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Extract from the Register of European Patents

EP About this file: EP0786310

EP0786310 - Wafer polishing head [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  10.10.2003
Database last updated on 24.04.2024
Most recent event   Tooltip26.11.2004Lapse of the patent in a contracting state
New state(s): MC		published on 12.01.2005  [2005/02]
Applicant(s)For all designated states
LAM RESEARCH CORPORATION
4650 Cushing Parkway
Fremont, CA 94538 / US
[2000/12]
Former [1997/31]For all designated states
ONTRAK SYSTEMS, INC.
1010 Rincon Circle
San Jose, California 95131 / US
Inventor(s)01 / Volodarsky, Konstantin
1721 Rivera Street
San Francisco, California 94116 / US
02 / Weldon, David Edwin
23613 Skyview Terrace
Los Gatos, California 95030 / US
[1997/31]
Representative(s)Bucks, Teresa Anne, et al
Boult Wade Tennant
Verulam Gardens
70 Gray's Inn Road
London WC1X 8BT / GB
[N/P]
Former [1998/46]Bucks, Teresa Anne, et al
BOULT WADE TENNANT, 27 Furnival Street
London EC4A 1PQ / GB
Former [1997/31]Bayliss, Geoffrey Cyril, et al
BOULT WADE TENNANT, 27 Furnival Street
London EC4A 1PQ / GB
Application number, filing date97300080.508.01.1997
[1997/31]
Priority number, dateUS1996059086124.01.1996         Original published format: US 590861
[1997/31]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP0786310
Date:30.07.1997
Language:EN
[1997/31]
Type: B1 Patent specification 
No.:EP0786310
Date:04.12.2002
Language:EN
[2002/49]
Search report(s)(Supplementary) European search report - dispatched on:EP20.05.1997
ClassificationIPC:B24B37/04
[1997/31]
CPC:
B24B37/30 (EP,US)
Designated contracting statesAT,   BE,   CH,   DE,   DK,   ES,   FI,   FR,   GB,   GR,   IE,   IT,   LI,   LU,   MC,   NL,   PT,   SE [1997/31]
Extension statesAL20.01.1997
LT20.01.1997
LV20.01.1997
RO20.01.1997
SI20.01.1997
TitleGerman:Halbleiterscheiben-Polierkopf[1997/31]
English:Wafer polishing head[1997/31]
French:Tête de polissage pour plaquette semi-conductrice[1997/31]
Examination procedure29.09.1997Examination requested  [1997/48]
08.06.1999Despatch of a communication from the examining division (Time limit: M06)
09.12.1999Reply to a communication from the examining division
18.12.2000Despatch of a communication from the examining division (Time limit: M04)
20.04.2001Reply to a communication from the examining division
18.02.2002Despatch of communication of intention to grant (Approval: Yes)
01.07.2002Communication of intention to grant the patent
04.09.2002Fee for grant paid
04.09.2002Fee for publishing/printing paid
Opposition(s)05.09.2003No opposition filed within time limit [2003/48]
Fees paidRenewal fee
21.12.1998Renewal fee patent year 03
20.12.1999Renewal fee patent year 04
21.12.2000Renewal fee patent year 05
21.01.2002Renewal fee patent year 06
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAT04.12.2002
CH04.12.2002
FI04.12.2002
GR04.12.2002
LI04.12.2002
IE08.01.2003
LU08.01.2003
MC31.01.2003
DK04.03.2003
SE04.03.2003
PT05.03.2003
ES27.06.2003
[2005/02]
Former [2004/39]AT04.12.2002
CH04.12.2002
FI04.12.2002
GR04.12.2002
LI04.12.2002
IE08.01.2003
LU08.01.2003
DK04.03.2003
SE04.03.2003
PT05.03.2003
ES27.06.2003
Former [2004/15]AT04.12.2002
CH04.12.2002
FI04.12.2002
GR04.12.2002
LI04.12.2002
IE08.01.2003
DK04.03.2003
SE04.03.2003
PT05.03.2003
ES27.06.2003
Former [2004/04]AT04.12.2002
CH04.12.2002
FI04.12.2002
GR04.12.2002
LI04.12.2002
DK04.03.2003
SE04.03.2003
PT05.03.2003
ES27.06.2003
Former [2004/02]AT04.12.2002
CH04.12.2002
FI04.12.2002
GR04.12.2002
LI04.12.2002
DK04.03.2003
SE04.03.2003
PT05.03.2003
Former [2003/43]AT04.12.2002
CH04.12.2002
FI04.12.2002
GR04.12.2002
LI04.12.2002
SE04.03.2003
PT05.03.2003
Former [2003/39]AT04.12.2002
CH04.12.2002
GR04.12.2002
LI04.12.2002
SE04.03.2003
PT05.03.2003
Former [2003/37]AT04.12.2002
GR04.12.2002
SE04.03.2003
PT05.03.2003
Former [2003/31]GR04.12.2002
SE04.03.2003
PT05.03.2003
Former [2003/29]SE04.03.2003
PT05.03.2003
Former [2003/27]SE04.03.2003
Documents cited:Search[A]JPS59187456  ;
 [A]JPS55157473  ;
 [PX]EP0747167  (APPLIED MATERIALS INC [US]) [PX] 1-13 * abstract *;
 [PX]US5584751  (KOBAYASHI HIROYUKI [JP], et al) [PX] 1-13 * the whole document *;
 [E]EP0768148  (EBARA CORP [JP]) [E] 1-13 * the whole document *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19850306), vol. 009, no. 051, Database accession no. (M - 361), & JP59187456 A 19841024 (FUJITSU KK) [A] 1-3,11 * abstract *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19810228), vol. 005, no. 033, Database accession no. (M - 057), & JP55157473 A 19801208 (NIPPON TELEGR & TELEPH CORP) [A] 1-3,11 * abstract *
by applicantUS5329732
 US5329734
 US19940287658
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.