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Extract from the Register of European Patents

EP About this file: EP0860877

EP0860877 - Semiconductor device and method for producing thereof [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  21.09.2007
Database last updated on 05.10.2024
Most recent event   Tooltip21.09.2007Application deemed to be withdrawnpublished on 24.10.2007  [2007/43]
Applicant(s)For all designated states
Oki Electric Industry Co., Ltd.
7-12, Toranomon 1-chome Minato-ku
Tokyo / JP
[N/P]
Former [1998/35]For all designated states
Oki Electric Industry Co., Ltd.
7-12, Toranomon 1-chome Minato-ku
Tokyo / JP
Inventor(s)01 / Sakamoto, Akira
c/o Oki Electric Industries Co., Ltd.
7-12, Toranomon 1-chome, Minato-ku Tokyo / JP
[1998/35]
Representative(s)Betten & Resch
Patent- und Rechtsanwälte PartGmbB
Postfach 10 02 51
80076 München / DE
[N/P]
Former [1998/35]Betten & Resch
Reichenbachstrasse 19
80469 München / DE
Application number, filing date97116500.622.09.1997
[1998/35]
Priority number, dateJP1997004071725.02.1997         Original published format: JP 4071797
[1998/35]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0860877
Date:26.08.1998
Language:EN
[1998/35]
Type: A3 Search report 
No.:EP0860877
Date:28.02.2001
[2001/09]
Search report(s)(Supplementary) European search report - dispatched on:EP12.01.2001
ClassificationIPC:H01L23/495, H01L23/31
[2000/03]
CPC:
H01L23/31 (EP,US); H01L23/48 (KR); H01L23/3107 (EP,US);
H01L23/49541 (EP,US); H01L23/49551 (EP,US); H05K3/3426 (EP,US);
H01L2224/45144 (EP,US); H01L2224/48091 (EP,US); H01L2224/48247 (EP,US);
H01L2224/49171 (EP,US); H01L24/45 (EP,US); H01L24/48 (EP,US);
H01L24/49 (EP,US); H01L2924/00014 (EP,US); H01L2924/01046 (EP,US);
H01L2924/01078 (EP,US); H01L2924/01079 (EP,US); H01L2924/09701 (EP,US);
H01L2924/181 (EP,US); Y02P70/50 (EP,US) (-)
C-Set:
H01L2224/45144, H01L2924/00014 (US,EP);
H01L2224/48091, H01L2924/00014 (EP,US);
H01L2224/49171, H01L2224/48247, H01L2924/00 (US,EP);
H01L2924/00014, H01L2224/45015, H01L2924/207 (EP,US);
H01L2924/181, H01L2924/00012 (US,EP)
(-)
Former IPC [1998/35]H01L23/495
Designated contracting statesDE,   FR,   GB [2001/46]
Former [1998/35]AT,  BE,  CH,  DE,  DK,  ES,  FI,  FR,  GB,  GR,  IE,  IT,  LI,  LU,  MC,  NL,  PT,  SE 
TitleGerman:Halbleiteranordnung und Herstellungsverfahren dafür[1998/35]
English:Semiconductor device and method for producing thereof[1998/35]
French:Dispositif semi-conducteur et procédé de fabrication[1998/35]
Examination procedure05.07.2001Examination requested  [2001/36]
24.11.2004Despatch of a communication from the examining division (Time limit: M06)
06.06.2005Reply to a communication from the examining division
15.12.2005Despatch of a communication from the examining division (Time limit: M06)
26.06.2006Reply to a communication from the examining division
27.12.2006Despatch of a communication from the examining division (Time limit: M04)
08.05.2007Application deemed to be withdrawn, date of legal effect  [2007/43]
11.06.2007Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [2007/43]
Divisional application(s)EP05105068.0  / EP1577944
