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EP0790647
European procedure
Extract from the Register of European Patents
EP About this file: EP0790647
| EP0790647 - Semiconductor body having a solder layer and method of soldering the semiconductor body on a metal suppporting plate [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 25.02.2005 Database last updated on 20.07.2024 | Most recent event Tooltip | 10.02.2006 | Lapse of the patent in a contracting state | published on 29.03.2006 [2006/13] | Applicant(s) | For all designated states Infineon Technologies AG St.-Martin-Strasse 53 81669 München / DE | [2001/36] |
| Former [1997/34] | For all designated states SIEMENS AKTIENGESELLSCHAFT Wittelsbacherplatz 2 80333 München / DE | Inventor(s) | 01 /
Hübner, Holger, Dr.rer.nat. Hamsterweg 10 85598 Baldham / DE | 02 /
Schneegans, Manfred, Dr.rer.nat., Dipl.-Phys. Johann-Strauss-Strasse 32 85591 Vaterstetten / DE | [1997/34] | Representative(s) | Kindermann, Peter Patentanwälte Kindermann Postfach 10 02 34 85593 Baldham / DE | [N/P] |
| Former [2001/39] | Kindermann, Peter, Dipl.-Ing. Patentanwalt, Postfach 1330 85627 Grasbrunn / DE | Application number, filing date | 97102700.8 | 19.02.1997 | [1997/34] | Priority number, date | DE1996106101 | 19.02.1996 Original published format: DE 19606101 | [1997/34] | Filing language | DE | Procedural language | DE | Publication | Type: | A2 Application without search report | No.: | EP0790647 | Date: | 20.08.1997 | Language: | DE | [1997/34] | Type: | A3 Search report | No.: | EP0790647 | Date: | 02.06.1999 | [1999/22] | Type: | B1 Patent specification | No.: | EP0790647 | Date: | 21.04.2004 | Language: | DE | [2004/17] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 20.04.1999 | Classification | IPC: | H01L23/492, H01L21/60, H01L23/482 | [1999/22] | CPC: |
H01L24/83 (EP,US);
H01L21/50 (KR);
H01L23/492 (KR);
H01L24/03 (EP,US);
H01L24/05 (EP,US);
H01L24/29 (EP,US);
H01L31/1113 (EP,US);
H01L31/18 (EP,US);
H01L2224/04026 (EP,US);
H01L2224/05083 (EP,US);
H01L2224/05624 (EP,US);
H01L2224/29101 (EP,US);
H01L2224/83191 (EP,US);
H01L2224/83801 (EP,US);
H01L2924/01004 (EP,US);
H01L2924/01005 (EP,US);
H01L2924/01006 (EP,US);
H01L2924/01013 (EP,US);
H01L2924/01014 (EP,US);
H01L2924/01015 (EP,US);
H01L2924/0102 (EP,US);
H01L2924/01022 (EP,US);
H01L2924/01024 (EP,US);
H01L2924/01028 (EP,US);
H01L2924/01029 (EP,US);
H01L2924/0103 (EP,US);
H01L2924/01033 (EP,US);
H01L2924/01046 (EP,US);
H01L2924/01047 (EP,US);
H01L2924/0105 (EP,US);
H01L2924/01079 (EP,US);
H01L2924/01082 (EP,US);
H01L2924/014 (EP,US);
H01L2924/10253 (EP,US);
H01L2924/157 (EP,US);
Y10T428/12681 (EP,US);
| C-Set: |
H01L2224/29101, H01L2924/014, H01L2924/00 (EP,US)
|
| Former IPC [1997/34] | H01L23/492, H01L21/60 | Designated contracting states | AT, DE, FR, GB, IE, NL [1997/34] | Title | German: | Halbleiterkörper mit Lotmaterialschicht und Verfahren zum Auflöten des Halbleiterkörpers auf eine metallene Trägerplatte | [1997/34] | English: | Semiconductor body having a solder layer and method of soldering the semiconductor body on a metal suppporting plate | [1997/34] | French: | Corps semi-conducteur ayant une couche de soudure et procédé de soudage du corps semi-conducteur sur une plaque métallique de support | [1997/34] | Examination procedure | 03.09.1999 | Examination requested [1999/44] | 03.07.2002 | Despatch of a communication from the examining division (Time limit: M04) | 31.10.2002 | Reply to a communication from the examining division | 14.11.2002 | Despatch of a communication from the examining division (Time limit: M04) | 03.03.2003 | Reply to a communication from the examining division | 29.10.2003 | Communication of intention to grant the patent | 18.02.2004 | Fee for grant paid | 18.02.2004 | Fee for publishing/printing paid | Opposition(s) | 24.01.2005 | No opposition filed within time limit [2005/15] | Fees paid | Renewal fee | 19.02.1999 | Renewal fee patent year 03 | 18.02.2000 | Renewal fee patent year 04 | 19.02.2001 | Renewal fee patent year 05 | 12.02.2002 | Renewal fee patent year 06 | 21.02.2003 | Renewal fee patent year 07 | 18.02.2004 | Renewal fee patent year 08 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | NL | 21.04.2004 | [2006/13] | Documents cited: | Search | [A]DE2522773 (SIEMENS AG [DE]) [A] 1,5* the whole document *; | [A]DE3406542 (TELEFUNKEN ELECTRONIC GMBH [DE]) [A] 1,2 * page 3, line 19 - line 8; figure 1 *; | [X]DE3823347 (SEMIKRON ELEKTRONIK GMBH [DE]) [X] 1,3-5 * column 2, line 44 - column 3, line 44; figure 1 *; | [X]DE9212486U (SIEMENS AG) [X] 1,2,5 * page 1, line 12 - page 3, line 5; figure 1 * |