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EP0859411
European procedure
Extract from the Register of European Patents
EP About this file: EP0859411
| EP0859411 - Semiconductor device of surface-mount type [Right-click to bookmark this link] | |||
| Former [1998/34] | Semiconducor device of surface-mount type, circuit board having such a semiconductor device mounted thereon, and a method of producing such a semiconductor device | ||
| [1999/11] | Status | No opposition filed within time limit Status updated on 21.03.2003 Database last updated on 04.06.2024 | Most recent event Tooltip | 21.03.2003 | No opposition filed within time limit | published on 07.05.2003 [2003/19] | Applicant(s) | For all designated states Oki Electric Industry Co., Ltd. 7-12, Toranomon 1-chome Minato-ku Tokyo / JP | [N/P] |
| Former [1998/34] | For all designated states Oki Electric Industry Co., Ltd. 7-12, Toranomon 1-chome Minato-ku Tokyo / JP | Inventor(s) | 01 /
Yamaguchi, Tadashi c/o Oki Electric Industries Co., Ltd. 7-12, Toranomon 1-chome, Minato-ku Tokyo / JP | [1998/34] | Representative(s) | Betten & Resch Patent- und Rechtsanwälte PartGmbB Postfach 10 02 51 80076 München / DE | [N/P] |
| Former [1998/34] | Betten & Resch Reichenbachstrasse 19 80469 München / DE | Application number, filing date | 97121955.5 | 12.12.1997 | [1998/34] | Priority number, date | JP19970027424 | 12.02.1997 Original published format: JP 2742497 | [1998/34] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0859411 | Date: | 19.08.1998 | Language: | EN | [1998/34] | Type: | A3 Search report | No.: | EP0859411 | Date: | 17.03.1999 | [1999/11] | Type: | B1 Patent specification | No.: | EP0859411 | Date: | 15.05.2002 | Language: | EN | [2002/20] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 28.01.1999 | Classification | IPC: | H01L23/498 | [1998/34] | CPC: |
H01L24/06 (EP,US);
H01L23/28 (KR);
H01L23/4951 (EP,US);
H01L2224/04042 (EP,US);
H01L2224/05554 (EP,US);
H01L2224/06136 (EP,US);
H01L2224/32245 (EP,US);
H01L2224/48091 (EP,US);
H01L2224/48247 (EP,US);
H01L2224/4826 (EP,US);
H01L2224/73215 (EP,US);
H01L24/48 (EP,US);
H01L2924/00014 (EP,US);
H01L2924/01005 (EP,US);
H01L2924/01006 (EP,US);
H01L2924/01033 (EP,US);
H01L2924/01082 (EP,US);
H01L2924/014 (EP,US);
| C-Set: |
H01L2224/48091, H01L2924/00014 (US,EP);
H01L2224/73215, H01L2224/32245, H01L2224/4826, H01L2924/00 (US,EP);
H01L2924/00014, H01L2224/05599 (EP,US);
H01L2924/00014, H01L2224/45015, H01L2924/207 (EP,US);
H01L2924/00014, H01L2224/45099 (US,EP);
H01L2924/00014, H01L2224/85399 (EP,US); | Designated contracting states | DE, FR, GB, NL [1999/48] |
| Former [1998/34] | AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE | Title | German: | Oberflächenmontierbare Halbleitervorrichtung | [2001/19] | English: | Semiconductor device of surface-mount type | [2001/19] | French: | Dispositif semiconducteur à montage de surface | [2001/19] |
| Former [1998/34] | Oberflächenmontierbare Halbleitervorrichtung, Leiterplatte mit einer derartigen Halbleitervorrichtung, und Verfahren zum Herstellen einer derartigen Halbleitervorrichtung | ||
| Former [1998/34] | Semiconducor device of surface-mount type, circuit board having such a semiconductor device mounted thereon, and a method of producing such a semiconductor device | ||
| Former [1998/34] | Dispositif semiconducteur à montage de surface, carte de circuit imprimé équipée d'un tel dispositif, et procédé de fabrication d'un tel dispositif | Examination procedure | 13.09.1999 | Examination requested [1999/46] | 07.07.2000 | Despatch of a communication from the examining division (Time limit: M04) | 31.10.2000 | Reply to a communication from the examining division | 29.06.2001 | Despatch of communication of intention to grant (Approval: No) | 13.11.2001 | Despatch of communication of intention to grant (Approval: later approval) | 19.11.2001 | Communication of intention to grant the patent | 25.01.2002 | Fee for grant paid | 25.01.2002 | Fee for publishing/printing paid | Opposition(s) | 18.02.2003 | No opposition filed within time limit [2003/19] | Fees paid | Renewal fee | 23.12.1999 | Renewal fee patent year 03 | 02.01.2001 | Renewal fee patent year 04 | 28.12.2001 | Renewal fee patent year 05 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [DA]JPH08125066 ; | [A]EP0614219 (IBM [US]) [A] 20* column 3, line 42 - column 3, line 54; figures 1,2 *; | [X]US5347159 (KHANDROS IGOR Y [US], et al) [X] 1,2,4-7,9-20 * column 6, line 55 - column 7, line 50 * * column 13, line 55 - column 15, line 8; figures 7,11 *; | [A]US5350947 (TAKEKAWA KOUICHI [JP], et al) [A] 1-20 * figure 3 *; | [X]DE9417734U (ZENTR MIKROELEKT DRESDEN GMBH [DE]) [X] 1,2,5-7,10,12,13,15,17,19 * page 6, line 4 - page 8, line 19; figures 1-4 *; | [X]US5583375 (TSUBOSAKI KUNIHIRO [JP], et al) [X] 1-19 * column 6, line 11 - column 8, line 67; figures 8,21 * * column 12, line 60 - column 13, line 30; figure 30 * | [DA] - PATENT ABSTRACTS OF JAPAN, (19960930), vol. 096, no. 009, & JP08125066 A 19960517 (DAINIPPON PRINTING CO LTD) [DA] 1-20 * abstract * |