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Extract from the Register of European Patents

EP About this file: EP0849793

EP0849793 - Improvements in or relating to integrated circuit device packages [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  25.11.2005
Database last updated on 24.04.2024
Most recent event   Tooltip26.06.2009Change - representativepublished on 29.07.2009  [2009/31]
Applicant(s)For all designated states
Texas Instruments Incorporated
7839 Churchill Way
Mail Station 3999
Dallas, Texas 75251 / US
[N/P]
Former [1998/26]For all designated states
Texas Instruments Incorporated
7839 Churchill Way, Mail Station 3999
Dallas, Texas 75251 / US
Inventor(s)01 / Lamson, Michael A.
1207 Church Street
Westminster, TX 75485 / US
[1998/26]
Representative(s)Degwert, Hartmut, et al
Prinz & Partner
Rundfunkplatz 2
80335 München / DE
[N/P]
Former [2009/31]Degwert, Hartmut, et al
Prinz & Partner GbR Rundfunkplatz 2
80335 München / DE
Former [2003/12]Degwert, Hartmut, Dipl.-Phys., et al
Prinz & Partner GbR, Manzingerweg 7
81241 München / DE
Former [1998/26]Schwepfinger, Karl-Heinz, Dipl.-Ing.
Prinz & Partner, Manzingerweg 7
81241 München / DE
Application number, filing date97122427.418.12.1997
[1998/26]
Priority number, dateUS19960033673P18.12.1996         Original published format: US 33673 P
[1998/26]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0849793
Date:24.06.1998
Language:EN
[1998/26]
Type: A3 Search report 
No.:EP0849793
Date:10.05.2000
[2000/19]
Search report(s)(Supplementary) European search report - dispatched on:EP27.03.2000
ClassificationIPC:H01L23/13, H01L23/498, H01L23/50
[1998/26]
CPC:
H01L23/12 (KR); H01L23/49822 (EP,US); H01L23/49861 (EP,US);
H01L23/66 (EP,US); H01L24/49 (EP,US); H01L2223/6616 (EP,US);
H01L2224/48091 (EP,US); H01L2224/48227 (EP,US); H01L2224/49109 (EP,US);
H01L24/48 (EP,US); H01L2924/00014 (EP,US); H01L2924/01029 (EP,US);
H01L2924/01074 (EP,US); H01L2924/014 (EP,US); H01L2924/14 (EP,US);
H01L2924/15153 (EP,US); H01L2924/1517 (EP,US); H01L2924/15311 (EP,US);
H01L2924/15787 (EP,US); H01L2924/3011 (EP,US) (-)
C-Set:
H01L2224/48091, H01L2924/00014 (US,EP);
H01L2224/49109, H01L2224/48227, H01L2924/00012 (EP,US);
H01L2924/00014, H01L2224/05599 (EP,US);
H01L2924/00014, H01L2224/45099 (US,EP);
H01L2924/15787, H01L2924/00 (US,EP)
(-)
Designated contracting statesDE,   FR,   GB,   IT,   NL [2001/03]
Former [1998/26]AT,  BE,  CH,  DE,  DK,  ES,  FI,  FR,  GB,  GR,  IE,  IT,  LI,  LU,  MC,  NL,  PT,  SE 
TitleGerman:Verbesserungen für oder in Beziehung auf integrierte Schaltungspackungen[1998/26]
English:Improvements in or relating to integrated circuit device packages[1998/26]
French:Améliorations pour ou concernant des empaquetages de dispositifs à circuit intégré[1998/26]
Examination procedure06.11.2000Examination requested  [2001/01]
28.02.2005Despatch of a communication from the examining division (Time limit: M04)
12.07.2005Application deemed to be withdrawn, date of legal effect  [2006/02]
12.08.2005Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [2006/02]
Fees paidRenewal fee
27.12.1999Renewal fee patent year 03
21.12.2000Renewal fee patent year 04
27.12.2001Renewal fee patent year 05
19.12.2002Renewal fee patent year 06
22.12.2003Renewal fee patent year 07
21.12.2004Renewal fee patent year 08
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[XA]JPH04184962  ;
 [XA]US4626889  (YAMAMOTO MASAKAZU [JP], et al) [X] 1-16 * column 2, lines 25-51; figures 5-7 * [A] 17-19;
 [XA]EP0614331  (IBM [US]) [X] 1-7 * column 1, lines 25-55 * * column 4, lines 1-10; figures 2,3 * [A] 8-19;
 [X]JPS60125002  ;
 [A]JPH08139281  ;
 [A]JPH04218948
 [XA]  - PATENT ABSTRACTS OF JAPAN, (19921015), vol. 016, no. 499, Database accession no. (E - 1280), & JP04184962 A 19920701 (HITACHI LTD;OTHERS: 01) [X] 1-16 * abstract * [A] 17-20
 [X]  - PATENT ABSTRACTS OF JAPAN, (19851112), vol. 009, no. 284, Database accession no. (E - 357), & JP60125002 A 19850704 (NIPPON DENSHIN DENWA KOSHA) [X] 1-7 * abstract *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19960930), vol. 096, no. 009, & JP08139281 A 19960531 (HITACHI LTD) [A] 1 * abstract *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19921208), vol. 016, no. 567, Database accession no. (E - 1296), & JP04218948 A 19920810 (MITSUBISHI ELECTRIC CORP) [A] 1 * abstract *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.