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EP0764704
European procedure
Extract from the Register of European Patents
EP About this file: EP0764704
| EP0764704 - Use of preceramic polymers as electronic adhesives [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 05.01.2001 Database last updated on 13.07.2024 | Most recent event Tooltip | 05.01.2001 | No opposition filed within time limit | published on 21.02.2001 [2001/08] | Applicant(s) | For all designated states Dow Corning Corporation 3901 S. Saginaw Road Midland, Michigan 48686-0994 / US | [N/P] |
| Former [1997/13] | For all designated states DOW CORNING CORPORATION 3901 S. Saginaw Road Midland Michigan 48686-0994 / US | Inventor(s) | 01 /
Bearinger, Clayton R. 2106 Virginia Street Midland, Michigan 48642 / US | 02 /
Camilletti, Robert Charles 5710 Woodberry Court Midland, Michigan 48640 / US | 03 /
Chandra, Grish 5203 Shoal Creek Circle Midland, Michigan 48640 / US | 04 /
Haluska, Loren Andrew 4519 James Drive Midland, Michigan 48640 / US | 05 /
Gentle, Theresa Eileen 710 Oakwood Drive Red Lion, Pennsylvania 17356 / US | [1997/13] | Representative(s) | Kyle, Diana Elkington and Fife LLP Prospect House 8 Pembroke Road Sevenoaks, Kent TN13 1XR / GB | [N/P] |
| Former [1997/13] | Kyle, Diana Elkington and Fife Prospect House 8 Pembroke Road Sevenoaks, Kent TN13 1XR / GB | Application number, filing date | 96306192.4 | 27.08.1996 | [1997/13] | Priority number, date | US19950533217 | 25.09.1995 Original published format: US 533217 | [1997/13] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP0764704 | Date: | 26.03.1997 | Language: | EN | [1997/13] | Type: | B1 Patent specification | No.: | EP0764704 | Date: | 08.03.2000 | Language: | EN | [2000/10] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 17.01.1997 | Classification | IPC: | C09J5/06, C09J183/16, H01L21/58, H01L23/498 | [1997/13] | CPC: |
H01L24/83 (EP,KR,US);
C09J5/06 (EP,KR,US);
C09J5/02 (EP,KR,US);
H01L24/29 (EP,KR,US);
H01L2224/29 (EP,US);
H01L2224/29101 (EP,US);
H01L2224/29287 (EP,US);
H01L2224/29324 (EP,US);
H01L2224/29339 (EP,US);
H01L2224/29344 (EP,US);
H01L2224/29347 (EP,US);
H01L2224/29369 (EP,US);
H01L2224/29386 (EP,US);
H01L2224/29388 (EP,US);
H01L2224/8319 (EP,US);
H01L2224/8385 (EP,US);
H01L2924/00013 (EP,US);
H01L2924/01004 (EP,US);
H01L2924/01005 (EP,US);
H01L2924/01006 (EP,US);
H01L2924/01011 (EP,US);
H01L2924/01013 (EP,US);
H01L2924/01015 (EP,US);
H01L2924/01018 (EP,US);
H01L2924/01023 (EP,US);
H01L2924/01024 (EP,US);
H01L2924/01027 (EP,US);
H01L2924/01029 (EP,US);
H01L2924/01033 (EP,US);
H01L2924/01039 (EP,US);
H01L2924/0104 (EP,US);
H01L2924/01041 (EP,US);
H01L2924/01047 (EP,US);
H01L2924/01073 (EP,US);
H01L2924/01078 (EP,US);
H01L2924/01079 (EP,US);
| C-Set: |
H01L2224/29287, H01L2924/00014 (US,EP);
H01L2224/29324, H01L2924/00014 (US,EP);
H01L2224/29339, H01L2924/00014 (US,EP);
H01L2224/29344, H01L2924/00014 (US,EP);
H01L2224/29347, H01L2924/00014 (US,EP);
H01L2224/29369, H01L2924/00014 (US,EP);
H01L2224/29386, H01L2924/04642, H01L2924/00014 (EP,US);
H01L2224/29386, H01L2924/05032, H01L2924/00014 (US,EP);
H01L2224/29386, H01L2924/05042, H01L2924/00014 (US,EP);
H01L2224/29386, H01L2924/05341, H01L2924/00014 (EP,US);
H01L2224/29386, H01L2924/05432, H01L2924/00014 (US,EP);
H01L2224/29386, H01L2924/05442, H01L2924/00014 (EP,US);
H01L2224/29388, H01L2924/00014 (US,EP);
H01L2924/00013, H01L2224/29099 (US,EP);
H01L2924/00013, H01L2224/29199 (EP,US);
H01L2924/00013, H01L2224/2929 (EP,US); | Designated contracting states | DE, FR, GB, IT, NL [1997/13] | Title | German: | Verwendung von präkeramischen Polymeren als Klebstoffe für Elektronik | [1999/28] | English: | Use of preceramic polymers as electronic adhesives | [1997/13] | French: | Utilisation de polymères précéramiques comme adhésifs pour l'électronique | [1997/13] |
| Former [1997/13] | Verwendung von prekeramischen Polymeren als Klebstoffen für Elektronik | Examination procedure | 23.04.1997 | Examination requested [1997/26] | 10.03.1998 | Despatch of a communication from the examining division (Time limit: M06) | 30.07.1998 | Reply to a communication from the examining division | 01.02.1999 | Despatch of a communication from the examining division (Time limit: M04) | 01.04.1999 | Reply to a communication from the examining division | 21.07.1999 | Despatch of communication of intention to grant (Approval: Yes) | 31.08.1999 | Communication of intention to grant the patent | 03.11.1999 | Fee for grant paid | 03.11.1999 | Fee for publishing/printing paid | Opposition(s) | 09.12.2000 | No opposition filed within time limit [2001/08] | Fees paid | Renewal fee | 26.06.1998 | Renewal fee patent year 03 | 24.06.1999 | Renewal fee patent year 04 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]US4422891 (GONSER DONALD I [US]) [A] 1-9 * claim - *; | [A]US4221826 (BALTRUSHAITIS VALENTINAS B, et al) [A] 1-9 * claim - * |