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Extract from the Register of European Patents

EP About this file: EP0779658

EP0779658 - A heat sink arrangement [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  21.11.2003
Database last updated on 19.07.2024
Most recent event   Tooltip21.11.2003Application deemed to be withdrawnpublished on 07.01.2004  [2004/02]
Applicant(s)For all designated states
Texas Instruments Incorporated
13500 North Central Expressway
Dallas, Texas 75265 / US
[N/P]
Former [1997/25]For all designated states
TEXAS INSTRUMENTS INCORPORATED
13500 North Central Expressway
Dallas Texas 75265 / US
Inventor(s)01 / Edwards, Darwin R
5301 Glen Vista Drive
Garland, TX 75044 / US
[1997/25]
Representative(s)Blanco White, Henry Nicholas, et al
ABEL & IMRAY
20 Red Lion Street
London WC1R 4PQ / GB
[N/P]
Former [1997/25]Blanco White, Henry Nicholas, et al
ABEL & IMRAY Northumberland House 303-306 High Holborn
London WC1V 7LH / GB
Application number, filing date96309134.313.12.1996
[1997/25]
Priority number, dateUS1995000864014.12.1995         Original published format: US 8640
[1997/25]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0779658
Date:18.06.1997
Language:EN
[1997/25]
Type: A3 Search report 
No.:EP0779658
Date:29.07.1998
[1998/31]
Search report(s)(Supplementary) European search report - dispatched on:EP16.06.1998
ClassificationIPC:H01L23/367
[1997/25]
CPC:
H01L23/3672 (EP); H01L23/28 (KR); H01L2924/0002 (EP)
C-Set:
H01L2924/0002, H01L2924/00 (EP)
Designated contracting statesDE,   FR,   GB,   IT,   NL [1997/25]
TitleGerman:Kühlkörper[1997/25]
English:A heat sink arrangement[1997/25]
French:Dissipateur de chaleur[1997/25]
Examination procedure22.01.1999Examination requested  [1999/13]
19.02.2003Despatch of a communication from the examining division (Time limit: M04)
02.07.2003Application deemed to be withdrawn, date of legal effect  [2004/02]
07.08.2003Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [2004/02]
Fees paidRenewal fee
11.12.1998Renewal fee patent year 03
09.12.1999Renewal fee patent year 04
27.02.2001Renewal fee patent year 05
31.05.2002Renewal fee patent year 06
02.01.2003Renewal fee patent year 07
Penalty fee
Additional fee for renewal fee
31.12.200005   M06   Fee paid on   27.02.2001
31.12.200106   M06   Fee paid on   31.05.2002
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Documents cited:Search[XA]GB2204181  (THERMALLOY INC [US]) [X] 1,2,4,5 * page 1, paragraph 3 - page 3, paragraph 1 * * page 6, paragraph 2; figure 2 * [A] 3,6;
 [X]US5367196  (MAHULIKAR DEEPAK [US], et al) [X] 1,5,6 * column 2, line 60 - column 3, line 65; figure 2 *;
 [A]EP0669651  (AT & T CORP [US]) [A] 1-4 * column 5, line 47 - column 6, line 1; figure 10 *
 [A]  - "THERMALLY CONDUCTIVE SUBSTRATE MOUNTED MULTI-CHIP MODULE CAP", IBM TECHNICAL DISCLOSURE BULLETIN, (19930901), vol. 36, no. 9B, page 623/624, XP000397284 [A] 1-3 * Entire article *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.