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EP0843508
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EP About this file: EP0843508
| EP0843508 - Coating circuits to dissipate heat [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 02.08.2003 Database last updated on 13.07.2024 | Most recent event Tooltip | 11.07.2008 | Change - representative | published on 13.08.2008 [2008/33] | Applicant(s) | For all designated states HONEYWELL INC. Honeywell Plaza Minneapolis, MN 55408 / US | [N/P] |
| Former [1998/21] | For all designated states HONEYWELL INC. Honeywell Plaza Minneapolis Minnesota 55408 / US | Inventor(s) | 01 /
Heffner, Kenneth H. 11200 102nd Terrance North Largo, Florida 34648 / US | 02 /
Anderson, Curtis W. 10820 Hammock Drive Largo, Florida 34644 / US | [1998/21] | Representative(s) | Fox-Male, Nicholas Vincent Humbert, et al Potter Clarkson LLP The Belgrave Centre Talbot Street Nottingham NG1 5GG / GB | [N/P] |
| Former [2008/33] | Fox-Male, Nicholas Vincent Humbert, et al Potter Clarkson LLP Park View House 58 The Ropewalk Nottingham NG1 5DD / GB | ||
| Former [2001/51] | Fox-Male, Nicholas Vincent Humbert, et al Eric Potter Clarkson Park View House 58 The Ropewalk Nottingham NG1 5DD / GB | ||
| Former [2001/22] | Sturm, Christoph, et al Honeywell Holding AG, IP Europe Law Dept., Kaiserleistrasse 39 63067 Offenbach am Main / DE | ||
| Former [1998/21] | Herzbach, Dieter, Dipl.-Ing., et al Honeywell Holding AG, Patent- und Lizenzabteilung, Kaiserleistrasse 39 63067 Offenbach am Main / DE | Application number, filing date | 97119687.8 | 11.11.1997 | [1998/21] | Priority number, date | US19960746701 | 15.11.1996 Original published format: US 746701 | [1998/21] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0843508 | Date: | 20.05.1998 | Language: | EN | [1998/21] | Type: | A3 Search report | No.: | EP0843508 | Date: | 19.04.2000 | [2000/16] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 02.03.2000 | Classification | IPC: | H05K3/28, H01L23/29, H01L23/373, H01L21/56 | [2000/16] | CPC: |
H05K3/284 (EP);
H01L23/295 (EP);
H01L2224/48091 (EP);
H01L2924/09701 (EP)
| C-Set: |
H01L2224/48091, H01L2924/00014 (EP)
|
| Former IPC [1998/21] | H05K3/28, H01L23/29, H01L23/373 | Designated contracting states | CH, DE, DK, FI, FR, GB, LI, NL [2000/52] |
| Former [1998/21] | AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE | Title | German: | Beschichten von Schaltungen zur Wärmeableitung | [1998/21] | English: | Coating circuits to dissipate heat | [1998/21] | French: | Recouvrir des circuits pour dissiper la chaleur | [1998/21] | Examination procedure | 10.05.2000 | Examination requested [2000/27] | 30.10.2002 | Despatch of a communication from the examining division (Time limit: M04) | 11.03.2003 | Application deemed to be withdrawn, date of legal effect [2003/38] | 15.04.2003 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [2003/38] | Fees paid | Renewal fee | 21.10.1999 | Renewal fee patent year 03 | 10.11.2000 | Renewal fee patent year 04 | 07.11.2001 | Renewal fee patent year 05 | 07.11.2002 | Renewal fee patent year 06 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]GB1265007 (ASSOCIATED ENGINEERING LTD) [X] 1,3,5,7 * page 1, column L, line 13 - line 39 * * page 1, column R, line 70 - line 89 * * page 2, column L, line 21 - line 33 *; | [PX]EP0771023 (HONEYWELL INC) [PX] 1,3,5,7 * the whole document *; | [X]US5315480 (LARSON JR RALPH I ET AL) [X] 1,2,5,6 * column 3, line 52 - column 4, line 14; figure 6 *; | [A]EP0115412 (ATOMIC ENERGY AUTHORITY UK) [A] 1,3,5,7 * page 3, line 1 - page 5, line 22 *; | [A]US5399441 (BEARINGER CLAYTON R ET AL) [A] 1-4 * column 4, line 35 - column 5, line 33 * | [X] - "GLASS COATING OF ELECTRONIC COMPONENTS", IBM TECHNICAL DISCLOSURE BULLETIN., NEW YORK US, (197112), vol. 14, no. 7, page 2168, XP002090243 [X] 1,5 * the whole document * |