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EP0821408
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EP About this file: EP0821408
| EP0821408 - A structure of mounting a semiconductor element onto a substrate and a mounting method thereof [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 17.10.2008 Database last updated on 29.07.2024 | Most recent event Tooltip | 17.10.2008 | Application deemed to be withdrawn | published on 19.11.2008 [2008/47] | Applicant(s) | For all designated states Sharp Kabushiki Kaisha 22-22 Nagaike-cho Abeno-ku Osaka-shi Osaka-fu 545-0013 / JP | [N/P] |
| Former [1999/09] | For all designated states SHARP KABUSHIKI KAISHA 22-22 Nagaike-cho, Abeno-ku Osaka-shi, Osaka-fu 545 / JP | ||
| Former [1998/05] | For all designated states SHARP KABUSHIKI KAISHA 22-22, Nagaike-cho, Abeno-ku Osaka-shi, Osaka-fu 545 / JP | Inventor(s) | 01 /
Yamamoto, Seiichi 361-9, Shinga-cho Kashihara-shi, Nara / JP | [1998/05] | Representative(s) | Brown, Kenneth Richard, et al R.G.C. Jenkins & Co 26 Caxton Street London SW1H 0RJ / GB | [N/P] |
| Former [1998/05] | Brown, Kenneth Richard, et al R.G.C. Jenkins & Co. 26 Caxton Street London SW1H 0RJ / GB | Application number, filing date | 97305608.8 | 25.07.1997 | [1998/05] | Priority number, date | JP19960196479 | 25.07.1996 Original published format: JP 19647996 | [1998/05] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0821408 | Date: | 28.01.1998 | Language: | EN | [1998/05] | Type: | A3 Search report | No.: | EP0821408 | Date: | 01.12.1999 | [1999/48] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 18.10.1999 | Classification | IPC: | H01L21/60, H01L21/56 | [1999/47] | CPC: |
H01L24/81 (EP,US);
H01L21/563 (EP,US);
H01L24/29 (EP,US);
H01L24/83 (EP,US);
H01L2224/13144 (EP,US);
H01L2224/16225 (EP,US);
H01L2224/29111 (EP,US);
H01L2224/2919 (EP,US);
H01L2224/32225 (EP,US);
H01L2224/73203 (EP,US);
H01L2224/73204 (EP,US);
H01L2224/81 (EP);
H01L2224/81801 (EP,US);
H01L2224/83101 (EP,US);
H01L2224/83102 (EP,US);
H01L2224/83192 (EP,US);
H01L2224/92125 (EP,US);
H01L2924/01004 (EP,US);
H01L2924/01005 (EP,US);
H01L2924/01006 (EP,US);
H01L2924/01013 (EP,US);
H01L2924/01029 (EP,US);
H01L2924/01033 (EP,US);
H01L2924/0104 (EP,US);
H01L2924/0105 (EP,US);
H01L2924/01075 (EP,US);
H01L2924/01078 (EP,US);
H01L2924/01079 (EP,US);
H01L2924/0132 (EP,US);
H01L2924/014 (EP,US);
H01L2924/14 (EP,US);
H01L2924/1579 (EP,US);
Y10T29/49144 (EP,US);
Y10T29/49146 (EP,US)
(-)
| C-Set: |
H01L2224/16225, H01L2224/13144, H01L2924/00 (US,EP);
H01L2224/29111, H01L2924/01079, H01L2924/00015 (EP,US);
H01L2224/2919, H01L2924/0665 (EP,US);
H01L2224/73204, H01L2224/16225, H01L2224/32225, H01L2924/00 (US,EP);
H01L2224/83192, H01L2224/32225, H01L2924/00 (US,EP);
H01L2224/83192, H01L2224/73204, H01L2224/16225, H01L2224/32225, H01L2924/00 (EP,US);
H01L2224/83192, H01L2224/83101, H01L2924/00 (EP,US);
H01L2224/92125, H01L2224/73204, H01L2224/16225, H01L2224/32225, H01L2924/00 (EP,US); |
| Former IPC [1998/05] | H01L21/60 | Designated contracting states | DE, FR, GB [2000/32] |
| Former [1998/05] | AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE | Title | German: | Eine Struktur zur Montierung eines Halbleiterelementes auf einem Substrat und ein Montierverfahren dafür | [1998/05] | English: | A structure of mounting a semiconductor element onto a substrate and a mounting method thereof | [1998/05] | French: | Une structure pour le montage d'un élément semi-conducteur sur un substrat et procédé de montage | [1998/05] | Examination procedure | 10.02.2000 | Examination requested [2000/15] | 31.10.2003 | Despatch of a communication from the examining division (Time limit: M04) | 09.03.2004 | Reply to a communication from the examining division | 07.01.2008 | Despatch of a communication from the examining division (Time limit: M04) | 20.05.2008 | Application deemed to be withdrawn, date of legal effect [2008/47] | 24.06.2008 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [2008/47] | Fees paid | Renewal fee | 13.07.1999 | Renewal fee patent year 03 | 12.07.2000 | Renewal fee patent year 04 | 12.07.2001 | Renewal fee patent year 05 | 12.07.2002 | Renewal fee patent year 06 | 14.07.2003 | Renewal fee patent year 07 | 14.07.2004 | Renewal fee patent year 08 | 13.07.2005 | Renewal fee patent year 09 | 12.07.2006 | Renewal fee patent year 10 | 13.07.2007 | Renewal fee patent year 11 | Penalty fee | Additional fee for renewal fee | 31.07.2008 | 12 M06 Not yet paid |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XA]JPS5873126 ; | [XA]EP0389756 (MATSUSHITA ELECTRIC IND CO LTD [JP]) [X] 1 * the whole document * [A] 2-13; | [PA]WO9717727 (FORD MOTOR CO [US], et al) [PA] 1-13 * page 8, line 3 - page 9, line 17; figures 1,2 *; | [PA]JPH0997816 ; | [A]US5363277 (TANAKA OSAMU [JP]) [A] 1-13 * the whole document *; | [A]EP0388011 (TOSHIBA KK [JP]) [A] 1-13 * the whole document * | [XA] - ASCHENBRENNER R ET AL, "FLIP CHIP ATTACHMENT USING NON-CONDUCTIVE ADHESIVES AND GOLD BALL BUMPS", INTERNATIONAL JOURNAL OF MICROCIRCUITS AND ELECTRONIC PACKAGING, (19950701), vol. 18, no. 2, ISSN 1063-1674, pages 154 - 161, XP000522303 [X] 1-5,11 * figure 4; table 2 * [A] 7-10,12,13 | [XA] - PATENT ABSTRACTS OF JAPAN, (19830721), vol. 007, no. 166, Database accession no. (E - 188), & JP58073126 A 19830502 (SEIKOO KEIYOU KOGYO KK) [X] 1,4,11,12 * abstract * [A] 2,3,5-10,13 | [PA] - PATENT ABSTRACTS OF JAPAN, (19970829), vol. 1997, no. , & JP09097816 A 19970408 (NEC CORP) [PA] 1-13 * abstract * |