Fees paidRenewal fee
17.09.1999Renewal fee patent year 03
29.09.2000Renewal fee patent year 04
28.09.2001Renewal fee patent year 05
30.09.2002Renewal fee patent year 06
30.09.2003Renewal fee patent year 07
30.09.2004Renewal fee patent year 08
30.09.2005Renewal fee patent year 09
29.09.2006Renewal fee patent year 10
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[YA]JPH08316371  ;
 [XY]US4920074  (SHIMIZU ICHIO [JP], et al) [X] 9 * column 4, line 11 - column 5, line 55; figures 5-11 * [Y] 1-4;
 [YA]JPH04171856  ;
 [YA]US5270492  (FUKUI MASARO [JP]) [Y] 1-4 * the whole document * [A] 9;
 [YA]JPH0547954  ;
 [YA]JPH05326807  ;
 [XA]JPH06252310  ;
 [X]JPH07211847  ;
 [X]JPH0444347  ;
 [X]JPH0697223  ;
 [X]JPH03116940  ;
 [E]JPH09275177  ;
 [X]JPH04280663  ;
 [XY]JPS62105456  ;
 [Y]JPH06302758  ;
 [A]JPH02280359
 [YA]  - PATENT ABSTRACTS OF JAPAN, (19970331), vol. 097, no. 003, & JP08316371 A 19961129 (ROHM CO LTD) [Y] 1-4 * abstract * [A] 6-9
 [YA]  - PATENT ABSTRACTS OF JAPAN, (19921005), vol. 016, no. 478, Database accession no. (E - 1274), & JP04171856 A 19920619 (MATSUSHITA ELECTRON CORP) [Y] 1-4 * abstract * [A] 6-9
 [YA]  - PATENT ABSTRACTS OF JAPAN, (19930629), vol. 017, no. 344, Database accession no. (E - 1390), & JP05047954 A 19930226 (TOSHIBA CORP) [Y] 1-4 * abstract * [A] 9
 [YA]  - PATENT ABSTRACTS OF JAPAN, (19940310), vol. 018, no. 144, Database accession no. (E - 1521), & JP05326807 A 19931210 (MITSUBISHI ELECTRIC CORP) [Y] 1-4 * abstract * [A] 9
 [XA]  - PATENT ABSTRACTS OF JAPAN, (19941207), vol. 018, no. 643, Database accession no. (E - 1640), & JP06252310 A 19940909 (TOPPAN PRINTING CO LTD) [X] 9 * the whole document * [A] 1-3
 [X]  - PATENT ABSTRACTS OF JAPAN, (19951226), vol. 1995, no. 11, & JP07211847 A 19950811 (MITSUBISHI ELECTRIC CORP) [X] 5 * abstract *
 [X]  - PATENT ABSTRACTS OF JAPAN, (19920527), vol. 016, no. 230, Database accession no. (E - 1208), & JP04044347 A 19920214 (HITACHI LTD) [X] 5 * abstract *
 [X]  - PATENT ABSTRACTS OF JAPAN, (19940706), vol. 018, no. 359, Database accession no. (E - 1574), & JP06097223 A 19940408 (FUJITSU LTD) [X] 5 * abstract *
 [X]  - PATENT ABSTRACTS OF JAPAN, (19910812), vol. 015, no. 315, Database accession no. (E - 1099), & JP03116940 A 19910517 (TOSHIBA CORP) [X] 5 * abstract *
 [E]  - PATENT ABSTRACTS OF JAPAN, (19980130), vol. 1998, no. 02, & JP09275177 A 19971021 (HITACHI CABLE LTD) [E] 5 * the whole document *
 [X]  - PATENT ABSTRACTS OF JAPAN, (19930219), vol. 017, no. 085, Database accession no. (E - 1322), & JP04280663 A 19921006 (HITACHI LTD;OTHERS: 01) [X] 6,7 * abstract *
 [XY]  - PATENT ABSTRACTS OF JAPAN, (19871012), vol. 011, no. 312, Database accession no. (E - 548), & JP62105456 A 19870515 (HITACHI LTD) [X] 6-8 * abstract * [Y] 10
 [Y]  - PATENT ABSTRACTS OF JAPAN, (19950228), vol. 1995, no. 01, & JP06302758 A 19941028 (ROHM CO LTD) [Y] 10 * the whole document *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19910206), vol. 015, no. 050, Database accession no. (E - 1030), & JP02280359 A 19901116 (MATSUSHITA ELECTRON CORP) [A] 8,10 * the whole document *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.