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EP0898308
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EP About this file: EP0898308
| EP0898308 - A method for forming a metal interconnection in a semiconductor device [Right-click to bookmark this link] | Status | The application has been refused Status updated on 27.02.2015 Database last updated on 02.09.2024 | Most recent event Tooltip | 27.02.2015 | Refusal of application | published on 01.04.2015 [2015/14] | Applicant(s) | For all designated states Samsung Electronics Co., Ltd. 129, Samsung-ro Yeongtong-gu Suwon-si, Gyeonggi-do, 443-742 / KR | [2012/39] |
| Former [1999/08] | For all designated states Samsung Electronics Co., Ltd. 416 Maetan 3-Dong, Paldal-gu Suwon-city, Kyungki-do 441-370 / KR | Inventor(s) | 01 /
Yoon, Mee-Yong 506-1703 Mujigae Maeul Cheonggu Apt. 221 Gumi-dong Bundang-gu, Seongnam-city, Kyungki-do / KR | 02 /
Lee, Sang-in 9-101 Dongnam Yeollip, 197, Maetan 2-dong Paldal-gu, Suwon-city, Kyungki-do / KR | [1999/08] | Representative(s) | Zijlstra, Robert Wiebo Johan, et al Elkington and Fife LLP Prospect House 8 Pembroke Road Sevenoaks, Kent TN13 1XR / GB | [N/P] |
| Former [2009/15] | Zijlstra, Robert Wiebo Johan, et al Elkington and Fife LLP Prospect House 8 Pembroke Road Sevenoaks, Kent TN13 1XR / GB | ||
| Former [2000/49] | Kyle, Diana Elkington and Fife Prospect House 8 Pembroke Road Sevenoaks, Kent TN13 1XR / GB | ||
| Former [1999/08] | Finnie, Peter John Elkington and Fife, Prospect House, 8 Pembroke Road Sevenoaks, Kent TN13 1XR / GB | Application number, filing date | 98302581.8 | 02.04.1998 | [1999/08] | Priority number, date | KR19970040236 | 22.08.1997 Original published format: KR 9740236 | [1999/08] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0898308 | Date: | 24.02.1999 | Language: | EN | [1999/08] | Type: | A3 Search report | No.: | EP0898308 | Date: | 21.06.2000 | [2000/25] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 04.05.2000 | Classification | IPC: | H01L21/768 | [1999/08] | CPC: |
H01L21/76856 (EP,US);
H01L21/28 (KR);
H01L21/76843 (EP,US);
H01L21/76876 (EP,US);
H01L21/76879 (EP,US);
H01L21/76829 (EP,US)
| Designated contracting states | DE, FR, GB, NL [2001/09] |
| Former [1999/08] | AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE | Title | German: | Herstellungsverfahren für eine metallische Verbindung in einer Halbleitervorrichtung | [1999/08] | English: | A method for forming a metal interconnection in a semiconductor device | [1999/08] | French: | Procédé de fabrication d'une interconnexion métallique dans un dispositif à semiconducteurs | [1999/08] | Examination procedure | 19.12.2000 | Examination requested [2001/08] | 15.12.2006 | Despatch of a communication from the examining division (Time limit: M04) | 23.04.2007 | Reply to a communication from the examining division | 19.06.2008 | Despatch of a communication from the examining division (Time limit: M04) | 24.10.2008 | Reply to a communication from the examining division | 15.10.2009 | Date of oral proceedings | 28.12.2009 | Minutes of oral proceedings despatched | 10.03.2010 | Despatch of communication that the application is refused, reason: substantive examination [2015/14] | 15.01.2015 | Application refused, date of legal effect [2015/14] | Appeal following examination | 17.05.2010 | Appeal received No. T1680/10 | 20.07.2010 | Statement of grounds filed | 15.01.2015 | Result of appeal procedure: appeal of the applicant was rejected | 15.01.2015 | Date of oral proceedings | 20.01.2015 | Minutes of oral proceedings despatched | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 15.12.2006 | Fees paid | Renewal fee | 13.04.2000 | Renewal fee patent year 03 | 12.04.2001 | Renewal fee patent year 04 | 12.04.2002 | Renewal fee patent year 05 | 14.04.2003 | Renewal fee patent year 06 | 15.04.2004 | Renewal fee patent year 07 | 27.04.2005 | Renewal fee patent year 08 | 23.03.2006 | Renewal fee patent year 09 | 12.04.2007 | Renewal fee patent year 10 | 28.03.2008 | Renewal fee patent year 11 | 16.04.2009 | Renewal fee patent year 12 | 25.03.2010 | Renewal fee patent year 13 | 12.04.2011 | Renewal fee patent year 14 | 26.03.2012 | Renewal fee patent year 15 | 24.04.2013 | Renewal fee patent year 16 | 14.03.2014 | Renewal fee patent year 17 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]US5151168 (GILTON TERRY L [US], et al) [X] 1,3,7,10,11,39,47 * column 4, line 46 - column 5, line 68; figures 1-6 *; | [X]US5055423 (SMITH GREGORY C [US], et al) [X] 1,3,10,39,47 * column 5, line 15 - column 6, line 6; figures 2A-C *; | [X]US4687552 (EARLY STEPHEN R [US], et al) [X] 1,3 * column 3, line 31 - line 63; figures 1,2 *; | [PXA]EP0831523 (APPLIED MATERIALS INC [US]) [PX] 1,4,7,10-15,17,21-24,26,29,39,40,42-45,47 * column 5, line 34 - column 8, line 56; figures 2-4 * [PA] 5,6; | [PX]DE19713501 (LG SEMICON CO LTD [KR]) [PX] 1,3,7,10,39-42 * column 3, line 61 - column 5, line 41; figures 2B-D,3A-D *; | [A]US5572072 (LEE SANG-IN [KR]) [A] 2,5-9,33-35,40,42,44-47,49-51,60,61 * column 10, line 20 - column 13, line 19; figures 8,9 * |