EP0892445 - Semiconductor device comprising an aggregate of semiconductor micro-needles [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 11.02.2005 Database last updated on 07.06.2024 | Most recent event Tooltip | 17.10.2008 | Change - applicant | published on 19.11.2008 [2008/47] | Applicant(s) | For all designated states MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 1006, Oaza Kadoma Kadoma-shi Osaka 571-8501 / JP | [2008/47] |
Former [2004/15] | For all designated states MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 1006, Oaza Kadoma Kadoma-shi, Osaka 571-8501 / JP | ||
Former [1999/03] | For all designated states MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 1006, Ohaza Kadoma Kadoma-shi, Osaka 571-8501 / JP | Inventor(s) | 01 /
Eriguchi, Koji 1-1-23 Kyuhouji Yao-shi, Osaka 581 / JP | 02 /
Kubota, Masafumi 1-35-3, Banda, Takatsuki-shi Osaka 569-0044 / JP | 03 /
Niwa, Masaaki 9.30 Kouriencho Hirakata-shi, Osaka 573 / JP | 04 /
Nomura, Noboru 6-294, Sujikaebashi, Fukakusa Fushimi-ku Kyoto-shi, Kyoto 612-0889 / JP | [1999/35] |
Former [1999/08] | 01 /
Eriguchi, Koji 1-1-23 Kyuhouji Yao-shi, Osaka 581 / JP | ||
02 /
Kubota, Masafumi 3-2-7-411 Taishibashi, Asahi-ku Osaka-shi, Osaka 573 / JP | |||
03 /
Niwa, Masaaki 9.30 Kouriencho Hirakata-shi, Osaka 573 / JP | |||
04 /
Nomura, Noboru 35 Fukakusanakanoshimacho, Fushimi-ku Kyoto-shi, Kyoto 612 / JP | |||
Former [1999/03] | 01 /
Eriguchi, Kofi 1-1-23 Kyuhouji Yao-shi, Osaka 581 / JP | ||
02 /
Kubota, Masafumi 3-2-7-411 Taishibashi, Asahi-ku Osaka-shi, Osaka 573 / JP | |||
03 /
Niwa, Masaaki 9.30 Kouriencho Hirakata-shi, Osaka 573 / JP | |||
04 /
Nomura, Noboru 35 Fukakusanakanoshimacho, Fushimi-ku Kyoto-shi, Kyoto 612 / JP | Representative(s) | Grünecker Patent- und Rechtsanwälte PartG mbB Leopoldstraße 4 80802 München / DE | [N/P] |
Former [1999/03] | Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät Maximilianstrasse 58 80538 München / DE | Application number, filing date | 98119144.8 | 02.11.1994 | [1999/03] | Priority number, date | JP19930274191 | 02.11.1993 Original published format: JP 27419193 | JP19930312747 | 17.11.1993 Original published format: JP 31274793 | JP19940162028 | 14.07.1994 Original published format: JP 16202894 | [1999/03] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0892445 | Date: | 20.01.1999 | Language: | EN | [1999/03] | Type: | A3 Search report | No.: | EP0892445 | Date: | 06.05.1999 | [1999/18] | Type: | B1 Patent specification | No.: | EP0892445 | Date: | 07.04.2004 | Language: | EN | [2004/15] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 22.03.1999 | Classification | IPC: | H01L33/00, H01L21/30, H01L27/15 | [1999/03] | CPC: |
B82Y10/00 (EP,US);
G02B6/1245 (EP,US);
G11C23/00 (EP,US);
H01H1/0036 (EP,US);
H01L21/3086 (EP,US);
H01L31/0352 (EP,US);
H01L31/1804 (EP,US);
G02B2006/12102 (EP,US);
G02B2006/12173 (EP,US);
G02B2006/12176 (EP,US);
H01L33/10 (EP,US);
H01L33/18 (EP,US);
Y02E10/547 (US);
Y02P70/50 (EP,US);
Y10S438/947 (EP,US);
| Designated contracting states | DE, FR, GB [1999/03] | Extension states | LT | Not yet paid | SI | Not yet paid | Title | German: | Halbleiterbauelement mit Aggregat von Mikro-Nadeln aus Halbleitermaterial | [1999/03] | English: | Semiconductor device comprising an aggregate of semiconductor micro-needles | [1999/03] | French: | Dispositif semiconducteur comprenant un agrégat de micro-aiguilles semi-conductrices | [1999/03] | Examination procedure | 15.07.1999 | Examination requested [1999/37] | 11.01.2002 | Despatch of a communication from the examining division (Time limit: M06) | 16.07.2002 | Reply to a communication from the examining division | 13.10.2003 | Communication of intention to grant the patent | 09.02.2004 | Fee for grant paid | 09.02.2004 | Fee for publishing/printing paid | Parent application(s) Tooltip | EP94117295.9 / EP0652600 | Opposition(s) | 10.01.2005 | No opposition filed within time limit [2005/13] | Fees paid | Renewal fee | 09.10.1998 | Renewal fee patent year 03 | 09.10.1998 | Renewal fee patent year 04 | 09.10.1998 | Renewal fee patent year 05 | 25.11.1999 | Renewal fee patent year 06 | 29.11.2000 | Renewal fee patent year 07 | 29.11.2001 | Renewal fee patent year 08 | 28.11.2002 | Renewal fee patent year 09 | 28.11.2003 | Renewal fee patent year 10 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]EP0544408 (XEROX CORP [US]) [A] 1,5-12,14,15 * column 5, line 2 - column 6, line 35 * * column 8, line 8 - column 12, line 24 * * column 13, lines 26-29 * * column 14, lines 4-23; figure - *; | [A]JPS59205774 | [A] - H.I.LIU ET AL., "Silicon quantum wires oxidation and transport studies", MICROCRYSTALLINE SEMICONDUCTORS: MATERIALS SCIENCE AND DEVICES SYMPOSIUM PROCEEDINGS, BOSTON, MA, USA, (19921130), vol. 283, pages 57 - 63, XP000496422 [A] 1,5-10,15 * the whole document * | [A] - PATENT ABSTRACTS OF JAPAN, (19850329), vol. 009, no. 069, Database accession no. (E - 305), & JP59205774 A 19841121 (NIPPON DENKI KK) [A] 1-3 * abstract * |