT ABSTRACTS OF JAPAN, (19880107), vol. 012, no. 003, Database accession no. (E - 570), & JP62163351 A 19870720 (TOSHIBA CORP) [X] 1-5,7-9,12 * abstract *
 [E]  - PATENT ABSTRACTS OF JAPAN, (19961226), vol. 096, no. 012, & JP08203644 A 00000000 (NHK SPRING CO LTD) [E] 3-5,13,14 * abstract *
 [E]  - PATENT ABSTRACTS OF JAPAN, (19970228), vol. 097, no. 002, & JP08271578 A 00000000 (TOSHIBA CORP) [E] 1,7 * abstract *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19880829), vol. 012, no. 318, Database accession no. (E - 650), & JP63081837 A 19880412 (HONDA TSUSHIN KOGYO KK) [A] 1,7 * abstract *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.