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EP0876689
European procedure
Extract from the Register of European Patents
EP About this file: EP0876689
| EP0876689 - METHOD OF FORMING ELECTRICAL INTERCONNECTS USING ISOTROPIC CONDUCTIVE ADHESIVES AND CONNECTIONS FORMED THEREBY [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 04.08.2000 Database last updated on 04.06.2024 | Most recent event Tooltip | 12.06.2009 | Change - representative | published on 15.07.2009 [2009/29] | Applicant(s) | For all designated states Hewlett-Packard Company 3000 Hanover Street Palo Alto, CA 94304-1112 / US | [N/P] |
| Former [1998/46] | For all designated states Hewlett-Packard Company 3000 Hanover Street Palo Alto, California 94304 / US | Inventor(s) | 01 /
SCHAR, Wayne, C. 271 Old Spanish Trail Portola Valley, CA 94028 / US | [1998/46] | Representative(s) | Schoppe, Fritz Schoppe, Zimmermann, Stöckeler & Zinkler Patentanwälte Postfach 246 82043 Pullach bei München / DE | [N/P] |
| Former [2009/29] | Schoppe, Fritz Schoppe, Zimmermann, Stöckeler & Zinkler Patentanwälte Postfach 246 82043 Pullach bei München / DE | ||
| Former [1998/46] | Schoppe, Fritz, Dipl.-Ing. Schoppe & Zimmermann, Patentanwälte, Postfach 71 08 67 81458 München / DE | Application number, filing date | 97902073.2 | 23.01.1997 | [1998/46] | WO1997US01026 | Priority number, date | US19960592042 | 26.01.1996 Original published format: US 592042 | [1998/46] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | WO9727646 | Date: | 31.07.1997 | Language: | EN | [1997/33] | Type: | A2 Application without search report | No.: | EP0876689 | Date: | 11.11.1998 | Language: | EN | The application published by WIPO in one of the EPO official languages on 31.07.1997 takes the place of the publication of the European patent application. | [1998/46] | Type: | B1 Patent specification | No.: | EP0876689 | Date: | 06.10.1999 | Language: | EN | [1999/40] | Search report(s) | International search report - published on: | EP | 23.10.1997 | Classification | IPC: | H01R4/04, H05K3/36, H01R9/09 | [1998/46] | CPC: |
H01L24/83 (EP,US);
H01L21/563 (EP,US);
H01L24/29 (EP,US);
H01L24/81 (EP,US);
H01R4/04 (EP,US);
H05K3/321 (EP,US);
H01L2224/16225 (EP,US);
H01L2224/29101 (EP,US);
H01L2224/2919 (EP,US);
H01L2224/2929 (EP,US);
H01L2224/29339 (EP,US);
H01L2224/29344 (EP,US);
H01L2224/29393 (EP,US);
H01L2224/32225 (EP,US);
H01L2224/73203 (EP,US);
H01L2224/73204 (EP,US);
H01L2224/81193 (EP,US);
H01L2224/81801 (EP,US);
H01L2224/83102 (EP,US);
H01L2224/8319 (EP,US);
H01L2224/838 (EP,US);
H01L2224/92125 (EP,US);
H01L2924/00013 (EP,US);
H01L2924/01006 (EP,US);
H01L2924/0103 (EP,US);
H01L2924/01033 (EP,US);
H01L2924/01047 (EP,US);
H01L2924/01078 (EP,US);
H01L2924/01079 (EP,US);
H01L2924/01082 (EP,US);
H01L2924/01087 (EP,US);
H01L2924/014 (EP,US);
H01L2924/0665 (EP,US);
H01L2924/0781 (EP,US);
H01L2924/12042 (EP,US);
