EP0771607 - An arrangement for laser bonding [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 14.03.2003 Database last updated on 24.08.2024 | Most recent event Tooltip | 14.03.2003 | Application deemed to be withdrawn | published on 02.05.2003 [2003/18] | Applicant(s) | For all designated states AT&T Corp. 32 Avenue of the Americas New York, NY 10013-2412 / US | [1997/19] | Inventor(s) | 01 /
Bergmann, Ernest Eisenhardt 730 Seneca Street Bethlehem, Pennsylvania 18015 / US | [1997/19] | Representative(s) | Perkins, Sarah, et al Stevens Hewlett & Perkins 1 St Augustine's Place Bristol BS1 4UD / GB | [N/P] |
Former [2001/17] | Perkins, Sarah, et al Stevens, Hewlett & Perkins Halton House 20/23 Holborn London EC1N 2JD / GB | ||
Former [1997/19] | Johnston, Kenneth Graham, et al Lucent Technologies (UK) Ltd, 5 Mornington Road Woodford Green Essex, IG8 OTU / GB | Application number, filing date | 97100835.4 | 22.09.1993 | [1997/19] | Priority number, date | US19920955168 | 01.10.1992 Original published format: US 955168 | [1997/19] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0771607 | Date: | 07.05.1997 | Language: | EN | [1997/19] | Type: | A3 Search report | No.: | EP0771607 | Date: | 04.06.1997 | [1997/23] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 15.04.1997 | Classification | IPC: | B23K26/06 | [1997/19] | CPC: |
B23K26/0643 (EP,US);
B23K26/06 (EP,US);
B23K26/064 (EP,US);
B23K26/0648 (EP,US);
B23K26/0665 (EP,US);
B29C65/1635 (EP,US);
B29C65/1638 (EP,US);
B29C65/169 (EP,US);
B29C65/1693 (EP,US);
B29C66/112 (EP,US);
B29C66/1122 (EP,US);
B29C66/131 (EP,US);
B29C66/232 (EP,US);
B29C66/45 (EP,US);
B29C66/30223 (EP,US);
B29C66/43 (EP,US);
B29K2705/00 (EP,US);
B29K2995/0025 (EP,US);
B29K2995/0027 (EP,US)
(-)
| C-Set: |
B29C66/30223, B29C65/00 (EP,US)
| Designated contracting states | DE, FR, GB [1997/19] | Title | German: | Laserverbindungseinrichtung | [1997/19] | English: | An arrangement for laser bonding | [1997/19] | French: | Un arrangement pour joindre au laser | [1997/19] | Examination procedure | 29.01.1997 | Examination requested [1997/19] | 14.12.2000 | Despatch of a communication from the examining division (Time limit: M04) | 19.04.2001 | Reply to a communication from the examining division | 27.05.2002 | Despatch of a communication from the examining division (Time limit: M04) | 28.09.2002 | Application deemed to be withdrawn, date of legal effect [2003/18] | 13.11.2002 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [2003/18] | Parent application(s) Tooltip | EP93307507.9 / EP0590873 | Fees paid | Renewal fee | 29.01.1997 | Renewal fee patent year 03 | 29.01.1997 | Renewal fee patent year 04 | 18.09.1997 | Renewal fee patent year 05 | 14.09.1998 | Renewal fee patent year 06 | 17.09.1999 | Renewal fee patent year 07 | 06.09.2000 | Renewal fee patent year 08 | 22.06.2001 | Renewal fee patent year 09 | Penalty fee | Additional fee for renewal fee | 30.09.2002 | 10   M06   Not yet paid |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]EP0342348 (FORD WERKE AG [DE], et al) [X] 1 * column 5, line 48 - line 51 * * column 6, line 11 - line 16; figure 4 *; | [X]DE4104256 (THYSSEN LASER TECHNIK GMBH [DE]) [X] 1 * the whole document *; | [X]JPS6087987 ; | [X]JPS61169184 ; | [X]US4883937 (MATSUNO KENJI [JP], et al) [X] 1 * the whole document *; | [X]EP0098306 (KAWASAKI STEEL CO [JP]) [X] 1 * the whole document *; | [PX]EP0511746 (TOYO SEIKAN KAISHA LTD [JP]) [PX] 1 * the whole document * | [X] - PATENT ABSTRACTS OF JAPAN, (19850918), vol. 009, no. 231, Database accession no. (M - 414), & JP60087987 A 19850517 (TOSHIBA KK) [X] 1 * abstract * | [X] - PATENT ABSTRACTS OF JAPAN, (19861217), vol. 010, no. 378, Database accession no. (M - 546), & JP61169184 A 19860730 (TOYOTA MOTOR CORP) [X] 1 * abstract * | by applicant | US4990741 | US4320281 | JPS57160590 |