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EP0867475
European procedure
Extract from the Register of European Patents
EP About this file: EP0867475
| EP0867475 - Epoxy resin composition to seal semiconductors and resin-sealed semiconductor device [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 23.10.2009 Database last updated on 26.06.2024 | Most recent event Tooltip | 10.06.2011 | Lapse of the patent in a contracting state New state(s): IT | published on 13.07.2011 [2011/28] | Applicant(s) | For all designated states SUMITOMO BAKELITE CO., LTD. 5-8, Higashishinagawa 2-chome Shinagawa-ku Tokyo 140-0002 / JP | [2008/51] |
| Former [2004/24] | For all designated states Sumitomo Bakelite Co., Ltd. 5-8, Higashishinagawa 2-chome Shinagawa-ku Tokyo 140-0002 / JP | ||
| Former [1998/40] | For all designated states TORAY INDUSTRIES, INC. 2-1, Nihonbashi-Muromachi 2-chome, Chuo-ku Tokyo 103-8666 / JP | Inventor(s) | 01 /
Tanaka, Masayuki 258, Horagai 1-chome, Midori-ku Nagoya-shi, Aichi, 458 / JP | 02 /
Tsurumi, Yumiko 706, Bell-wood Nogawa, 4162, Nogawa, Miyamae-ku Kawasaki-shi, Kanagawa, 216 / JP | [1998/40] | Representative(s) | Coleiro, Raymond, et al Mewburn Ellis LLP 33 Gutter Lane London EC2V 8AS / GB | [N/P] |
| Former [1998/40] | Coleiro, Raymond, et al MEWBURN ELLIS York House 23 Kingsway London WC2B 6HP / GB | Application number, filing date | 98300448.2 | 23.01.1998 | [1998/40] | Priority number, date | JP19970010721 | 23.01.1997 Original published format: JP 1072197 | [1998/40] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0867475 | Date: | 30.09.1998 | Language: | EN | [1998/40] | Type: | A3 Search report | No.: | EP0867475 | Date: | 18.11.1998 | [1998/47] | Type: | B1 Patent specification | No.: | EP0867475 | Date: | 17.12.2008 | Language: | EN | [2008/51] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 02.10.1998 | Classification | IPC: | C08L63/00, C08K3/00, H01L23/29 | [1998/40] | CPC: |
H01L23/293 (EP,US);
C08G59/62 (KR);
C08G59/40 (KR);
C08G59/621 (EP,US);
C08L63/00 (EP,KR,US);
H01L2224/32225 (EP,US);
H01L2224/45124 (EP,US);
H01L2224/48091 (EP,US);
H01L2224/48227 (EP,US);
| C-Set: |
C08L63/00, C08L2666/22 (US,EP);
C08L63/00, C08L61/04 (EP,US);
H01L2224/45124, H01L2924/00 (EP,US);
H01L2224/48091, H01L2924/00014 (US,EP);
H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00 (US,EP);
H01L2924/15311, H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00 (EP,US) (-) | Designated contracting states | DE, FR, GB, IE, IT, NL [1999/30] |
| Former [1998/40] | AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE | Title | German: | Epoxidharzzusammensetzung geeignet zur Verkapselung von Halbleiteranordnungen und harzverkapselte Halbleiteranordnungen | [1998/40] | English: | Epoxy resin composition to seal semiconductors and resin-sealed semiconductor device | [1998/40] | French: | Composition de résine époxyde utilisable pour l'encapsulation de sémiconducteurs et sémiconducteurs encapsulés par une résine | [1998/40] | Examination procedure | 01.02.1999 | Examination requested [1999/13] | 11.08.2004 | Despatch of a communication from the examining division (Time limit: M06) | 10.02.2005 | Reply to a communication from the examining division | 25.11.2005 | Despatch of a communication from the examining division (Time limit: M04) | 30.03.2006 | Reply to a communication from the examining division | 25.06.2008 | Communication of intention to grant the patent | 28.10.2008 | Fee for grant paid | 28.10.2008 | Fee for publishing/printing paid | Opposition(s) | 18.09.2009 | No opposition filed within time limit [2009/48] | Fees paid | Renewal fee | 24.01.2000 | Renewal fee patent year 03 | 23.01.2001 | Renewal fee patent year 04 | 22.01.2002 | Renewal fee patent year 05 | 22.01.2003 | Renewal fee patent year 06 | 22.01.2004 | Renewal fee patent year 07 | 24.01.2005 | Renewal fee patent year 08 | 24.01.2006 | Renewal fee patent year 09 | 23.01.2007 | Renewal fee patent year 10 | 22.01.2008 | Renewal fee patent year 11 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | IT | 17.12.2008 | NL | 17.12.2008 | IE | 23.01.2009 | FR | 17.02.2009 | GB | 17.03.2009 | [2011/28] |
| Former [2010/28] | NL | 17.12.2008 | |
| IE | 23.01.2009 | ||
| FR | 17.02.2009 | ||
| GB | 17.03.2009 | ||
| Former [2010/07] | NL | 17.12.2008 | |
| IE | 23.01.2009 | ||
| Former [2009/30] | NL | 17.12.2008 | Documents cited: | Search | [X]EP0749996 (TORAY INDUSTRIES [JP]) [X] 1-20 * page 5, line 18 - line 21; example -; claim - *; | [X]DE4408176 (SEL ALCATEL AG [DE]) [X] 1-20 * column 2, line 27 - line 28; claim - *; | [X]EP0511833 (ROHM & HAAS [US]) [X] 1-20 * example -; claim - *; | [X]EP0751561 (HITACHI CHEMICAL CO LTD [JP]) [X] 1,21,22 * figure -; example -; claim - *; | [X]EP0676806 (SGS THOMSON MICROELECTRONICS [US]) [X] 1,21,22 * figure -; claim - * | [X] - REHME F ET AL, "CHIPGEHAUSE IM WERKSTOFFTEST", F & M. FEINWERKTECHNIK MIKROTECHNIK MESSTECHNIK, (19950801), vol. 103, no. 7/08, pages 425 - 428, XP000524175 [X] 1-20 * page 425; figure . * | [X] - ROBINSON D ET AL, "GLOB TOP ENCAPSULATION OF LARGE DIE ON MCM-L", INTERNATIONAL JOURNAL OF MICROCIRCUITS AND ELECTRONIC PACKAGING, (19920101), vol. 15, no. 4, pages 213 - 228, XP000303596 [X] 1-20 * The whole document * |