H01L2924/14 (EP,US);
H01L2924/15311 (EP,US);
H01L2924/30105 (EP,US);
H01L2924/30107 (EP,US);
H05K2201/10674 (EP,US);
H05K2201/10977 (EP,US);
H05K2201/10984 (EP,US);
H05K2203/0195 (EP,US);
H05K2203/0338 (EP,US);
H05K2203/0568 (EP,US);
H05K3/1216 (EP,US);
Y10T156/1089 (EP,US);
Y10T156/109 (EP,US);
| C-Set: |
H01L2224/29101, H01L2924/014, H01L2924/00 (US,EP);
H01L2224/2929, H01L2924/00014 (US,EP);
H01L2224/29339, H01L2924/00014 (US,EP);
H01L2224/29344, H01L2924/00014 (US,EP);
H01L2224/29393, H01L2924/00014 (US,EP);
H01L2224/73204, H01L2224/16225, H01L2224/32225, H01L2924/00 (US,EP);
H01L2224/92125, H01L2224/73204, H01L2224/16225, H01L2224/32225, H01L2924/00 (US,EP);
H01L2924/00013, H01L2224/29099 (US,EP);
H01L2924/00013, H01L2224/29199 (EP,US);
H01L2924/00013, H01L2224/2929 (EP,US);
H01L2924/00013, H01L2224/29299 (EP,US);
H01L2924/0665, H01L2924/00 (US,EP);
H01L2924/12042, H01L2924/00 (US,EP);
H01L2924/15311, H01L2224/73204, H01L2224/16225, H01L2224/32225, H01L2924/00 (US,EP) (-) | Designated contracting states | DE, GB [1998/46] | Title | German: | VERFAHREN ZUR HERSTELLUNG ELECTRISCHER ANSCHLÜSSE UNTER VERWENDUNG VON ISOTOPEN LEITFÄHIGEN KLEBSTOFFE UND DAMIT ERREICHTE VERBINDUNGEN | [1998/46] | English: | METHOD OF FORMING ELECTRICAL INTERCONNECTS USING ISOTROPIC CONDUCTIVE ADHESIVES AND CONNECTIONS FORMED THEREBY | [1998/46] | French: | PROCEDE DE FORMATION D'INTERCONNEXIONS ELECTRIQUES A L'AIDE DE CONDUCTEURS ADHESIFS ISOTROPES ET CONNEXIONS AINSI FORMEES | [1998/46] | Entry into regional phase | 22.06.1998 | National basic fee paid | 22.06.1998 | Designation fee(s) paid | 22.06.1998 | Examination fee paid | Examination procedure | 19.08.1997 | Request for preliminary examination filed International Preliminary Examining Authority: EP | 22.06.1998 | Examination requested [1998/46] | 11.11.1998 | Despatch of communication of intention to grant (Approval: Yes) | 07.04.1999 | Communication of intention to grant the patent | 15.04.1999 | Fee for grant paid | 15.04.1999 | Fee for publishing/printing paid | Opposition(s) | 07.07.2000 | No opposition filed within time limit [2000/38] | Fees paid | Renewal fee | 05.01.1999 | Renewal fee patent year 03 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Cited in | International search | [Y]JPH06275678 ; | [A]JPH03112011 ; | [Y]WO8504980 (AMP INC [US]) [Y] 1,6 * abstract *; | [A]EP0424106 (SHARP KK [JP]) [A] 1-9 * abstract *; | [X]EP0501270 (FUJI POLYMER IND [JP]) [X] 1,4,6 * page 5, lines 2-8; figure 1 *; | [A]US5397685 (DANIELS GEORGE R E [US], et al) [A] 6-8* abstract * | [Y] - PATENT ABSTRACTS OF JAPAN, (19941222), vol. 018, no. 684, Database accession no. (E - 1650), & JP06275678 A 19940930 (FUJITSU LTD) [Y] 1,6 * abstract * | [A] - PATENT ABSTRACTS OF JAPAN, (19910807), vol. 015, no. 308, Database accession no. (E - 1097), & JP03112011 A 19910513 (CATALYSTS & CHEM IND CO LTD) [A] 1-9 * abstract * |