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Extract from the Register of European Patents

EP About this file: EP0838133

EP0838133 - DEVICE FOR MOUNTING ELECTRICAL COMPONENTS ON PRINTED-CIRCUIT BOARDS [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  03.09.1999
Database last updated on 31.08.2024
Most recent event   Tooltip08.08.2008Change - representativepublished on 10.09.2008  [2008/37]
Applicant(s)For all designated states
MELCHER AG
Ackerstrasse 56
8610 Uster / CH
[1998/18]
Inventor(s)01 / HUNZIKER, Hansjürg
Dorfstrasse 125
CH-8424 Embrach / CH
[1998/18]
Representative(s)Salgo, Reinhold Caspar
Dr. R.C. Salgo + Partner
Patentanwälte AG
Rütlistrasse 103
8636 Wald ZH / CH
[N/P]
Former [2008/37]Salgo, Reinhold Caspar
Dr. R.C. Salgo + Partner Patentanwälte AG Rütlistrasse 103
8636 Wald ZH / CH
Former [1998/18]Salgo, Reinhold Caspar, Dr.
Patentanwalt Toebelistrasse 88
8635 Dürnten / CH
Application number, filing date97902142.518.02.1997
[1998/18]
WO1997CH00059
Priority number, dateCH1996000120810.05.1996         Original published format: CH 120896
[1998/18]
Filing languageDE
Procedural languageDE
PublicationType: A1 Application with search report
No.:WO9743883
Date:20.11.1997
Language:DE
[1997/50]
Type: A1 Application with search report 
No.:EP0838133
Date:29.04.1998
Language:DE
The application published by WIPO in one of the EPO official languages on 20.11.1997 takes the place of the publication of the European patent application.
[1998/18]
Type: B1 Patent specification 
No.:EP0838133
Date:28.10.1998
Language:DE
[1998/44]
Search report(s)International search report - published on:EP20.11.1997
ClassificationIPC:H05K1/18, H01R9/09
[1998/18]
CPC:
H01R12/57 (EP); H05K3/3426 (EP); H01R12/716 (EP);
H05K1/0271 (EP); H05K2201/1003 (EP); H05K2201/10848 (EP);
Y02P70/50 (EP) (-)
Designated contracting statesCH,   DE,   FR,   GB,   LI,   SE [1998/18]
TitleGerman:VORRICHTUNG ZUR MONTAGE ELEKTRISCHER BAUTEILE AUF LEITERPLATTEN[1998/18]
English:DEVICE FOR MOUNTING ELECTRICAL COMPONENTS ON PRINTED-CIRCUIT BOARDS[1998/18]
French:DISPOSITIF POUR MONTER DES COMPOSANTS ELECTRIQUES SUR DES CARTES DE CIRCUITS[1998/18]
Entry into regional phase08.09.1997National basic fee paid 
08.09.1997Designation fee(s) paid 
08.09.1997Examination fee paid 
Examination procedure08.09.1997Examination requested  [1998/18]
27.01.1998Request for accelerated examination filed
23.06.1998Despatch of communication of intention to grant (Approval: Yes)
23.06.1998Decision about request for accelerated examination - accepted: Yes
20.08.1998Fee for grant paid
20.08.1998Fee for publishing/printing paid
26.08.1998Communication of intention to grant the patent
Opposition(s)29.07.1999No opposition filed within time limit [1999/42]
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Lapses during opposition  TooltipSE28.01.1999
[1999/32]
Cited inInternational search[A]US5253145  (LINT JAMES D [US]) [A] 1,5,6 * column W *;
 [A]US4086426  (KNAPPENBERGER THOMAS A) [A] 1 * column A *;
 [A]JPH07302655
 [A]  - "Improved area array surface mount module package", IBM TECHNICAL DISCLOSURE BULLETIN, NEW YORK US, (199002), vol. 32, no. 9B, pages 64 - 65, XP000082233 [A] 1,5,6 * the whole document *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19960329), vol. 96, no. 3, & JP07302655 A 19951114 (IRISO DENSHI KOGYO KK) [A] 1 * abstract *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.